Provided is a temperature-pressure complex sensor with an anti-radiation property including a first sensing material which is a porous conductive film, and second sensing materials which are dispersedly disposed on a surface of the first sensing material. The second sensing materials may include a conductive structure having a two-dimensional crystal structure, and nanoparticles having a radiation shielding property which are disposed between crystal layers of the conductive structure.

A semiconductor device according to an embodiment includes a substrate, an -ray shielding layer, a first semiconductor chip, and a second semiconductor chip. The -ray shielding layer is provided on the substrate. The first semiconductor chip is provided on the -ray shielding layer. The second semiconductor chip is provided on the first semiconductor chip, whose operation is controlled by the first semiconductor chip.

A protective housing for shielding an individual against electro-magnetic field (EMF) radiation includes a conductive mesh configured to be suspended from an elevated position, a conductive plane at a base of the protective housing and configured to be a grounding plane for the protective housing, the conductive plane and conductive mesh being configured to shield an interior space, defined by the conductive plane and conductive mesh when suspended, against EMF radiation, and a cable coupled to a circumference of the conductive mesh and configured to weigh down the conductive mesh and to electrically couple the conductive mesh to the conductive plane.

A shielded conduction path includes a conduction path main body in which sheathed electrical wires are surrounded by a tubular braided wire. An inner holder through which the sheathed electrical wires pass and is made of a synthetic resin. The shielded conduction path further includes a shield shell to which the braided wire is fixed and configured to house the inner holder. A lock hole is formed in a circumferential surface of the shield shell. A lock arm is formed in the inner holder, and locks the inner holder and the shield shell in an attached state by locking to the lock hole.

A thermoplastic resin composition capable of providing a molded article that is excellent in its capability of shielding millimeter waves. A thermoplastic resin composition for a molded article having a capability of shielding millimeter waves, containing (A) a thermoplastic resin and (B) carbon long fibers having a fiber length of from 3 to 30 mm in an amount of from 0.5 to 5% by mass. A molded article obtained from the composition is excellent in its capability of shielding millimeter waves and can be used as a protective member for a transmitting and receiving antenna of a millimeter wave radar.

An NFC tag shielding system for a multi-layer product of printed and/or non-printed layered material(s) includes a plurality of layers of printed and/or non-printed materials. The system includes a first on-metal NFC tag applied to a first layer of material of the plurality of layers and a second on-metal NFC tag applied to a second layer of material of the plurality of layers. The first and second on-metal NFC tags are aligned along an axis perpendicular to planes of the first and second layers of material. The system also includes an RF shielding layer disposed between the first and second on-metal NFC tags. The RF shielding layer is positioned along the axis and extends parallel to the first and second layers of material a distance covering at least a projected area of the larger of the first or second on-metal NFC tag. The RF shielding layer provides signal shielding between the NFC tags so that a user wishing to read the first NFC tag on the first layer of material will not unintentionally read the aligned second NFC tag on the second layer of material.

A semiconductor device according to an embodiment includes a substrate, an -ray shielding layer, a first semiconductor chip, and a second semiconductor chip. The -ray shielding layer is provided on the substrate. The first semiconductor chip is provided on the -ray shielding layer. The second semiconductor chip is provided on the first semiconductor chip, whose operation is controlled by the first semiconductor chip.

A shielding box configured for regulating a transmission distance of a radio frequency (RF) signal of an electronic device is used as a container of the electronic device. The shielding box includes a box body. The box body includes a wave-absorbing layer, a first metal layer, a conductive fabric layer, a second metal layer, and a third metal layer in that order from inside to outside. An RF signal attenuation system and method are also provided.

A protective housing for shielding an individual against electro-magnetic field (EMF) radiation includes a conductive mesh configured to be suspended from an elevated position, a conductive plane at a base of the protective housing and configured to be a grounding plane for the protective housing, the conductive plane and conductive mesh being configured to shield an interior space, defined by the conductive plane and conductive mesh when suspended, against EMF radiation, and a cable coupled to a circumference of the conductive mesh and configured to weigh down the conductive mesh and to electrically couple the conductive mesh to the conductive plane.

A connector for use with a sensor, such as a pressure sensor, has EMI absorbing capabilities. The connector includes a polymeric body configured for coupling to a sensor body and an EMI absorbing material. The EMI absorbing material may be entrained in the polymeric body, coated on the polymeric body, or otherwise integrated with the polymeric body. The EMI absorbing material may be carbon black or carbon nanotubes.