An electronic device and rigid-flexible substrate module includes a rigid-flexible substrate having a first region and a second region more flexible than the first region and having a first laterally extended region extending in a first lateral direction further than the first region, an integrated circuit (IC) disposed in a position lower than a position of the first region of the rigid-flexible substrate, a signal line electrically connected to the IC and extending to a lateral end of the second region of the rigid-flexible substrate, and a first heat dissipation ground layer including a first portion that overlaps the first region when viewed in a vertical direction, and a second portion different from the portion that overlaps the first laterally extended region when viewed in a vertical direction.

The present invention is directed to a system for generating a healthy energy vortex within a space through an earthing effect. The system may comprise a plurality of copper-clad earthing poles encompassing a perimeter of an area. Each earthing pole of the plurality of earthing poles may be completely submerged underground, may contact a plurality of healthy negative ions underground, and may not contact a separate structure. Each adjacent pair of earthing poles may be separated by a distance suitable for generating the healthy energy vortex through the earthing effect. Each earthing pole may further comprise a cap of grounding enhancement material and a wire connecting the earthing pole to adjacent earthing poles. The system may further comprise a plurality of magnet pairs disposed underground outside of the perimeter of the area encompassed by the plurality of earthing poles.

An electrical connection box includes: a box main body; an electric circuit body loaded into the box main body; a grounding member provided in the electric circuit body; a belt-like grounding metal plate extending from the grounding member to the outside of the box main body; a fixing bracket extending integrally with the box main body and including the grounding metal plate; and a bolt through hole formed through a tip end portion of the fixing bracket to electrically connect the grounding metal plate to a bolt to be inserted.

A substrate includes a primary circuit; a secondary circuit; and a ground (GND) patterns. In a path between the primary circuit and the secondary circuit without passing through the GND pattern, reinforced insulation is provided between the primary circuit and the secondary circuit. In a path between the primary circuit and the secondary circuit through the GND pattern, one of 1) a combination of reinforced insulation and functional insulation and 2) a combination of basic insulation, additional insulation, and functional insulation is provided between the primary circuit and the secondary circuit.

Provided are an electrical device and a component for an electrical device that can efficiently suppress the occurrence of a short circuit between a housing and a circuit board. The electrical device includes a housing and a circuit board housed inside the housing. The housing includes a metallic main housing to be attached to an installation section and a sub-housing attached to the main housing. The main housing includes a main wall, extending along the circuit board with a gap between the main wall and the circuit board, and a board attachment portion having the circuit board attached thereto. An insulating plate having insulating properties is fixed to an inner surface of the main wall.

A method of operating a public utility facility includes receiving a commodity at a processing facility communicably coupled to a control system that includes primary electrical components configured to operate the processing facility, and transitioning operation of the processing facility to an electromagnetic pulse mitigation module communicably coupled to the processing facility via a fiber optic line when the primary electrical components are rendered inoperable. The electromagnetic pulse mitigation module comprises a continuous conductive enclosure that is impervious to radiated and coupled electromagnetic energy. Operation of the primary electrical components is then assumed with one or more backup electrical components housed within the electromagnetic pulse mitigation module.

A radio frequency filter includes a first conductive pattern; a second conductive pattern connected to a first point of the first conductive pattern and extended; a third conductive pattern connected to a second point of the first conductive pattern and extended to surround a portion of the second conductive pattern; a fourth conductive pattern; a fifth conductive pattern connected to a third point of the fourth conductive pattern and extended; and a sixth conductive pattern connected to a fourth point of the fourth conductive pattern and extended to surround a portion of the fifth conductive pattern. The first conductive pattern extends toward the fourth conductive pattern and the fourth conductive pattern extends toward the first conductive pattern. A distance between the first conductive pattern and the fourth conductive pattern is greater than or equal to a distance between the third conductive pattern and the sixth conductive pattern.

An electronic component package (100) includes a resin layer (40), an electronic component (10), a grounding member (30), and a conductor film (50). The grounding member (30) includes a multilayer body (31) and an outer conductor (32) disposed at an end portion of the multilayer body (31) in a lamination direction. The multilayer body (31) includes at least one resin film (31a) and at least one pattern conductor (31b) laminated one on another, and at least one via conductor (31c) extending in the lamination direction and connected to the outer conductor (32). In the multilayer body (31), at least one of the pattern conductor (31b) has at least part of a circumference connected to a conductor film (50) and electrically connected to the via conductor (31c). Part of an external terminal and part of the outer conductor (32) are exposed from an identical surface of the resin layer (40).

The present disclosure provides a display substrate, including: a display area and a bonding area positioned on a side of the display area, the bonding area includes a plurality of bonding sub-areas arranged at intervals, the bonding sub-areas are arranged along a direction in which an edge of the display area extends and configured for bonding a chip-on-film, where a first antistatic layer is further arranged on the bonding area, at least a part of the first antistatic layer is positioned between adjacent ones of the bonding sub-areas, and the first antistatic layer is electrically coupled to a reference signal terminal. The present disclosure further provides a display device.

A field device having a monitoring device for grounding and/or shield connections, wherein the monitoring device is connected to a power supply of the field device, an activation arrangement for activating a monitoring current and at least one current detection device downstream of the activation arrangement, wherein the at least one current detection device is connected to at least one component of the field device to be grounded and/or to be shielded.