A network communication device includes communication circuitry configured to communicate signals over a network cable, and a connector configured to connect to the network cable. The connector includes one or more signal terminals, an inner shield connection and an outer shield connection. The one or more signal terminals are configured to connect to one or more signal conductors of the network cable for communicating the signals. The inner shield connection surrounds the one or more signal terminals and is connected to a circuit ground of the communication circuitry. The outer shield connection surrounds the inner shield connection and is connected to an additional ground of the network communication device, the additional ground being different from the circuit ground.

A printed circuit board (PCB) includes a substrate defining a major plane. A first side of the major plane is configured for mounting of functional circuit elements. A cable connector is mounted on a second side of the major plane of the substrate, opposite the first side, for coupling to a shielded radiofrequency (RF) communications cable. At least one component grounding layer is parallel to the major plane and configured for coupling to the functional elements. At least one cable grounding layer is parallel to the major plane and is separated from the at least one component grounding layer. Each cable grounding layer in the at least one cable grounding layer is coextensive with the substrate and is configured for coupling, through the connector, to shielding of the shielded RF communications cable, without coupling to any other component. Nodes of an RF communications system may be mounted on such PCBs.

A module includes a wiring substrate; a component; a metal pin attached to a land electrode formed at one main surface and has a first extending portion extends from the one main surface, a second extending portion that is bent and extends from one end of the first extending portion on an opposite side from the one end surface, and a third extending portion that is bent and extends from one end of the second extending portion on an opposite side from the first extending portion to approach the one main surface; a sealing resin layer that covers the one main surface, the component, and the metal pin; and a shield layer that covers a side surface of the wiring substrate, a surface of the sealing resin layer, and the upper surface and the side outer surface of the metal pin.

An electronic device includes a camera module and an external structure. The camera module includes an image sensor and a shielding structure that shields components of the camera module from electromagnetic interference (EMI). The external structure two-dimensionally surrounds the camera module, and a portion of the external structure is conductive. The shielding structure includes an accommodating portion that accommodates the image sensor, and a protruding portion that protrudes from the accommodating portion to contact the external structure.

Disclosed in some embodiments is a chamber component (such as an end effector body) coated with an ultrathin electrically-dissipative material to provide a dissipative path from the coating to the ground. The coating may be deposited via a chemical precursor deposition to provide a uniform, conformal, and porosity free coating in a cost effective manner. In an embodiment wherein the chamber component comprises an end effector body, the end effector body may further comprise replaceable contact pads for supporting a substrate and the contact surface of the contact pads head may also be coated with an electrically-dissipative material.

Disclosed in some embodiments is a chamber component (such as an end effector body) coated with an ultrathin electrically-dissipative material to provide a dissipative path from the coating to the ground. The coating may be deposited via a chemical precursor deposition to provide a uniform, conformal, and porosity free coating in a cost effective manner. In an embodiment wherein the chamber component comprises an end effector body, the end effector body may further comprise replaceable contact pads for supporting a substrate and the contact surface of the contact pads head may also be coated with an electrically-dissipative material.

A substrate includes a primary circuit; a secondary circuit; and a ground (GND) patterns. In a path between the primary circuit and the secondary circuit without passing through the GND pattern, reinforced insulation is provided between the primary circuit and the secondary circuit. In a path between the primary circuit and the secondary circuit through the GND pattern, one of 1) a combination of reinforced insulation and functional insulation and 2) a combination of basic insulation, additional insulation, and functional insulation is provided between the primary circuit and the secondary circuit.

Methods and systems of suppressing ground faults. One system includes a power center including a transformer and a ground fault relay. The system also includes a first motor electrically connected to the power center. The system also includes a first variable speed drive connected to the first motor. The first variable speed drive is configured to vary the speed of the first motor. The system also includes a first common mode choke connected in a series-type connection between the power center and the first variable speed drive. The first common mode choke is configured to suppress a ground current induced by the first variable speed drive.

A sleeping compartment with a sleeping region and an electrically conducting curtain, which can be arranged around the sleeping region, having a rail system by which the conducting curtain is mounted in a displaceable manner. The rail system includes at least one rail and a multiplicity of connecting elements, the connecting elements being connected to the conducting curtain and being mounted in the at least one rail in a displaceable manner. The rail system is configured such that the conducting curtain is connected to the at least one rail in an electrically conducting manner, preferably such that the conducting curtain is earthed by way of the rail.

According to various embodiments of the present invention, an electronic device comprises: a connector comprising a conductive shell and at least one terminal arranged inside the conductive shell; a capacitor; and a circuit board comprising a first board layer at least partially facing the connector, a second board layer formed beneath the first board layer, and at least one third board layer formed between the first board layer and the second board layer. The circuit substrate comprises: a ground area made of a conductor formed at least one of the first board layer, the second board layer, or the at least one third board layer and electrically connected to the conductive shell through the capacitor while being connected to a ground portion of the electronic device; a first conductive area which is a partial area of the first board layer facing the connector, the first conductive area being made of a conductor having a first size and electrically connected to the conductive shell; and a second conductive area which is an area of the second board layer at least partially facing the first conductive area with the at least one third substrate layer interposed therebetween, the second conductive area being made of a conductor having a second size wider than the first size and electrically connected to the first conductive area. At least one of the first conductive area and the second conductive area may be arranged adjacent to the ground area such that the first conductive area and the second conductive area are electrically separated from the ground area.