A panel alignment device for a display device includes a stage supporting a panel and including a transmitting portion that includes a first region having a first thickness and a second region having a second thickness greater than the first thickness, a head disposed over the stage and supporting a driving chip, a vision camera which is disposed under the stage, captures a first alignment mark of the panel through the first region, and captures a second alignment mark of the driving chip through the second region, and a controller which controls at least one of a movement and a rotation of each of the stage and the head based on first image information related to a position of the first alignment mark and second image information related to a position of the second alignment mark.

A changeover operation configuration device for use in a component mounting line including a registration section configured to register information of at least one of line layout information related to an arrangement of the component mounting line, work area layout information related to an arrangement of a work area at which the changeover operation is to be performed, and personnel quantity information of a quantity of operators who are to perform the changeover operation; an aggregation section configured to select the component type for which to perform changeover operation from the multiple component types, aggregate the component types to a restricted quantity of the component supply devices and designate the component supply devices as work targets; and a setting section configured to set an arrangement position of the component supply devices that are the work targets based on the at least one of the registered information.

Various back-drilled via probing techniques are described. In some cases, a screw may be utilized to establish a conductive pathway through a voided portion of a back-drilled via to a plated portion of the back-drilled via to enable back-drilled via probing. In other cases, a combination of solder paste and a wire may be utilized to establish the conductive pathway to enable back-drilled via probing. In other cases, a compliant pin that includes a metallized particle interconnect material may be utilized to establish the conductive pathway to enable back-drilled via probing. In other cases, a combination of an ultraviolet curable film and a light pipe may be utilized to establish a conductive pathway the conductive pathway to enable back-drilled via probing.

An apparatus includes an upper housing, a gasket, and a lower housing. The upper housing generally comprises a plurality of tabs and a plurality of threaded sockets. The lower housing generally comprises a plurality of openings configured to engage the tabs of the upper housing and a plurality of holes configured to align with the plurality of threaded sockets when assembled to the upper housing.

An adjustment jig for performing position alignment of nozzle holders, including: multiple positioning pins including a primary insertion section configured such that multiple nozzle holders of a primary side device are insertable into the primary insertion section and a secondary insertion section configured such that multiple nozzle holders of a secondary side device are insertable into the secondary insertion section; and a board member configured such that the multiple positioning pins protruding to an opposite side to the primary insertion section and the secondary insertion section can be attached at a specified fixing position via a fixing section, a position of which is adjustable.

A mark recognition device is applied to a substrate including a marked region. The mark recognition device includes; an image collecting mechanism and a first light source. The first light source emits a light beam, the light beam includes a first light beam and a second light beam. The first light beam is irradiated to the marked region of the substrate and blocked by a mark of the marked region to generate a marked orthographic projection on the image collecting mechanism. The second light beam is transmitted to the image collecting mechanism to form transmitted light. The image collecting mechanism recognizes the mark according to the marked orthographic projection of the mark and the second light beam. Recognition accuracy of the mark is effectively improved in embodiments of the present application.

Provided is a method for the throughput-optimised production of printed circuit boards on least two assembly lines, wherein: the printed circuit boards are divided into each cluster; each cluster is produced using a set-up system that is carried out by changeover tables that can be attached to the assembly line, each changeover table having at least one feed device for keeping ready stocks of components; and a changeover table set and an empty changeover table set comprises changeover tables with feed devices that are empty.

A device for inserting a flexible printed circuit board into a connector of a display panel includes: a suction unit configured to adhere to the flexible printed circuit board; a position restriction unit configured to restrict a position of the flexible printed circuit board; and a flexible printed circuit board transfer unit coupled to the suction unit and the position restriction unit, and configured to insert the flexible printed circuit board into the connector. A method of inserting a flexible printed circuit board into a connector of a display panel is also disclosed.

An apparatus for manufacturing a printed circuit board having a substrate with an upper and a lower surfaces is disclosed. The apparatus is configured to implement a stacking operation disposing a first insulating material and a second insulating material on the upper and the lower surfaces of the substrate respectively. The apparatus includes a stacking operation table with a first and a second sides, a first measuring table and a first transporting device. The first measuring table is disposed adjacent to the first side of the stacking operation table, and has a first and a second image sensing elements disposed at a pair of diagonal corners. The first transporting device is movably disposed on a location higher than the stacking operation table and the first measuring table to transport the first and the second insulating materials to the first measuring table and then to the stacking operation table sequentially.

An apparatus for positioning micro-devices on a destination substrate includes a first support to hold a destination substrate, a second support to provide or hold a transfer body having a surface to receive an adhesive layer, a light source to generate a light beam, a mirror configured to adjustably position the light beam on the adhesive layer on the transfer body, and a controller. The controller is configured to cause the light source to generate the light beam and adjust the mirror to position the light beam on the adhesive layer so as to selectively expose one or more portions of the adhesive layer to create one or more neutralized portions. The transfer body and the destination substrate are moved away from each other and one or more micro-devices corresponding to the one or more neutralized portions of the adhesive layer remain on the destination substrate.