Described herein is an apparatus and method for manufacturing an image display. The apparatus provides an automated method for efficient production of a finished image display, beginning with a planar, unassembled, image display and resulting with a fully-assembled image display in its final form, such as a cube-shaped image display with a plurality of images affixed thereto. In one embodiment, the apparatus is machinery configured as a semi-automated workstation, configured with four jigs stationed on a rotating platform housed on a workstation base. The rotating platform is configured for 360 degree rotation and advancing each jig through one of four work positions. The rotating platform is controlled by a control panel, which can be operated manually or automated. In one embodiment, the machinery is capable of high through-put manufacturingup to three hundred image display cubes in one hour of operation.

A fixture to enable correct positioning of components in surface mount technology (SMT) field includes a tray, a positioning mechanism, at least one first upper magnet, at least one second upper magnet, and at least one lower magnet. The tray has at least one positioning hole. The positioning mechanism includes a base member, at least one sliding assembly, and at least one positioning post. The sliding assembly is slidably mounted to the base member. The positioning post is mounted to the base member, and disposed in the positioning hole of the tray. The first upper magnet and the second upper magnet are attached to the tray. The lower magnet is attached to the sliding assembly. The tray and the positioning mechanism are repulsive when the lower magnet aligns with the first upper magnet but are attracted when the lower magnet aligns with the second upper magnet.

A method for placing electronic components onto a circuit board, comprising the following steps: Placing a component to be placed of a first component type into a starting position; creating a component image of the component to be placed in the starting position; creating a circuit board region image of a circuit board of a first circuit board region type; calculating a travel path for moving the component to be placed into a final position on the circuit board based upon an image overlay of the component image and a previously saved reference component image of a reference component of the first component type, and based upon a previously saved reference travel path of the reference component from a reference starting position into a reference final position on a reference circuit board of the first circuit board region type, and based upon an image overlay of the circuit board region image and a previously saved reference circuit board region image of the reference circuit board; moving the component to be placed along the travel path into the final position.

An apparatus for holding a printed circuit board when mounting components thereon, said apparatus comprising a base plate, a mounting device for mounting a printed circuit board spaced from and substantially parallel to the base plate, a plurality of elongate support pins extending through respective holes within the base plate to extend transversely from the base plate, the support pins being independently positionable in height with respect to the base plate to define a configurable support surface for supporting components mounted on the printed circuit board during soldering, wherein the height that each pin extends from the base plate can be adjusted such that the support surface defined by the support pins can correspond to the topography of the circuit board and the components mounted thereon, a locking mechanism being provided for selectively locking the position of each support pin with respect to the base plate, wherein said locking mechanism comprises at least one elongate flexible member arranged to extend around a plurality of said support pins in convolute manner, tensioning device being associated with said at least one flexible member, whereby said tensioning device is adapted to selectively apply tension to said at least one flexible member to grip the pins around which said flexible member extends to lock the position of said pins with respect to the base plate.

A chuck main body type and claw type deciding table and a pusher type deciding table are memorized in advance, information related to a leaded component such as component size, lead pitch, lead diameter, and component form is acquired, a combination of the chuck main body type and the claw type is searched from the chuck main body type and claw type deciding table using the acquired component size, lead pitch, lead diameter, and the like as search terms, the pusher is searched from the pusher type deciding table using the acquired component form or the like as a search term, and the search results are displayed. By this, it is possible to automatically select a tool made from a combination of multiple configuration members.

A module installation assembly for installing a module into a socket of a land grid array includes a tool having a mounting bracket for connecting the tool to an adjacent fixture, an alignment member connected to the mounting bracket, and cavity defined at least partially by the alignment member. The cavity is substantially aligned with a socket of the land grid array such that the module is configured to pass through the cavity when being connected to the socket.

An electronic component mounting device is provided for mounting, at different intervals from each other on attachments, a plurality of electronic components which have been placed in a predetermined portion. The electronic component mounting device comprises a removal mechanism for removing some of the plurality of the electronic components being placed in the predetermined portion, a transport mechanism for transporting the electronic components removed by the removal mechanism, moving the electronic components such that, before reaching the attachments, the plurality of the electronic components are at the different intervals at which they will be mounted on the attachments, and transporting the electronic components to the attachments, and a mounting and transfer mechanism for mounting the electronic components, which have been transported by the transport mechanism, on predetermined positions of the attachments.

Devices, methods and systems disclosed herein relate to the application of a protective film on a surface of an electronic device that instantly reduces air bubbles and eliminates the waiting time usually required when using a wet fluid solution. In one embodiment, a flange may be configured to couple to the protective film. The flange may aid in the accurate application of the protective film to the electronic device.

Devices, methods and systems disclosed herein relate to the application of a protective film on a surface of an electronic device that instantly reduces air bubbles and eliminates the waiting time usually required when using a wet fluid solution. In one embodiment, a flange may be configured to couple to the protective film. The flange may aid in the accurate application of the protective film to the electronic device.

According to embodiments of the invention, an electronic component assembly may be provided. The electronic component assembly may include an electronic component body. The electronic component assembly may also include one or more elastic members affixed to the electronic component body. The electronic component assembly may also include a catch mechanism affixed to each elastic member adapted to allow insertion of the elastic member and the catch mechanism through a hole of a circuit board in an extended position, and upon release from the extended position, hold the electronic component body in a fixed position by the tension of the elastic member and the catch mechanism grasping an edge of a surface of the circuit board opposite a surface upon which the electronic component body rests.