A holding and drive device including a frame; a rotation structure which is attached to the frame in such a manner that it can rotate around a rotation axis; a rotation drive for rotating the rotation structure around the rotation axis; and a rotation structure interface attached to or formed on the rotation structure, to which a tool device including a plurality of sleeves can be detachably attached, which are configured for the detachable attachment of a respective component holding device protruding from the rotation axis with a radial direction component or of another tool element. A corresponding tool device, a corresponding supplementary tool device, and a component handling device constructed from these components.

One or plurality of correction information corresponding to one or plurality of spin chucks are acquired in advance for adjustment of a position of a substrate by an aligner and are stored in a memory. Each correction information indicates a position to be adjusted by the aligner when the substrate is transported from the aligner to each spin chuck by a transport mechanism in order for a center of the transported substrate to coincide with a rotational center of the spin chuck. The position of the substrate is adjusted by the aligner based on the correction information, corresponding to the spin chuck, stored in the memory before the substrate is transported to any one of the spin chucks from the aligner during processing for the substrate.

Populating printed circuit boards with components on a pick-and-place variant set-up is provided. Each set-up includes a number of components, stocks of which are brought to setting-up tables on the pick-and-place line, and a set-up family is associated with each set-up, the family system, a fixed set-up and multiple printed circuit board types which can be populated using the set-up. The fixed set-up is optimized with respect to a weighted parameter, before determining, by means of a simulation, how well variant set-ups, with which the remaining components of predefined pick-and-place orders are associated, can be implemented on the setting-up tables and brought to the pick-and-place line. The quality of each different weighting is determined in order to determine an optimized weighting.

In a mounting system including multiple mounting machines, there is provided a mounting system that is capable of reducing the number of measurement devices that measure electrical characteristics of an electronic component. A control device controls a switching device in order to connect a measurement device and a mounting machine that transmitted request information for measuring the electrical characteristics of the electronic component. When transmitting an instruction for starting measurement to the measurement device and receiving a characteristic measurement value from the measurement device, the control device transfers the received characteristic measurement value to the mounting machine that transmitted request information.

Provided are a first component holding tool operating device which operates one component holding tool which is positioned at a first position set on one circumference among the plurality of component holding tools for holding and disengaging a component, and a second holding tool operating device which operates one component holding tool which is positioned at a second position set on the circumference among the plurality of component holding tools for holding and disengaging the component. The first position and the second position are set so that the second position is positioned in the middle of two adjacent component holding tools among the plurality of component holding tools when one of the plurality of component holding tools is positioned at the first position.

There is provided an inspection apparatus which inspects a board on which a mounting apparatus mounts a component, including a detecting unit (an inspection process unit and an inspection camera) that detects inspection information including a positional deviation amount of the component which is mounted on the board, a determining unit that determines whether the detected positional deviation amount falls within a predetermined first range, a transmission unit that transmits the detected positional deviation amount to the mounting apparatus; and a determination unit that determines whether to transmit the detected positional deviation amount to the mounting apparatus. In addition, in a case where it is determined that the positional deviation amount falls within the first range and it is determined that a predetermined condition is satisfied, the determination unit suspends transmission of the positional deviation amount to the mounting apparatus.

A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.

An apparatus for manufacturing a printed circuit board having a substrate with an upper and a lower surfaces is disclosed. The apparatus is configured to implement a stacking operation disposing a first insulating material and a second insulating material on the upper and the lower surfaces of the substrate respectively. The apparatus includes a stacking operation table with a first and a second sides, a first measuring table and a first transporting device. The first measuring table is disposed adjacent to the first side of the stacking operation table, and has a first and a second image sensing elements disposed at a pair of diagonal corners. The first transporting device is movably disposed on a location higher than the stacking operation table and the first measuring table to transport the first and the second insulating materials to the first measuring table and then to the stacking operation table sequentially.

An apparatus for manufacturing a display apparatus includes a controller configured to control a second stage, wherein the controller includes an image processor configured to calculate position information of a first material and a second material and alignment information of a bonded material based on image information sensed by a camera unit, an operator configured to calculate final bonding position based on the position information of the first material and the second material calculated by the image processor, a controller unit configured to move the second stage to the final bonding position calculated by the operator, and a deep learning unit configured to update the operator through deep learning based on the alignment information of the bonded material calculated by the image processor.

In an electronic device assembly apparatus that inserts a leading end of flat and flexible cables 162 and 166 into connectors 164 and 168 on a circuit board 160, a gripping device 200 includes a first gripping mechanism 210 and a second gripping mechanism 212, a rotational mechanism 260, and a width direction open/close mechanism 240, and the width direction open/close mechanism 240 includes a first cylinder 244 and a second cylinder 270 that causes the first and the second gripping mechanism to perform a width adjustment movement in the same direction as the first cylinder, and the second cylinder has a lock function for fixing the second cylinder at a predetermined position.