A component mounting device includes a conveyance unit that conveys a placement member on which a mounting target is placed, a head unit movable in a horizontal plane, and a controller. The controller transfers the mounting target from the conveyance unit to a transfer position by controlling movement of the head unit in the horizontal plane in a state in which the placement member is held by one or a plurality of heads of the head unit.

A vertical circuit board printer includes a multi-layer conveyor, a printer assembly, and a control system. The multi-layer conveyor includes a number of front conveyors and one rear conveyor. Each upper front conveyor is coupled to a lower front conveyor by a circuit board-lowering mechanism to transport a number of circuit boards in sequence from the number of front conveyors to the rear conveyor. The printer assembly includes a number of printers arranged in sequence above the number of front conveyors. The control system controls operation of the multi-layer conveyor and controls operation of the printing assembly through a software system.

Systems and methods for releasing semiconductor dies during pick and place operations are disclosed. In one embodiment, a system for handling semiconductor dies comprises a support member positioned to carry at least one semiconductor die releasably attached to a support substrate. The system further includes a picking device having a pick head coupleable to a vacuum source and positioned to releasably attach to the semiconductor die at a pick station. The system still further includes a cooling member coupleable to a cold fluid source and configured to direct a cold fluid supplied by the cold fluid source toward the support substrate at the pick station. The cold fluid cools a die attach region of the substrate where the semiconductor die is attached to the substrate to facilitate removal of the semiconductor die.

A mounting target working device includes a head unit, a first mounting target work area in which the head unit mounts a component on a first mounting target having a flat plate shape, and a second mounting target work area in which the head unit mounts the component on a second mounting target having a three-dimensional shape as compared with the first mounting target.

It is an object of the present invention to provide a component management system or the like that can accurately predict component exhaustion in a component mounting device that performs work at a line. Specifying section updates the time table based on the arrival time point or the unloading time point in each of component mounting devices. Arrival predicting section predicts the arrival time point in each component mounting device based on the time table and updates a prediction table. Since component-exhaustion predicting section acquires the arrival time point of a circuit board for which a component will be exhausted from the prediction table and calculates a component exhaustion time point, it is possible to predict the component exhaustion time point with high accuracy. An operator can perform a replenishment work based on the component exhaustion time point.

A component mounter includes a substrate conveying-and-holding device 22 configured to convey a board, work heads 60, 62 configured to hold a component, a work head moving device 64 configured to shift the work heads above the board, multiple work units 34, 36, 37 configured to perform work on the board from below, and a unit moving device 35 configured to shift the work units below the board, and each of the multiple work units is mounted on a mounting section of the unit moving device in an exchangeable fashion. With the substrate work machine configured as described above, the board can be worked on from above and below, hence making it possible to deal with various types of work. In addition, by exchanging the work units mounted in the mounting section, further types of work can be dealt with.

Disclosed are a screen printer improved in solder separation and a method of controlling the same, in which close contact between a printed circuit board and a mask unit is enhanced to thereby improve the solder separation and stably supply a fixed quantity of solder supplied through a squeeze unit to the printed circuit board.

A setup support device that improves the efficiency of setup of a component mounter by guiding supplying of feeders to a component supply device as preparation for setting of the feeders. The support setup device includes: a preparation cart on which are loaded multiple of the feeders used to perform multiple production jobs; and a feeder identifying section configured to identify multiple of the feeders to be set on a component supply device among the multiple feeders loaded on the preparation cart. The preparation cart includes a guidance section configured to issue guidance all at once for the identified multiple feeders to an operator performing the setup so as to supply the identified multiple feeders to the component supply device as preparation for setting the identified multiple feeders on the component supply device.

A system for separating a workpiece from workpieces is provided. The system includes a stocker on which a plurality of workpieces are stored in a stacked state, a holding unit including at least one pair of inverted V-shaped pads that sandwich and clamp both ends of one of the workpieces, and a moving unit that moves at least one of the holding unit and the stocker so as to relatively move the stocker downward with respect to the holding unit, which is in a state where the one of the workpieces is clamped by the at least one pair of pads, and to separate the one of the workpieces from other workpieces.

Systems and methods for releasing semiconductor dies during pick and place operations are disclosed. In one embodiment, a system for handling semiconductor dies comprises a support member positioned to carry at least one semiconductor die releasably attached to a support substrate. The system further includes a picking device having a pick head coupleable to a vacuum source and positioned to releasably attach to the semiconductor die at a pick station. The system still further includes a cooling member coupleable to a cold fluid source and configured to direct a cold fluid supplied by the cold fluid source toward the support substrate at the pick station. The cold fluid cools a die attach region of the substrate where the semiconductor die is attached to the substrate to facilitate removal of the semiconductor die.