A method for washing a plurality of PCB units, the method comprising the steps of: receiving a plurality of PCB units, said PCB units arranged with a bump face projecting downwards; washing the bump face of the PCB units, then; flipping the PCB units as to project a ball face downwards, then; washing the ball face.

A system for flux residue detection is provided. The system includes a flux heater, where the flux heater controls a temperature of a flux spray applied to a printed circuit board, and an infrared camera, wherein the infrared camera provides a thermal image of the flux on the printed circuit board. A method, a computer system, and a computer program product for flux residue detection is provided, including setting flux application parameters, applying flux to a printed circuit board, and capturing an infrared image of the flux applied to the printed circuit board. A method, a computer system, and a computer program product for flux residue detection is provided, including setting flux application parameters, applying flux to a printed circuit board, capturing an infrared image of the flux applied to the printed circuit board, and determining there is excess flux residue on the printed circuit board.

When a workpiece holder holding a workpiece is rocked around a lateral rocking axis by a work stage of a mounter and the workpiece is positioned so that one mounting surface of the workpiece faces a predetermined direction to be worked, a component is mounted on the one mounting surface by a mounting head of the mounter. When a posture of the workpiece in the workpiece holder is changed by a posture changing head of a posture changer and thereafter the workpiece holder in which the posture of the workpiece is changed is rocked around the lateral rocking axis by the work stage of the mounter and the workpiece is positioned so that the other mounting surface of the workpiece faces a predetermined direction to be worked, a component is mounted on the other mounting surface by the mounting head of the mounter.

A work machine including a conveyor belt is rotated such that a protruding section is positioned on the upstream side of an end face on the opposite side to a conveyance direction of a circuit board while the circuit board is clamped by a clamping device. Thereby, it is possible to prevent interference between the projecting portion and the circuit board, and reliably push out the circuit board toward the downstream side using the protruding section. In multiple work machines, the circuit boards are simultaneously conveyed after a clamp of the circuit board is released. Thereby, there is no need for the work machine on the upstream side to be on standby for conveyance of the circuit board using the work machine on the downstream side and it is possible to prevent a reduction of throughput.

Provided is a method for the throughput-optimised production of printed circuit boards on least two assembly lines, wherein: the printed circuit boards are divided into each cluster; each cluster is produced using a set-up system that is carried out by changeover tables that can be attached to the assembly line, each changeover table having at least one feed device for keeping ready stocks of components; and a changeover table set and an empty changeover table set comprises changeover tables with feed devices that are empty.

An electronic component mounting machine including a board clamp device configured to clamp a circuit board conveyed by a conveyor by sandwiching side edge sections of the circuit board between a clamp member from below and a conveyor rail from above by raising the clamp member, the electronic component mounting machine being configured to mount electronic components on the circuit board clamped by the board clamp device; and a control device configured to control a clamping force that is a sandwiching force on the side edge sections of the circuit board sandwiched between the clamp member and the conveyor rail of the board clamp device. The control device is configured to acquire board information including at least a weight of the circuit board and to control the clamping force of the board clamp device based on the acquired board information.

Board conveyance device 24 is provided with a pair of conveyor belts 64 for conveying a board; and a lifter 70, 74, 78 that raises a board loaded on the pair of conveyor belts, and, in a state with board S raised by the lifter, a different board, board S, is conveyed by the pair of conveyor belts. Also, a board work system includes such a board conveyance device and a board work device that performs work on the board raised by the lifter of the board conveyance device.

A component mounter of the present disclosure including a mounting head configured to pick up components and mount the components onto a substrate; a head moving device configured to move the mounting head in parallel to a horizontal plane; and a conveyance device configured to convey the substrate in a conveyance direction parallel to the horizontal plane. The mounting head includes multiple nozzles configured to pick up and hold the components by a negative pressure, multiple switching valves provided corresponding to each of the multiple nozzles and configured to switch whether the negative pressure is supplied to the corresponding nozzle, a nozzle moving device configured to change which nozzle is positioned at each of a first nozzle position and a second nozzle position for moving the multiple nozzles and performing at least one of picking up and mounting of the components, a first driving device, and a second driving device.

A first conveyor belt and second conveyor belt are disposed on guide rail which is disposed so as to extend in a circuit substrate conveyance direction. Then, the circuit substrate supported by both the conveyor belts of the first conveyor belt and the second conveyor belt is held by substrate holding device, and work is performed on the held circuit substrate. In the transfer device having such a structure, for example, when the circuit substrate on which an operation has been completed is conveyed out by the second conveyor belt, a new circuit substrate is conveyed into the transfer device by the first conveyor belt. In this way, it is possible to perform printing work on a new circuit substrate at an early stage and shorten a cycle time.

A conveyance device used in a mounting system including a mounting-related device for applying a viscous liquid to and/or arranging a member on a processing target. This conveyance device uses a pallet having a pallet-side attachment section that holds a processing target. In addition, the conveyance device includes having a robot-side attachment section arranged at a distal end section of the conveyance robot for mounting the pallet-side attachment section and the conveyance robot is configured to convey the pallet in a mounted state between a loading position and a discharge position.