A mounting-related device includes an articulated robot that is disposed in a movable space formed between a first conveyance section and a second conveyance section, holds, and moves a processing target object such that a posture of a mounting surface can be changed, and the first conveyance section and the second conveyance section include a rail attachment section that can attach and detach a pair of rail devices bridged between the first conveyance section and the second conveyance section for moving a board when conveying the board.

A circuit board tape includes substrate units each including a sprocket-hole region, a layout region and a joining mark. There are odd and more than three sprocket holes on the sprocket-hole region. An imaginary line extended from the joining mark is extended to between a first layout and a second layout located on the layout region. The amount of the sprocket holes between the imaginary lines of the adjacent substrate units is odd. The circuit board tape is cut along the imaginary lines of the different substrate units so as to remove the defective substrate unit from the circuit board tape and divide the circuit board tape into a front tape and a rear tape. After joining the front and rear tapes, the region where a first layout on the front tape and a second layout on the rear tape are located is defined as a combined layout region.

A component mounter includes a substrate conveying-and-holding device 22 configured to convey a board, work heads 60, 62 configured to hold a component, a work head moving device 64 configured to shift the work heads above the board, multiple work units 34, 36, 37 configured to perform work on the board from below, and a unit moving device 35 configured to shift the work units below the board, and each of the multiple work units is mounted on a mounting section of the unit moving device in an exchangeable fashion. With the substrate work machine configured as described above, the board can be worked on from above and below, hence making it possible to deal with various types of work. In addition, by exchanging the work units mounted in the mounting section, further types of work can be dealt with.

A separation positioning mechanism and a robot positioning system are disclosed. An embodiment of the separation positioning mechanism includes a fixed part, at least one guide rod, a movable part, a power part, and a positioning member. One end of the guide rod is fixed to the fixed part; the movable part is provided on the guide rod; the movable part is slidable along the guide rod to push a first assembly member placed on a transmission mechanism to be separated from the transmission mechanism. The robot positioning system includes the separation positioning mechanism.

An assembly system that includes a robot adapted to grip an electronic device to be mounted on a circuit board, a first vision system that identifies a position and a posture of the electronic device gripped by the robot, a fixing device that fixe a plurality of circuit boards thereon, and a second vision system that identifies a position and a posture of the circuit board fixed on the fixing device. The robot mounts the gripped electronic device on a circuit board under the visual guidance of the first vision system and the second vision system. The view field of the second vision system is not capable of completely covering a surface region of all circuit boards fixed on the fixing device. The assembly system further includes a moving mechanism that moves the second vision system in a first horizontal direction and a second horizontal direction perpendicular to the first horizontal direction, so that the second vision system completes identification of all circuit boards on the fixing device step by step. With this assembly system, the robot complete the assembly work of all circuit boards at an assembly station. Also, a method of assembling a circuit board that mounts a gripped electronic device on a circuit board.

A coordinate data generation device is used in a component mounter configured to perform processing for mounting electronic components on boards of different dimensions by imaging the board that is controlled to be conveyed and stopped at a target position and performing the mounting of the electronic components after correcting for a deviation between a stopping position of the board identified from an image captured by the imaging and a target position, and specifies an imaging region for imaging the board stopped at the stopping position.

A mounting target working device includes a head unit, a first mounting target work area in which the head unit mounts a component on a first mounting target having a flat plate shape, and a second mounting target work area in which the head unit mounts the component on a second mounting target having a three-dimensional shape as compared with the first mounting target.

A conveyance device used in a mounting system including a mounting-related device for applying a viscous liquid to and/or arranging a member on a processing target. This conveyance device uses a pallet having a pallet-side attachment section that holds a processing target. In addition, the conveyance device includes having a robot-side attachment section arranged at a distal end section of the conveyance robot for mounting the pallet-side attachment section and the conveyance robot is configured to convey the pallet in a mounted state between a loading position and a discharge position.

A component mounter of the present disclosure including a mounting head configured to pick up components and mount the components onto a substrate; a head moving device configured to move the mounting head in parallel to a horizontal plane; and a conveyance device configured to convey the substrate in a conveyance direction parallel to the horizontal plane. The mounting head includes multiple nozzles configured to pick up and hold the components by a negative pressure, multiple switching valves provided corresponding to each of the multiple nozzles and configured to switch whether the negative pressure is supplied to the corresponding nozzle, a nozzle moving device configured to change which nozzle is positioned at each of a first nozzle position and a second nozzle position for moving the multiple nozzles and performing at least one of picking up and mounting of the components, a first driving device, and a second driving device.

Systems and methods for releasing semiconductor dies during pick and place operations are disclosed. In one embodiment, a system for handling semiconductor dies comprises a support member positioned to carry at least one semiconductor die releasably attached to a support substrate. The system further includes a picking device having a pick head coupleable to a vacuum source and positioned to releasably attach to the semiconductor die at a pick station. The system still further incudes a cooling member coupleable to a cold fluid source and configured to direct a cold fluid supplied by the cold fluid source toward the support substrate at the pick station. The cold fluid cools a die attach region of the substrate where the semiconductor die is attached to the substrate to facilitate removal of the semiconductor die.