A mark recognition device is applied to a substrate including a marked region. The mark recognition device includes; an image collecting mechanism and a first light source. The first light source emits a light beam, the light beam includes a first light beam and a second light beam. The first light beam is irradiated to the marked region of the substrate and blocked by a mark of the marked region to generate a marked orthographic projection on the image collecting mechanism. The second light beam is transmitted to the image collecting mechanism to form transmitted light. The image collecting mechanism recognizes the mark according to the marked orthographic projection of the mark and the second light beam. Recognition accuracy of the mark is effectively improved in embodiments of the present application.

Provided is a method for the throughput-optimised production of printed circuit boards on least two assembly lines, wherein: the printed circuit boards are divided into clusters; each cluster is produced using a set-up system that is carried out by changeover tables that can be attached to the assembly line, each changeover table having at least one feed device for keeping ready stocks of components; and a changeover table set and an empty changeover table set comprises changeover tables with feed devices that are empty.

A gantry-type positioning device includes first and second cross members. Two linear guides are disposed parallel to each other on a base and support the first and second cross members such that the cross members are movable in a first direction. A Y-carriage has a functional element and is supported on the first cross member such that the Y-carriage and the functional element are movable in a second direction. A position-measuring device is disposed on the second cross member and the Y-carriage such that a position of the Y-carriage relative to the second cross member is detectable. A Z-carriage supports the functional element such that the functional element is movable relative to the Y-carriage in a third direction. A further position-measuring device is disposed on the Y-carriage and the functional element such that a position of the functional element relative to the Y-carriage is detectable.

A positioning device that has a support table, two pairs of sliding blocks slidably mounted in the support table, a positioning plate extending vertically at the top of each sliding block, a base on which the support table is supported, a cylinder in the base, a ball in the cylinder, a piston rod slidably mounted in the cylinder and pushing the ball to move upward in a vertical direction, so that the ball drives the two pairs of sliding blocks to move away from each other in the first horizontal direction and the second horizontal direction, respectively, until the positioning plates of the two pairs of sliding blocks abut against four inner walls of the opening of the circuit board, respectively, to allow the electronic device to be received in a positioning slot defined by the positioning plates, and a release mechanism that drives the piston rod to move downward in the vertical direction to allow the two pairs of sliding blocks to be moved toward each other in the first horizontal direction and the second horizontal direction, so that the positioning plates drive the electronic device in the positioning slot to move toward a center of the opening.

A tray-type component supply device includes a device main body, a magazine configured to be detachably held by the device main body and to accommodate multiple trays in each of which multiple components are arranged vertically, a shuttle mechanism configured to draw any of the trays from the magazine to enable the components to be supplied, a lifting/lowering mechanism configured to move the magazine or the shuttle mechanism up and down to select a tray to be drawn by the shuttle mechanism, and an automatic exchange section configured to exchange the magazine to be collected from the device main body and the magazine to be provided to the device main body.

A mounting device includes a mounting section configured to pick up a component from a supply section that holds the component and execute a mounting process of the component on a mounting target, and a control section configured to acquire an inspection result obtained by executing an inspection process on the components placed on the mounting target and to notify an operator of the inspection result indicating that the component is defective at a timing before mounting an inspection resulted mounting component that is turned out to be mountable after the inspection result is determined.

An electronic device is provided with an electronic component having a base material and a terminal electrode formed on a first surface of the base material, and a circuit substrate in which a pad for mounting the electronic component is formed on a first surface. A hole for light transmission is formed in the pad, and the pad and the terminal electrode are electrically and mechanically connected to each other with a cured product of optical firing paste obtained by receiving light from a second surface that is a surface opposite to the first surface of the circuit substrate.

A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.

An apparatus, system and method for placing components on a circuit board by a pick and place machine. The apparatus, system and method may include a rotational table suitable to receive and hold the circuit board for the pick and place machine; at least one sensor capable of sensing an off-center fiducial on the circuit board after association with the rotational table; and at least one processor connective with at least one computing memory having therein non-transitory computing code. The steps performed by execution of the code may include receiving sensor data from the sensor indicative of at least a physical location the off-center fiducial; dividing the board into radial sections based on the sensor data; accessing at least one placement program for placement of at least first components by the pick and place machine; monitoring for a change to a second at least one of the radial sections based on rotation of the rotational table according to the sensor data; and accessing at least one second placement program for placement of second components upon a change to the physical location.

A method and a placement machine for equipping a carrier with components. The procedure includes: (a) positioning of the carrier in a first spatial location within the placement machine, such that components in a first section of the carrier are placeable by a placement head of the placement machine; (b) placement, by means of the placement head, of a multitude of marker components on the carrier in an overlap area of the carrier; (c) transferring of the carrier along a transport direction into a second spatial location within the placement machine, the second spatial location being selected such that components in a second section of the carrier are placeable by the placement head and that the marker components placed in the overlap area are optically detectable by a camera; (d) second optical detection by means of the camera of the marker components placed in the overlap area; and (e) placement of a multitude of components on the carrier in predefined placement positions within the second section, the spatial locations of the placement positions on the carrier depending at least on the result of the second optical detection of the placed marker components.