A shield cap for protecting an electronic component includes a cap member having a side wall portion and a ceiling portion, and a conductive film formed on the cap member such that the conductive film is formed to shield electromagnetic waves. The side wall and ceiling portions are forming accommodation space to accommodate electronic component, the ceiling portion has a first surface facing the space and a second surface on the opposite side, the side wall portion has a third surface facing the ceiling portion, a fourth surface on the opposite side, a fifth surface facing the space, and a sixth surface on the opposite side, and the side wall portion is formed such that the sixth surface has a first inclined portion increasing distance to the space from the third toward fourth surfaces and a second inclined portion increasing distance to the space from the fourth toward third surfaces.

A method for forming an optimized radiation shield design for a component including providing a computer system programmed to generate data files that define a component radiation shield having an optimized design based on pre-stored data defining particular radiation characteristics and user-provided data defining radiation shield design criteria. Radiation shield design criteria are inputted into the computer system which processes the inputted radiation shield design criteria and the pre-stored data defining particular radiation characteristics in order to generate data files defining an optimized design for a component radiation shield. The generated data files defining the optimized design for a component radiation shield are provided to a metallic three-dimensional printing system. The three-dimensional printing system is then activated to form a component radiation shield using a predetermined metal powder and the generated data files that define the optimized component radiation shield design. The formed component radiation shield is then attached to the component or the circuit board.

This disclosure relates to a multi-piece shield comprising a fence, a lid, and an insert. The lid attaches to the fence, which is attached to the circuit board. The lid is a relatively thick, flexible material for supporting the insert. The lid has a recess so that the insert can be recessed into the lid to position the insert closer to the circuit for enhanced heat absorption. The insert is made of a thicker heat absorbing material than the lid, again to facilitate heat absorption. The insert can be press-fit into the recess of the lid. The lid can have a dovetail configuration to retain the insert in the lid.

[Object] To reduce electromagnetic noise with ease in a semiconductor device provided with wiring serving as a source of noise. [Solution] The semiconductor device includes first and second substrates. In this semiconductor device, a plurality of first signal lines are wired in a predetermined direction on the first substrate. In addition, in a semiconductor device on which the plurality of first signal lines are wired in the predetermined direction, a second signal line, which produces a plurality of magnetic fields with mutually different directions in a region between two adjacent signal lines of the plurality of first signal lines, is wired on the second substrate.

An apparatus for transmitting electrical signals is disclosed. The apparatus includes a substrate and a twisted pair of conductors located on the substrate. The twisted pair of conductors has a first layer comprising conductive material, a second layer comprising nonconductive material, and a third player comprising conductive material. The first layer has a plurality of segments separated by a plurality of gaps. The second layer is positioned in said gaps and electrically insulates a portion of the segments positioned within the gaps. The third layer is positioned over the second layer. The third layer is configured to electrically connects an end of one segment to an end of another segment. The twisted pair of conductors formed by the three dimensional structure comprises two electrically isolated conductors twisted about each other.

A panel for an electromagnetic shield includes a light-weight, porous, electrically-conductive core layer of metallic foam having generally parallel opposed surfaces and a face sheet having rigidity properties superior to the rigidity properties of the core layer laminated to a surface of the core layer. Alternatively, a panel for a broadband electromagnetic shield includes a composite fiber-reinforced core having opposed surfaces and a layered electrically-conductive composite cover disposed on a surface of the core. The cover includes a first stratum of porous metal exhibiting pronounced low-frequency electromagnetic shielding properties and a second stratum of electrically-conductive elements exhibiting pronounced high-frequency electromagnetic shielding properties secured in an overlapping electrically-continuous relationship to the first stratum, the first stratum being a metallic lattice, and the electrically-conductive elements being a non-woven veil of electrically-nonconductive metal-coated fibers.

An antenna system is on a first conductor, spaced apart from a second conductor and includes a first dielectric substrate, and a first metal layer and a second metal layer. Many first conductive structures are connected to the first metal layer and the second conductor. Many second conductive structures are connected to the first metal layer and the second metal layer. A second dielectric substrate includes a third horizontal surface, a first vertical surface and a second vertical surface. A frequency adjustment portion is on the third horizontal surface. A first matching portion and a second matching portion are on the second vertical surface. A first coupling distance is between the first matching portion and the first metal layer. A second coupling distance is between the second matching portion and the first metal layer. A signal source is connected to the second matching portion and the second metal layer.

An apparatus for transmitting electrical signals is disclosed. The apparatus includes a substrate and a twisted pair of conductors located on the substrate. The twisted pair of conductors has a first layer comprising conductive material, a second layer comprising nonconductive material, and a third player comprising conductive material. The first layer has a plurality of segments separated by a plurality of gaps. The second layer is positioned in said gaps and electrically insulates a portion of the segments positioned within the gaps. The third layer is positioned over the second layer. The third layer is configured to electrically connects an end of one segment to an end of another segment. The twisted pair of conductors formed by the three dimensional structure comprises two electrically isolated conductors twisted about each other.

A signal shielding device for shielding electronic components of a circuit board in an electronic device includes a shielding frame and a shielding cover. The shielding frame comprising an opening and a side wall forming the opening. The shielding cover covers the opening of the shielding frame and adheres flush to the shielding frame by a conductive adhesive.

A module 1a includes a multilayer wiring board 2, a component 3 that is mounted on a main surface 2a of the multilayer wiring board 2, a sealing-resin layer 4 that is laminated on the main surface 2a of the multilayer wiring board 2, and a resin coating layer 7 that coats a surface of the sealing-resin layer 4. The resin coating layer 7 includes a shield film 5 and outer electrodes 6, and opposite surfaces 6a of the outer electrodes 6 and an opposite surface 5a of the shield film 5 are formed on the same plane. The module 1a can be connected to, for example, an external antenna without using a wiring electrode of a mother substrate, and thus, signal loss can be suppressed.