An apparatus for manufacturing a display device includes a stage on which a display panel is placed, an accommodation portion on which a display circuit board is placed, where the display circuit board is connected to the display panel, an interval adjustment portion that adjusts an interval between the stage and the accommodation portion, and a rotation driving portion that rotates the accommodation portion. When the interval adjustment portion applies a force to the display circuit board, the rotation driving portion rotates the accommodation portion.

A changeover operation configuration device for use in a component mounting line including a registration section configured to register information of at least one of line layout information related to an arrangement of the component mounting line, work area layout information related to an arrangement of a work area at which the changeover operation is to be performed, and personnel quantity information of a quantity of operators who are to perform the changeover operation; an aggregation section configured to select the component type for which to perform changeover operation from the multiple component types, aggregate the component types to a restricted quantity of the component supply devices and designate the component supply devices as work targets; and a setting section configured to set an arrangement position of the component supply devices that are the work targets based on the at least one of the registered information.

Disclosed is a film sticking tool. The film sticking tool includes a base, a mounting seat and a pressing member. The base is provided with a sliding groove, the sliding groove having a first opening that opens toward one side; the mounting seat is provided with a positioning groove, the positioning groove being configured for positioning a device to be stuck with a film, and the mounting seat sliding into the sliding groove from the first opening; and the pressing member is provided close to the first opening and configured for pressing a film onto the device to be stuck with a film when the mounting seat is sliding into the sliding groove. The technical schemes of the present invention are simple in structure and easy to operate, which can easily remove air between the film and the device to be stuck with a film, prolong the service life of the film, and prevent the air between the film and the device to be stuck with a film from affecting the display effect of the device to be stuck with a film.

A correction amount calculation device includes a selection section and a correction amount calculation section. The selection section is configured to select a target component in which a movement amount of the component on a board before and after being conveyed to a reflow furnace is equal to or less than a predetermined allowable value. The correction amount calculation section is configured to calculate a correction amount, which is used in a mounting process of a board product to be produced later, regarding a positional deviation amount of the mounting position of the target component selected by the selection section with respect to a target mounting position.

According to various embodiments of the disclosure, an aligning device may include a body part including a body and a mask plate, wherein the body is configured to receive a movement by a first moving part and includes a body hole and the mask plate is configured to receive a movement by a second moving part and includes a mask plate hole and a head part disposed on the body part and configured to receive a movement by a third moving part. The mask plate may be disposed between the body and the head part and is configured to receive the movement by the second moving part to move between the body and the head part.

A panel alignment device for a display device includes a stage supporting a panel and including a transmitting portion that includes a first region having a first thickness and a second region having a second thickness greater than the first thickness, a head disposed over the stage and supporting a driving chip, a vision camera which is disposed under the stage, captures a first alignment mark of the panel through the first region, and captures a second alignment mark of the driving chip through the second region, and a controller which controls at least one of a movement and a rotation of each of the stage and the head based on first image information related to a position of the first alignment mark and second image information related to a position of the second alignment mark.

A display device includes a film align pad disposed under a connection film connected to a display panel and including a base lead and an align lead. The base lead extends in a first direction and the align lead protrudes from the base lead in a second direction intersecting the first direction. A board align pad is disposed on a printed circuit board, is connected to the connection film, and includes a base land and an align land. The base land extends in the first direction and the align land protrudes from the base land in the second direction.

A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.

A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.

A filter removal method for removing a filter held in a filter holding space provided in a tip part of a nozzle shaft in a component suction head, in which a suction nozzle is detachably attached to the tip part of the nozzle shaft, from the component suction head. The method comprises a deforming step of compressing and deforming the filter in the filter holding space, and a discharging step of discharging the compressed and deformed filter from the filter holding space.