A component mounter includes a substrate conveying-and-holding device 22 configured to convey a board, work heads 60, 62 configured to hold a component, a work head moving device 64 configured to shift the work heads above the board, multiple work units 34, 36, 37 configured to perform work on the board from below, and a unit moving device 35 configured to shift the work units below the board, and each of the multiple work units is mounted on a mounting section of the unit moving device in an exchangeable fashion. With the substrate work machine configured as described above, the board can be worked on from above and below, hence making it possible to deal with various types of work. In addition, by exchanging the work units mounted in the mounting section, further types of work can be dealt with.

An apparatus includes an upper housing, a gasket, and a lower housing. The upper housing generally comprises a plurality of tabs and a plurality of threaded sockets. The lower housing generally comprises a plurality of openings configured to engage the tabs of the upper housing and a plurality of holes configured to align with the plurality of threaded sockets when assembled to the upper housing.

Disclosed are a screen printer improved in solder separation and a method of controlling the same, in which close contact between a printed circuit board and a mask unit is enhanced to thereby improve the solder separation and stably supply a fixed quantity of solder supplied through a squeeze unit to the printed circuit board.

In a board work machine that performs board work with reference to a reference mark provided on a board, in a case of performing board work with respect to a board provided with overall reference mark and local area reference mark that acts as a reference for a local area as reference marks, when recognizing the reference marks by imaging, checking is performed as to whether a recognized reference mark is recognized correctly. For this checking, when checking whether the position deviation amount from a normal position and the relative position deviation amount of an imaging target identified as a reference mark is within the range of a set tolerance, set tolerances for a local area reference mark are smaller than set tolerances for an overall reference mark.

A method for manufacturing an electronic component, and a device for manufacturing the electronic component, which can easily achieve alignment by inserting multilayer chips into cavities formed in a pallet, and form external electrodes with a high degree of dimensional accuracy. A plurality of multilayer chips each composed of a laminated body with a plurality of ceramic layers and a plurality of internal electrode layers is inserted into each of a plurality of cavities formed in a pallet, and the plurality of multilayer chips is aligned by moving each of the plurality of multilayer chips to one of inner wall surfaces forming the cavity. A conductive ink is applied onto ends of the plurality of aligned multilayer chips, including the upper surface of the pallet, and the conductive ink applied is dried to form external electrodes on the plurality of multilayer chips.

A component mounting device is configured to mount, on a substrate, an electronic component having a functional unit. The component mounting device includes a component supply mechanism, a recognition unit, a component mounting mechanism, and a holding position determination unit. The component supply mechanism supplies the electronic component. The recognition unit recognizes a position of the functional unit. The component mounting mechanism holds the electronic component supplied from the component supply mechanism and mounts the electronic component on the substrate. The holding position determination unit determines a holding position of the electronic component by the component mounting mechanism based on the position of the functional unit recognized by the recognition unit.

A mounting nozzle is capable of holding an electronic component having multiple patterns provided on its pattern surface based on pattern design information. A camera is capable of capturing an image of the pattern surface of the electronic component. A movement mechanism is capable of moving the mounting nozzle between a location where capturing of the image by the camera is performed and a component mounting location. A control unit is capable of controlling the mounting nozzle and the movement mechanism. The control unit stores positional relationship information indicating positional relationship based on the pattern design information between a position of a registration pattern representative point identified by at least one registration pattern selected from the multiple patterns provided on the pattern surface and a position of a positioning reference point on which positioning of the electronic component at the component mounting location for mounting is based.

A component mounter includes a mounting head configured to revolve multiple nozzle holders to which multiple pickup nozzles can detachably be attached individually in a circumferential direction and to allow the multiple pickup nozzles to rotate on their own axes while being interlocked with each other and two Z-axis drive devices provided at two locations on a revolving orbit of the multiple pickup nozzles to raise and lower the pickup nozzles situated at the two locations. Then, when a component supplied from a component supply device can be picked up at any of multiple different nozzle angles of the pickup nozzle, the component mounter moves the pickup nozzle to a revolving angle at which the pickup nozzle can be raised and lowered and then lowers the pickup nozzle to pick up the component at a nozzle angle of the multiple nozzle angles which involves a smaller moving amount.

An object printing system printer enables printing of electrical circuits on non-planar areas of objects and the accurate placement of electronic components within the printed circuits. The system includes a direct-to-object printer and an electronic component placement system. The direct-to-object printer is configured to form an electrical circuit on an object secured within the direct-to-object printer. The electronic component placement system is configured to retrieve an electronic component and install the electronic component in the electrical circuit on the object secured within the direct-to-object printer in response to the direct-to-object printer generating a signal for the electronic component placement system that indicates the electronic component is to be installed in the circuit on the object secured within the direct-to-object printer.

A light emitting component mounter includes a luminance distribution measurer, a head moving mechanism, and a component mounting processor. The luminance distribution measurer causes the light to emit a light and measures a luminance distribution of a light emitter and detects a position of a luminance distribution center in the light emitter based on the measured luminance distribution. The head moving mechanism moves a mounting head. The component mounting processor controls the head moving mechanism based on the position detected by the luminance distribution measure.