A shielding structure is disclosed. The shielding structure includes a patterned shielding layer and a ring structure. The patterned shielding layer is extended along a plane and located between an inductor structure and a substrate. The ring structure is coupled to and stacked on the patterned shielding layer along a first direction. The first direction is perpendicular to the plane. The ring structure surrounds the patterned shielding layer. The ring structure includes at least one opening and a ground terminal.

An electromagnetic wave absorber and an electromagnetic wave anechoic room using the absorbers. The electromagnetic wave absorber has improved electromagnetic wave absorption characteristics at high frequencies in spite of having a hollow structure. The electromagnetic wave absorber includes a hollow shell with a bottom that is a rectangle. A part of a surface of the hollow shell and an outer face of a planar extension lie in planes that are not parallel to any side of the rectangle. At least the plane that is not parallel to any side of the rectangle is included in a surface of an electromagnetic wave absorption member.

A window member includes: a glass member; a display member wherein the glass member has a bottom surface which faces and overlays the display member and a pattern layer provided on a first surface of the glass member and having a fine pattern. The pattern layer is silk-screen printed on the first surface of the glass member to directly contact the surface of the glass member. A method of manufacturing a window member, includes: forming a pattern layer such that the pattern layer contacts a surface of the glass member along a periphery of the glass member. The pattern layer is formed at a location which is offset inward from a periphery of the glass member.

The present disclosure provides a circuit board for high frequency transmission and a shielding method. The circuit board for high frequency transmission includes: a first shielding film, a second shielding film and a circuit board body. The circuit board body includes a first surface and a second surface that are arranged opposite to each other. The first shielding film covers the first surface, and the second shielding film covers the second surface. The circuit board body is provided with a wire region. The first shielding film and the second shielding film are in electrical connection at a lateral side of the wire region. Therefore, leaky waves at the lateral side of the circuit board body are effectively avoided, and the circuit board body is thin in structure.

Provided herein are methods for manufacturing a multilayer circuit structure having embedded circuits and the multilayer circuit structure made thereby. A substrate having at least one existing circuit on the surface is provided, then a dielectric layer is formed to cover the existing circuit. A metal layer is subsequently formed on the dielectric layer. The metal layer is made into a metal mask with a pattern by photoimaging, then the pattern is transferred to the dielectric layer underneath by plasma etching to create multiple trenches and pads at the same time. After vias are made at the pads, a conductive metal is deposited into the trenches and vias to form an embedded trace layer with excess conductive metal in the dielectric layer. The excess conductive metal is removed to obtain a new circuit embedded in the dielectric layer and is coplanar with the surface of the dielectric layer.

A protective housing for shielding against electro-magnetic field (EMF) radiation includes a conductive mesh, a frame coupled to the conductive mesh and configured to define a shape of the conductive mesh, and a frame cover coupled to the frame and the conductive mesh, the frame cover including a main body coupled to the frame, a first swivel portion rotatably coupled to a first end of the main body, and a second swivel portion rotatably coupled to a second end of the main body, the first and second swivel portions corresponding to an entry of the protective housing.

A microelectronic package may be fabricated with a microelectronic substrate, a microelectronic die electrically attached to the microelectronic substrate, and an electromagnetic interference shield layer contacting one or both of the microelectronic substrate and the microelectronic die, wherein the electromagnetic interference shield layer has an electrical conductivity between about 10,000 siemens per meter and 100,000 siemens per meter. The specific range of electrical conductivity results in electromagnetic fields either generated by the microelectronic die or generated by components external to the microelectronic package scattering within the electromagnetic interference shield layer and attenuating. Thus, the electromagnetic interference shield layer can prevent electromagnetic field interference without the need to be grounded.

In accordance with 37 C.F.R. § 1.121(b)(2)(i), please replace the abstract of the specification as filed with the following paragraph:

A method of making an electrically conductive and weatherproof enclosure includes mixing and melting an electrically conductive material, a latex rubber material, and a polycarbonate material to produce a weatherproof material mixture, blending carbon black with polyethylene to produce an electrically conductive additive, positioning an injection mold of the enclosure in fluid communication with an exit end of a heating barrel, injecting the weatherproof material mixture into an entry end of the heating barrel, introducing the electrically conductive additive through a lateral port of the heating barrel proximate to the exit end to partially mix with the weatherproof material mixture to produce an injection mixture, and injecting the injection mixture into the injection mold to produce the electrically conductive and weatherproof enclosure.

A wind turbine including a plurality of elements including a tower, a nacelle mounted to the tower and a plurality of blades rotatable mounted to the nacelle is provided. At least one element of the tower, the nacelle and the blades includes a coaxial impedance member coaxially arranged about an axis of the element.

A connector for use with a sensor, such as a pressure sensor, has EMI absorbing capabilities. The connector includes a polymeric body configured for coupling to a sensor body and an EMI absorbing material. The EMI absorbing material may be entrained in the polymeric body, coated on the polymeric body, or otherwise integrated with the polymeric body. The EMI absorbing material may be carbon black or carbon nanotubes.