A protector installation device for an electronic device includes a shell and a protector. The shell is provided with an accommodating space, a first mounting end face, and a second mounting end face. The accommodating space is communicated to the second mounting end face of the shell from the first mounting end face of the shell, so that the accommodating space forms a placement opening in the first mounting end face, and the accommodating space forms a mounting opening in the second mounting end face. The placement opening is used for allowing the electronic device to be put into the accommodating space. The protector is arranged on the second mounting end face; and the protector blocks the mounting opening, so that the protector is fitted to a screen of the electronic device in the accommodating space via the mounting opening.

A constitutive device quality determination server is communicably connected to an inspection device via the internet, the inspection device performing an inspection on a constitutive device configuring a board work machine by operating the constitutive device in accordance with to a type of the inspection, and includes an inspection data acquisition section that designates a predetermined type of the inspection for the inspection device and acquires inspection data obtained by the inspection by the inspection device, a determination section that determines quality of the constitutive device based on the acquired inspection data, and a transmission section that transmits a quality determination result determined by the determination section to a terminal device communicably connected over the internet.

A camera module according to an embodiment of the present technology includes a first component-mounting board, a second component-mounting board, and a spacer component. The first component-mounting board includes an imaging device. The second component-mounting board is electrically connected to the first component-mounting board. The spacer component is arranged between the first component-mounting board and the second component-mounting board. The spacer component includes a component body that is made of a first insulating material. The component body including a first primary-surface portion that includes a plurality of first reference surfaces including at least three first reference surfaces, a second primary-surface portion that includes a plurality of second reference surfaces including at least three second reference surfaces, and a component accommodation portion with or without a bottom, the first primary-surface portion being brought into contact with the first component-mounting board, the second primary-surface portion being brought into contact with the second component-mounting board, the component accommodation portion being provided to at least one of the first primary-surface portion or the second primary-surface portion.

Disclosed herein are a screen protector assembly, a screen protector applying assembly and a screen protector applicator. The screen protector assembly comprises a screen protector layer, a retention layer and a first matching member. The retention layer is bonded to the screen protector layer. The first matching member is fixedly connected to the retention layer, and the first matching member is used to be detachably connected to a protector applying assembly. With the above arrangement, a detachable connection between the retention layer of the screen protector assembly and the protector applying assembly is realized, allowing the retention layer to be detached from the protector applying assembly after a protector is applied to a screen, thereby allowing the protector applying assembly to be reused, and saving costs.

Features described herein generally relate to systems and methods for assembling an electronic device. Particularly, the electronic device can be assembled by holding a portion of the first component arranged in a first plane in a holding position with a stream of air output from a nozzle of an assembly system and aligning the portion of the first component with an opening in a portion of the second component arranged in a second plane parallel to the first plane while the portion of the first component is held in the holding position.

A work system includes a mounting system which mounts a component on a board and an unmanned conveyance system having an unmanned conveyance vehicle. The unmanned conveyance system includes a first notifier which notifies the mounting system of an arrival notification indicating that the unmanned conveyance vehicle arrives at a position where separating the feeder carriage from the base starts, and a first processor which causes the unmanned conveyance vehicle to travel in a direction away from the base upon receiving, from the mounting system, a release notification indicating that a connection of the feeder carriage is released. The mounting system includes a second processor which causes the connection mechanism to release the connection of the feeder carriage upon receiving the arrival notification, and a second notifier which notifies the unmanned conveyance system of the release notification upon being informed of completion of the release operation.

An electronic component supply device, comprising: a tape feeder configured to feed out a taped electronic component and supply an electronic component; and a holding mechanism arranged to handle the tape feeder and configured to hold a container for accommodating the taped electronic component supplied to the tape feeder, in which the holding mechanism is configured to hold the container having a width larger than the width of the tape feeder.

An aspect of the disclosed embodiments is a method for printed circuit board (PCB) component placement comprising: graphically displaying, on a display device, PCB design features of a PCB design; and providing a user interface control for designating one or more of the PCB design features as electrical contacts for a first selected electrical component. Other aspects are disclosed.

This disclosure is related to arranging micro devices in the donor substrate by either patterning or population so that there is no interfering with non-receiving pads and the non-interfering area in the donor substrate is maximized. This enables the transfer of micro devices to a receiver substrate with fewer steps.

A method and device for the alignment of substrates that are to be bonded. The method includes detecting and storing positions of alignment mark pairs located on surfaces of the substrates. and aligning the substrates with respect to each other in accordance with the detected positions.