A component mounting line includes a component mounting apparatus and a board distributing apparatus. The component mounting apparatus includes two transport lanes, each having a carry-in area where a board is carried and a mounting area where a component is mounted onto the board received from the carry-in area. The board distributing apparatus distributes the board to any one of the two transport lanes. The board distributing apparatus distributes the board to any one of the two transport lanes based on a presence or absence of boards in the carry-in area and the mounting area.

A work machine including a conveyor belt is rotated such that a protruding section is positioned on the upstream side of an end face on the opposite side to a conveyance direction of a circuit board while the circuit board is clamped by a clamping device. Thereby, it is possible to prevent interference between the projecting portion and the circuit board, and reliably push out the circuit board toward the downstream side using the protruding section. In multiple work machines, the circuit boards are simultaneously conveyed after a clamp of the circuit board is released. Thereby, there is no need for the work machine on the upstream side to be on standby for conveyance of the circuit board using the work machine on the downstream side and it is possible to prevent a reduction of throughput.

A component mounting station is divided into two component mounting areas in a board conveyance direction according to the size of circuit boards used in two types of production that are performed in order, and the area in which a backup pin is arranged on a backup plate is divided into two pin arrangement areas corresponding to the two component mounting areas. The quantity of backup pins necessary to support the component mounting board are arranged in a predetermined arrangement pattern, the circuit boards transported using the conveyor are stopped in the component mounting areas according to the type of component mounting board produced, the backup plate is lifted up, and the circuit boards are clamped by the clamp member, and the circuit boards supported by the backup pins in the pin arrangement areas are positioned below the circuit boards, and components are mounted on the circuit boards.

An apparatus for disassembling an electronic component from a circuit board includes a base, a controller, a positioning assembly, and a heating and suction assembly. The controller is fixed to the base. The positioning assembly is arranged on the base and coupled to the controller. The positioning assembly is configured to be controlled by the controller to position the circuit board at a first predetermined position. The heating and suction assembly is movably arranged on the base and coupled to the controller. The heating and suction assembly is moved to a second predetermined position to heat the electronic component and moved to a third predetermined position to attract and hold the heated electronic component by suction, whereby the electronic component is disassembled from the circuit board.

A board conveyance device provided with multiple engaging sections that engage with a circuit board. When the conveyance direction is a first direction and the board is large, a claw out of two claws is set to a stopping state. A shuttle is moved up to the movement end on the downstream side in the first direction and two arms rotate. A lever rotates accompanying rotation of a rotating body to a disengaged position by a lever rotating section of a stopping device and an arm unit is able to be disconnected from a moving body. An arm holding section engages with an engaging section to prevent movement in the x direction. The moving body is moved in a second direction with the arm unit held by the stopping device. The claw is set to be in the stopping state and is not used in conveyance of the board.

Disclosed are a screen printer improved in solder separation and a method of controlling the same, in which close contact between a printed circuit board and a mask unit is enhanced to thereby improve the solder separation and stably supply a fixed quantity of solder supplied through a squeeze unit to the printed circuit board.

A supply head of a die supply apparatus is detachably held by a head holding unit of a head moving mechanism. The supply head held by the head holding unit is replaceable with a supply head having the same number of nozzles as the number of nozzles of a mounting head of a component mounting machine. A nozzle arrangement of the supply head of the die supply apparatus has the same arrangement as a nozzle arrangement of the mounting head of the component mounting machine.

A carrier assembly configured to facilitate manufacture of a printed circuit board assembly includes a bottom frame defining a generally rectangular configuration and having a length and a width. The bottom frame is adjustable to vary at least one of the length or the width thereof. The assembly further includes a core releasably positionable on the bottom frame and configured to support a circuit board thereon. A carrier assembly system includes the bottom frame and a plurality of cores. Methods of manufacturing printed circuit board assemblies utilizing carrier assemblies are also provided.

A component mounting method includes independent mounting and cross lane alternate mounting. The independent mounting performs an operation of mounting a component on a first board carried in a first board transport lane from a first component supplier, and an operation of mounting a component on a second board carried in a second board transport lane from a second component supplier. The cross lane alternate mounting alternately performs an operation of mounting the component on the first board carried in the first board transport lane from the second component supplier, and an operation of mounting the component on the second board carried in the second board transport lane from the first component supplier.

A component mounting apparatus includes transport mechanisms that transport boards, component supply sections, mounting heads, and a control unit that controls them based on mounting data. Each transport mechanism includes an upstream side operation area and a downstream side operation area. When the mounting data corresponds to an independent mounting mode in which each of the mounting heads is used to mount a component only onto a board on a corresponding mechanism, the control unit performs a control so that the upstream side operation area is used as a mounting area. When the mounting data corresponds to an alternating mounting mode in which both mounting heads are used to mount the components sequentially onto a board that is first carried into the downstream side operation area, the control unit performs a control so that the upstream side operation area is used as a standby area.