Patent classifications
H05K13/0061
CONTACTLESS ELECTRIC POWER SUPPLY DEVICE
A contactless electric power supply device configured to widen a range in which power supply is possible to a moving body in a connection direction by supplying electric power from a supply coil to the moving body provided with the receiving coil in a contactless manner and connecting power supply modules provided with the supply coil, wherein, when at least one of the receiving coils is positioned to be able to receiver power from at least one of the supply coils, the contactless electric power supply device performs communication from the power supply module to an alternating module that supplies alternating current and performs communication from the alternating module to the power supply module, and causes a semiconductor switch provided on the power supply module to conduct electricity.
Setup support device
A setup support device that improves the efficiency of setup of a component mounter by guiding supplying of feeders to a component supply device as preparation for setting of the feeders. The support setup device includes: a preparation cart on which are loaded multiple of the feeders used to perform multiple production jobs; and a feeder identifying section configured to identify multiple of the feeders to be set on a component supply device among the multiple feeders loaded on the preparation cart. The preparation cart includes a guidance section configured to issue guidance all at once for the identified multiple feeders to an operator performing the setup so as to supply the identified multiple feeders to the component supply device as preparation for setting the identified multiple feeders on the component supply device.
COMPONENT MOUNTING MACHINE
A component mounting machine used for effectively avoiding interference between a head main body and a station during exchange of a component holding tool attached to the head main body, the component mounting machine including a head main body to detachably hold a component holding member to hold a component; a head moving mechanism to move the head main body; a station attached to the component mounting machine main body, and to hold an exchange-use component holding member; a station moving mechanism to move the station; and a control device configured to use the station moving mechanism to change a height position in the raising and lowering direction of the station during exchange of the component holding member to be attached to the head main body in accordance with a height position in the raising and lowering direction of the head main body.
ELECTRONIC COMPONENT MOUNTING MACHINE AND MOUNTING METHOD
An electronic component mounting machine includes a storage section configured to store viscous fluid, a head section configured to hold an electronic component having a bump and to immerse the bump of the electronic component in the viscous fluid, an irradiation section configured to irradiate the bump, to which the viscous fluid has been transferred, with light, an imaging section configured to capture an image of the bump irradiated with light from the irradiation section, and a control device. The control device executes detection processing for detecting a transfer amount of the viscous fluid transferred to the bump based on image data captured by the imaging section, determination processing for determining whether the transfer amount is good or bad, and transfer processing for transferring the viscous fluid to the bump in accordance with the transfer amount being less than a predetermined threshold.
Component mounting device
In component mounting device, if a rotary head held by a head holder greatly deviates from a specified reference, a CPU executes a process for a holding error. The process for the holding error includes a process of holding a rotary head again by the head holder or the like, for example. If the rotary head greatly deviates from a specified reference and the component mounting process is executed as is, there is a fear that poor precision will occur during component mounting. Therefore, the CPU does not execute the component mounting process but executes the process for the holding error.
SUBSTRATE WORK SYSTEM
A board work system including: a conveying and holding device including a pair of rails configured to support a board, and a changing mechanism configured to change a distance between the pair of rails, the conveying and holding device being configured to convey the board supported by the rails and hold the board at a work position; a work device configured to perform work with respect to the board held by the conveying and holding device from an underside of the board; a moving device configured to move the work device; and a control device, the control device including an acquiring section configured to acquire a rail spacing distance that is the distance between the pair of rails, and an operation control section configured to control operation of the moving device based on the rail spacing distance acquired by the acquiring section.
Component placement machine and component placement method
A lower surface of a board arranged at a working position is supported by a board supporter, and heights of a plurality of portions of the lower surface of the board are measured by a plurality of height measuring instruments attached to the board supporter. A component is installed on the board by control of a height of the installation of the component by an installation head and with respect to the board, which has the lower surface supported by the board supporter, being performed based on the height of the plurality of portions of the lower surface of the board measured by the plurality of height measuring instruments.
IMPROVED PRINTED CIRCUIT BOARD TRANSPORT
An assembly machine comprising a continuous circuitous track; a dispensing head system configured to at least partially assemble products, wherein the dispensing head system includes one or more dispensing heads movable around the continuous circuitous track; a product conveyance system extending between a first location of the continuous circuitous track and a second location of the continuous circuitous track and a placement module, the placement module including a first positioning system configured to move along a first axis that intersects with the product conveyance system, wherein the first positioning system is configured to receive a first of the products from the product conveyance system and move the first of the products from the product conveyance system to a first placement location; and a second positioning system configured to move along a second axis that intersects with the product conveyance system, wherein the second positioning system is configured to receive a second of the products from the product conveyance system and move the second of the products from the product conveyance system to a second placement location.
Pick-and-place device
This disclosure provides a pick-and-place device including base, carrying mechanism, driving mechanism and clamping mechanism. Carrying mechanism includes first side part, second side part, two conveyor assemblies and two first driving devices. Conveyor assemblies are respectively disposed on first side part and second side part and configured to carry circuit board. First driving devices are respectively connected to conveyor assemblies so as to respectively turn conveyor assemblies. Driving mechanism is disposed on base. Clamping mechanism includes base plate, clamping assembly and second driving device. Base plate is movably disposed on base via driving mechanism. Clamping assembly includes first claw and second claw are disposed on base plate and configured to pick and place circuit board. Second driving device is disposed on base plate. Second driving device is connected to clamping assembly so as to move first claw and second claw toward or away from each other.
Workpiece processing system and method
A workpiece processing system and method, the workpiece processing system comprising at least one workpiece processing module (3), each workpiece processing module comprising: a workpiece processing unit (11) for processing workpieces (W); and a feed unit (37) which is operable to transfer workpieces to and from the workpiece processing unit, wherein the feed unit comprises input and output feed assemblies (38, 39) which are operable to transfer workpieces to and from the workpiece processing unit and a processing zone feed assembly (40) which interconnects the input and output feed assemblies and is operable to transfer workpieces from the input feed assembly (38) to the workpiece processing unit and from the workpiece processing unit to the output feed assembly (39).