A sleeping compartment with a sleeping region and an electrically conducting curtain, which can be arranged around the sleeping region, having a rail system by which the conducting curtain is mounted in a displaceable manner. The rail system includes at least one rail and a multiplicity of connecting elements, the connecting elements being connected to the conducting curtain and being mounted in the at least one rail in a displaceable manner. The rail system is configured such that the conducting curtain is connected to the at least one rail in an electrically conducting manner, preferably such that the conducting curtain is earthed by way of the rail.

A method of operating a public utility facility includes receiving a commodity at a processing facility communicably coupled to a control system that includes primary electrical components configured to operate the processing facility, and transitioning operation of the processing facility to an electromagnetic pulse mitigation module communicably coupled to the processing facility via a fiber optic line when the primary electrical components are rendered inoperable. The electromagnetic pulse mitigation module comprises a continuous conductive enclosure that is impervious to radiated and coupled electromagnetic energy. Operation of the primary electrical components is then assumed with one or more backup electrical components housed within the electromagnetic pulse mitigation module.

A hermetically sealed feedthrough assembly for an active implantable medical device having an oxide-resistant electrical attachment for connection to an ENI filter, an EMI filter circuit board, an AIMD circuit board, or AIMD electronics. The oxide-resistant electrical attachment, including an oxide-resistant coating layer that is disposed on the device side surface of the hermetic seal ferrule over which an optional ECA stripe may be provided. The optional ECA stripe may comprise one of a thermal-setting electrically conductive adhesive, an electrically conductive polymer, an electrically conductive epoxy, an electrically conductive silicone, an electrically conductive polyamide, or an electrically conductive polyimide, such as those manufactured by Ablestick Corporation. The oxide-free coating layer may comprise one of gold, platinum, palladium, silver, iridium, rhenium, rhodium, tantalum, tungsten, niobium, zirconium, vanadium, and combinations or alloys thereof. As used herein, the oxide-free coating layer is not limiting and as will be taught, in addition to sputtering, there are many other methods of applying a proud oxide-free surface on either an AIMD ferrule or am AIMD housing.

A connection structure includes a circuit board, an insulating member, a housing, and a conductive wire. The insulating member includes a first portion and a second portion. The first portion is fixed to the circuit board. The second portion faces the first portion. The second portion is fixed to the housing. The housing includes a grounded contact. The conductive wire electrically connects the circuit board and the housing while being wound around the insulating member. A shortest distance along a surface of the housing from a position where the conductive wire and the housing are connected to the contact is shorter than a shortest distance along a surface of the housing from the second portion of the insulating member to the contact.

A component grounding system according to one embodiment includes a case for accommodating a plurality of components, a direct current (DC) capacitor disposed on one side of the case and electrically connected to the case, and a bus bar, disposed between the case and the DC capacitor, for connecting the case and the DC capacitor, the bus bar representing an electrode, wherein each of the plurality of components may be connected to the bus bar.

Systems, methods, and computer-readable media are disclosed for capacitive touch sensing using system-in-package components. In one embodiment, a device may include a flexible printed circuit, and a first system-in-package disposed on a first side of the flexible printed circuit. The first system-in-package may include a first molding compound, and a first electromagnetic interference shield disposed around an outer surface of the first molding compound. The device may include a first capacitive touch sensor, and a first stiffener disposed on a second side of the flexible printed circuit, where the first stiffener can be formed of a conductive material, and can be electrically coupled to both the flexible printed circuit and the first capacitive touch sensor. The first capacitive touch sensor may be configured to detect a change in capacitance via a change in electric field at the first electromagnetic interference shield.

The present disclosure provides a display substrate, including: a display area and a bonding area positioned on a side of the display area, the bonding area includes a plurality of bonding sub-areas arranged at intervals, the bonding sub-areas are arranged along a direction in which an edge of the display area extends and configured for bonding a chip-on-film, where a first antistatic layer is further arranged on the bonding area, at least a part of the first antistatic layer is positioned between adjacent ones of the bonding sub-areas, and the first antistatic layer is electrically coupled to a reference signal terminal. The present disclosure further provides a display device.

Disclosed in some embodiments is a chamber component (such as an end effector body) coated with an ultrathin electrically-dissipative material to provide a dissipative path from the coating to the ground. The coating may be deposited via a chemical precursor deposition to provide a uniform, conformal, and porosity free coating in a cost effective manner. In an embodiment wherein the chamber component comprises an end effector body, the end effector body may further comprise replaceable contact pads for supporting a substrate and the contact surface of the contact pads head may also be coated with an electrically-dissipative material.

A shield member (10) disclosed herein includes a flexible conductor (12) that is electrically conductive and covers the outer surface of at least one covered wire (W); at least one ground conductor (20) that electrically connects the flexible conductor (12) to a body ground (G); an auxiliary shield conductor (30) that covers the outer surface of the ground conductor (20); and an auxiliary ground conductor (35) that electrically connects the auxiliary shield conductor (30) to the body ground (G).

A substrate includes a primary circuit; a secondary circuit; and a ground (GND) patterns. In a path between the primary circuit and the secondary circuit without passing through the GND pattern, reinforced insulation is provided between the primary circuit and the secondary circuit. In a path between the primary circuit and the secondary circuit through the GND pattern, one of 1) a combination of reinforced insulation and functional insulation and 2) a combination of basic insulation, additional insulation, and functional insulation is provided between the primary circuit and the secondary circuit.