For an electronic circuit module (1), more particularly a circuit module that is used as an inverter for an electrical machine or as a converter, comprising at least one electronics unit (4), more particularly a power electronics unit, wherein the electronics unit (4) comprises at least one carrier substrate (5) and at least one electrical and/or electronic component (32) provided on the carrier substrate (5), at least one first connection point (10) and at least two second connection points (20) are formed on the carrier substrate (5) on a substrate top side (7) of the carrier substrate (5), the first connection point (10) is provided between the two second connection points (20), and wherein the electronic circuit module (1) further comprises at least one electrical or electronic part (8) having at least one first bus bar (12) for electrically contacting the electronic part (8) and at least one second bus bar (22) for electrically contacting the electronic part (8), the invention proposes that an electrically conductive bridge element (40) electrically conductively interconnects the two second connection points (20), the bridge element (40) passing, bridge-like, over the first connection point (10) and being spaced apart from the first connection point by means of a gap and electrically isolated, the first connection point (10) being electrically conductively connected to the first bus bar (12) by first connection elements (11) and the second connection point being electrically conductively connected to the second bus bar (22) by second connection elements (21).

A computer-implemented method of reducing an impact of stray magnetic fields on components of a quantum computing chip is disclosed. The computer implemented method includes applying a first current signal to a first component of a quantum computing chip, whereby the first component generates a stray magnetic field impacting an operation of a second component of the quantum computing chip. The computer implemented method further includes applying a compensation current signal to a shielding circuit of the quantum computing chip, the compensation current signal generated according to a predetermined function of the first signal, to magnetically shield the second component from the stray magnetic field generated by the first component.

A switchable wire includes filaments, each of which includes a heat-activated material layer that may be indirectly heated to change its state between different states having different electrical conductivity. In an example embodiment the indirect heating may be electrically resistance heating by passing electrical current through an electrically-resistive core of the filament. The heat passing through an electrically-insulative coating around the core, and into a heat-activated material layer around the electrically-insulative coating. The heat-activated material may be a chalcogenide material that is shiftable between a crystalline electrically-conducting state and an amorphous electrically-insulating state. The state of the material may be controlled by controlling the heating profile through controlling heating in the core. Many such filaments may be twisted together to form a switchable wire. Such wires may be used in any of a variety of devices where switchable electrical conductivity is desired.

A filter assembly is disclosed that includes a monolithic filter having a surface and a heat sink coupled to the surface of the monolithic filter. The heat sink includes a layer of thermally conductive material that can have a thickness greater than about 0.02 mm. The heat sink may provide electrical shielding for the monolithic filter. In some embodiments, the filter assembly may include an organic dielectric material, such as liquid crystalline polymer or polyphenyl ether. In some embodiments, the filter assembly may include an additional monolithic filter.

A magnetic-field shield is used to shield a magneto-optical trap (MOT) in an ultra-high vacuum (UHV) cell from magnetic fields generated by an ion pump used to maintain the UHV. The magnetic-field shield includes an enclosure of ferro-magnetic material that acts to capture portions of the magnetic field generated by the ion pump. However, as the distance between the ion pump and the MOT is less than 6 centimeters, enough of the magnetic field escapes through the ferro-magnetic material, and this leakage could impair the MOT. A drive magnet attached to the yoke redirects magnetic flux, that would otherwise leak out of the magnetic-field shield, along a path within the ferro-magnetic enclosure and away from the MOT.

Provided for may be an electromagnetic interference mitigation apparatus comprising a power supply; a power cord; a power supply chassis encapsulating at least the power supply, the power supply physically isolated from the power cord; a low value resistor in electrical communication with at least the power cord and the power supply; and a capacitor disposed between the power supply chassis and an equipment chassis, wherein the equipment chassis encapsulates the power supply chassis, wherein the equipment chassis is disposed a distance from the power supply chassis, and wherein the capacitor is formed by the equipment chassis and the power supply chassis.

Various implementations described herein are related to a device having a first coil-shaped spiral structure for an active shield and a second coil-shaped spiral structure that is wound in-between windings of the first coil-shaped spiral structure. The first coil-shaped spiral structure may provide for a coil-based electro-magnetic (EM) shield as a counter-measure circuit for protecting an underlying circuit.

An electronic device protection unit is provided. The electronic device protection unit includes a sensing part, a responding part, and an analysis and control part. The sensing part is configured to detect an incident ray which is electromagnetic wave or radiation with potential to cause destruction (damage), failure, or malfunction of an electronic device. The responding part is configured to be able to perform a plurality of behaviors to protect the electronic device. The analysis and control part is configured to control the behaviors of the responding part in response to a type of the incident ray detected by the sensing part.

An electromagnetic-wave shielding sheet is an electromagnetic-wave shielding sheet used to form an electronic component-mounted substrate, the electronic component-mounted substrate including an electromagnetic-wave shielding layer covering at least a part of a step part and an exposed surface of a substrate, in which the electromagnetic-wave shielding sheet is a laminate including a cushion layer and a conductive layer, the conductive layer is an isotropic conductive layer containing a binder resin and a conductive filler, a thickness of the conductive layer is 8 to 70 μm, and a content of the conductive filler in a region on a side opposite to a cushion layer side in the conductive layer is larger than that in a region on the cushion layer side in the conductive layer.

Electromagnetic shields for sub-modules of electronic modules are disclosed. Electronic modules may include multiple sub-modules arranged on a substrate with an electromagnetic shield arranged to conformally cover the sub-modules as well as portions of the substrate that are uncovered by the sub-modules. Electromagnetic shields are disclosed that are configured to extend between sub-modules to form one or more divider walls. The one or more divider walls may be configured to extend below mounting surfaces of electronic components in the sub-modules to provide improved reduction of electromagnetic interference (EMI) or crosstalk between various sub-modules. Electromagnetic shields are also disclosed that form perimeter sidewalls that extend below mounting surfaces of electronic components of sub-modules to provide improved reduction of EMI from other modules or other external sources.