An electronic device according to various embodiments of the disclosure may include: a housing which includes a first plate facing a first direction, a second plate facing a second direction opposite to the first direction, and a lateral member covering at least part of the space between the first and second plates; a display disposed to be visible in at least part of the first plate; a first circuit board which includes a first face facing the first direction and a second face facing the second direction, and which is disposed in the second direction of the display; a second circuit board which is disposed not to overlap at least in part with the first printed circuit board, and which is electrically coupled with the first circuit board; a socket mounted to the second circuit board; at least one or more metal structures disposed on the first circuit board to transfer, to another component, heat of at least one or more exothermic elements mounted on the first circuit board; and a ground path constructed in at least part of the second circuit board so as to be electrically coupled to the first circuit board or the metal member or the first circuit board and the metal structure.

Provided is a ground member that can prevent damage to interlayer adhesion between a conductive layer and an adhesive layer of the ground member due to heating in producing a shielded printed wiring board or in mounting an electronic component on a shielded printed wiring board. The ground member of the present invention includes: a conductive layer; and an adhesive layer stacked on the conductive layer, the adhesive layer containing a binder component and hard particles, the adhesive layer having a thickness of 5 to 30 μm.

Provided is a ground member that can prevent damage to interlayer adhesion between a conductive layer and an adhesive layer of the ground member due to heating in producing a shielded printed wiring board or in mounting an electronic component on a shielded printed wiring board. The ground member of the present invention includes: a conductive layer; and an adhesive layer stacked on the conductive layer, the adhesive layer containing a binder component and hard particles, the adhesive layer having a thickness of 5 to 30 μm.

A robot system comprising: a robot having an attaching/detaching mechanism; a controller; and a hand stand on which hands are put and includes a ground circuit for electrically grounding the hands, wherein a first electrode to which detection voltage is applied is fixed to the robot, each of the hands has a reference position used when the hand is attached to the attaching/detaching mechanism, and is provided with a second electrode so that distance from the reference position to the second electrode differs for each hand, a detecting unit for detecting current in the ground circuit is provided, the controller includes: a storage that stores the types of the hands and those corresponding positions of the second electrodes, and a hand identifying unit that identifies whether the hand is a selected hand based on the current when the first electrode is moved to a position of the second electrode.

A connecting element for galvanically connecting two electrically conductive surfaces, comprises: a body plate having a body plate upper surface defining a body plate top level; and a spring tab extending from the body plate and having a spring tab upper surface comprising an upper contact section above the body plate top level. The connecting element has a connecting element bottom level, and the spring tab has a spring tab lower surface comprising a lower contact section, the spring tab having a rest position in which, with no external force applied onto the upper contact section, the lower contact section lies above the connecting element bottom level, and is bendable, by applying external force onto the upper contact section, to a compressed position in which the lower contact section lies in or below the connecting element bottom level.

A non-eddy current electro-magnetic interference (EMI) shield to prevent or inhibit generation of eddy currents in the shield. The shield may include a non-conductive enclosure, one or more conductive traces interlaced on the non-conductive enclosure, wherein the one or more conductive traces do not form any conductive loops, and one or more ground connections on the one or more conductive traces, wherein the one or more ground connections do not form a ground loop. The EMI shielded electronic device may at least partially encompass an electronic device, such as a magnetic tracker, wherein the EMI shield comprises a non-conductive housing, with conductive traces interlaced on the housing, in a pattern or arrangement such that the conductive traces do not form any conductive loops. One or more ground connections may be provided for the one or more conductive traces.

Approaches are described for managing effects such as interference, crosstalk, and other types of noise in an electronic environment using a physical and/or electronic switch to improve electrode performance of a measurement system. Such approaches enable a component, such as a sensing electrode or other proximity sensing component of a measurement system of a computing device (e.g., a mobile phone, tablet computer, etc.) or other electronic device to be collocated, or otherwise placed in proximity, with one or more potential noise producing components, such as a ground plane, which can interfere or otherwise degrade the performance (i.e., electrode efficiency and/or electrode sensitivity) of the sensing electrode of the measurement system.

The present disclosure provides a hair dryer, the hair dryer including a housing, a switch unit, a controller, a fan unit, and a heating unit, wherein the heating unit is configured such that a non-magnetic field is formed by a first heating coil and a second heating coil being twisted in a shape of a twisted bread stick, where the first heating coil is flowed by a current of first direction and the second heating coil is flowed by a current of second direction opposite to the first direction, at least one of the first coil and the second coil is coated with an insulating shield member, and the first coil and the second coil is wound on a support member in a spiral shape.

A patterned ground shield includes a plurality of portions, a first connection member, a second connection member, and a third connection member. Each of the first connection member and the second connection member is coupled to any of two of the portions which are not adjacent to each other. The third connection member is coupled to two of the portions which are adjacent to each other.

A shielding structure is disclosed. The shielding structure includes a patterned shielding layer and a ring structure. The patterned shielding layer is extended along a plane and located between an inductor structure and a substrate. The ring structure is coupled to and stacked on the patterned shielding layer along a first direction. The first direction is perpendicular to the plane. The ring structure surrounds the patterned shielding layer. The ring structure includes at least one opening and a ground terminal.