A substrate transfer apparatus includes: a non-conductive support with an upper surface that faces a substrate and supports the substrate; a mover that moves the support to transfer the substrate; a connector that connects the support and the mover while being grounded; a conductive contact that is provided on the upper surface of the support, and supports the substrate in contact with a lower surface of the substrate such that the substrate is not brought into contact with the support; a strip-shaped conductive path that is provided to connect the contact and the connector. The strip-shaped conductive path is provided with a bent portion such that an interval of the strip-shaped conductive path formed by the bent portion is at least twice a width of the strip-shaped conductive path.

A protection device for a pulse inverter is provided and is configured to be detachably arranged on an opening of an open housing part of the pulse inverter, wherein the protection device is configured to protect from dirt, mechanical impact and/or electrostatic charging, at least one inner element of the pulse inverter, in particular an electrical system and/or an electronic system, which is arranged in the open housing part. Furthermore, a pulse inverter is provided comprising a housing, as well as an e-machine with a pulse inverter.

A functional contactor is provided. A functional contactor according to an exemplary embodiment of the present invention comprises; a clip-shaped conductor having elasticity which is in electrical contact with a conductor of an electronic device; a functional element which is electrically connected to the clip-shaped conductor in series via a solder and comprises a first electrode and a second electrode respectively provided on the entire upper and lower surfaces thereof; and an arrangement guide which is formed to surround at least a part of the clip-shaped conductor on the upper surface of the functional element so as to arrange the position of the clip-shaped conductor and is made of nonconductive resin.

A functional contactor is provided. Provided according to an exemplary embodiment of the present invention is a functional contactor comprising: a conductor which has elasticity and comes into contact with a conductor of an electronic device; a functional element which is connected to the conductor having elasticity and has a first and a second electrode respectively disposed on at least a part of an upper and a lower surface thereof; and a solder through which a lower surface of the conductor having elasticity is coupled with the first electrode of the functional element. The first electrode includes a first part outwardly extending from the lower surface of the conductor having elasticity along one side surface of the conductor having elasticity, and the solder includes an exposure part formed between the first part and a partial lateral surface of the one side surface of the conductor having elasticity.

A method forms an air gap metal tip structure for (ESD) protection. The method forms an air chamber, from an upper substrate and a lower substate disposed below the upper substrate, within which a first metal tip and a second metal tip are disposed. The first and second metal tips are disposed along at least one horizontal axis parallel to the upper and lower substrates. The chamber includes a portion between points of the metal tips, such that oxygen trapped in the chamber is converted into ozone responsive to an arc between the metal tips to dissipate the arc, and the ozone is decomposed back into the oxygen responsive to an arc absence between the metal tips to maintain the ESD protection for subsequent arcs. An under fill level is disposed between the lower and upper substrates, and above one or more layers having the first and second metal tips.

A backlight module and a display device are provided in the present invention. The backlight module includes a bottom polyester layer, an adhesive layer, a top coat layer, a silver reflective layer, an anchor coat layer, a polyester layer, and a grounding wire which overlap each other in sequence. A through hole in contact with the silver reflective layer is formed through the polyester layer and the anchor coat layer. The grounding wire is electrically connected to the silver reflective layer via the through hole.

An electronic device is provided according to various embodiments of the present disclosure. The electronic device includes a housing including a rear plate having an opening and a support bracket at least partially disposed along an edge of the rear plate; a camera decoration disposed in the opening to be exposed to the outside, covering a camera assembly and connected to rear plate; a printed circuit board disposed in the housing; a rear structure supporting the camera assembly and the printed circuit board; a fixing member coupled to the rear structure and fixing the camera assembly and/or the printed circuit board to the support bracket; and a conductive member at least partially disposed between the camera decoration and the fixing member to electrically connect the camera decoration and the fixing member to each other.

The present disclosure provides a stacked body for a flexible display device comprising a substrate layer, and an antistatic layer, wherein a surface resistance of an antistatic layer side surface of the stacked body for a flexible display device is 9×10.sup.13Ω/□ or less; and a surface resistance of the antistatic layer side surface of the stacked body for a flexible display device after an eraser test is 9×10.sup.13Ω/□ or less, wherein, in the eraser test, the antistatic layer side surface of the stacked body for a flexible display device is rubbed with a 6 mm diameter eraser, for 2500 strokes, applying a load of 9.8 N.

The present application provides a display device comprising: a display panel including a display region and a non-display region, wherein the non-display region includes first and second fan-out regions and a bending region; an optical functional film layer formed in the display region and the first fan-out region; an adhesive layer formed on the optical functional film layer; and a protective layer located in the bending region and with a gap with the optical functional film layer, and an end of the adhesive layer extends beyond the optical functional film layer and is connected to the protective layer, and the adhesive layer covers the optical functional film layer, the gap, and part of the protective layer.

A texture recognition device and a manufacturing method thereof are provided. The texture recognition device includes a backlight component and a photosensitive component. The photosensitive component is on a light-outputting side of the backlight component and configured to detect light emitted by the backlight component and reflected by a texture of a detection object to recognize an image of the texture of the detection object. The photosensitive component includes a plurality of photosensitive sensors and an antistatic layer on a side, away from the backlight component, of the plurality of photosensitive sensors, and orthographic projections of the plurality of photosensitive sensors on a plane where the antistatic layer is located are within the antistatic layer.