A substrate working machine including: a conveyance device configured to convey a substrate; a holding device configured to hold the substrate conveyed to a work position by the conveyance device; and a control device configured to control operation of the conveyance device, wherein the control device is configured to control the operation of the conveyance device such that the substrate is conveyed at a conveyance speed calculated based on a preset setting time and a conveyance distance of the substrate from the work position by the conveyance device or a conveyance distance of the substrate to the work position by the conveyance device.

An electronic component assembly including a fixing part fixable to a first face on a first-direction side of an adherend, an electronic component, and a housing. The adherend has a housing hole opening in the first face. The housing includes a fixed portion fixed to the fixing part and a housing body to house the electronic component. The housing body includes a first portion disposed on a second-direction side relative to the fixing part. The second direction is opposite to the first direction. The first portion of the housing body has a dimension in the second direction that is equal to, or smaller than, a dimension in the second direction of the housing hole of the adherend. The first portion of the housing body is configured to be housed in the housing hole of the adherend.

An object printing system printer enables printing of electrical circuits on non-planar areas of objects and the accurate placement of electronic components within the printed circuits. The system includes a direct-to-object printer and an electronic component placement system. The direct-to-object printer is configured to form an electrical circuit on an object secured within the direct-to-object printer. The electronic component placement system is configured to retrieve an electronic component and install the electronic component in the electrical circuit on the object secured within the direct-to-object printer in response to the direct-to-object printer generating a signal for the electronic component placement system that indicates the electronic component is to be installed in the circuit on the object secured within the direct-to-object printer.

A calibration plate is arranged on a support surface of a table. The calibration plate has first and second alignment marks arranged in one direction, and third and fourth alignment marks arranged in another direction that is orthogonal to the one direction. The first and second alignment marks that move in a front-and-rear direction are imaged by a first camera. The one direction of the calibration plate is made parallel to a front-and-rear direction based on the image. The positions of second and third cameras are adjusted based on the third and fourth alignment marks. The second and third cameras, positions of which have been adjusted, are moved to positions below the transfer roller, and a reference line formed at the transfer roller is imaged by the second and third cameras. An orientation of a rotation shaft of the transfer roller is adjusted in a plane parallel to the support surface based on these images.

A method of mounting a module to a land grid array is provided. The method includes installing a tool to a fixture. The tool includes at least one alignment member and at least one cavity partially defined by the at least one alignment member. The at least one cavity of the tool is aligned with one or more corresponding sockets of the land grid array. The method further includes installing a module through the cavity such that the module is substantially aligned with the socket as it is connected to the land grid array.

A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.

A method for manufacturing a display device includes preparing a flexible substrate that includes an alignment mark in a frame area, preparing a spacer that includes a notch or a hole penetrating from a back surface side to a display surface side of the spacer, disposing the spacer on a back surface side of the flexible substrate, and bending the bent area of the flexible substrate to conform to a shape of the spacer and disposing the terminal area of the flexible substrate on the back surface side of the spacer. In the step of disposing the spacer, the alignment mark is read through the notch or the hole from the back surface side of the flexible substrate so as to position the spacer on the flexible substrate.

After a chuck portion chucks a workpiece holding body which aligns and holds a plurality of workpieces on which components are to be placed, the posture of the workpieces held in the workpiece holding body is adjusted due to rotation mechanism by rotating the chuck portion around an axial line which extends in an aligning direction of the plurality of workpieces held in the workpiece holding body. Then, a placing head places the components on each of the plurality of workpieces which are subjected to posture adjustment.

A calculation device for a work machine comprising a holding head including a holding tool configured to hold a lead component comprising a lead and a body and a moving device configured to move the holding head, the calculation device calculating a release position of the lead component held by the holding tool, when the work machine mounts the lead component on a board by inserting the lead of the lead component held by the holding tool into a hole formed on the board by operating the moving device.

A display device includes: a display panel including a plurality of pixels that display an image, and a pixel pad portion; a first flexible film electrically connected to the display panel, the first flexible film including a first base film, an output pad portion, and an input pad portion, wherein the first base film includes a surface and an opposite surface facing each other, wherein the output pad portion is disposed on the surface of the first base film and is coupled to the pixel pad portion, and wherein the input pad portion is disposed on the surface of the first base film; a circuit substrate electrically connected to the display panel through the input pad portion, the circuit substrate including a first driving pad portion; and a first substrate disposed on the opposite surface and overlapping either the input pad portion or the output pad portion.