There is provided a production management apparatus including: a memory section configured to memorize component data in which ranks of LED components stored in the stocker are associated with identification information of the LED components; a rank input section configured to accept a rank of the LED component in the LED components of the multiple types as a designated rank, the LED component being used in producing the board product; and a component group generating section configured to generate a component group into which the LED components of the multiple ranks including the designated rank are combined so as to satisfy a required specification of the board product, based on the ranks of the LED components which are included in the component data.

An electronic component package includes an electronic component storage container including a main body with recesses to store electronic components positioned along a longitudinal direction of the main body and including openings on one side in a height direction of the main body, a cover sheet to cover the openings of the recesses and removably attached to the main body, and a cover positioned such that the cover sheet is between the cover and the main body, and electronic components stored in the recesses of the electronic component storage container, the electronic component package has a volume filling rate of the electronic components in at least one of the recesses of about 50% or higher.

An electronic component storage container includes a main body including recesses to store electronic components and positioned along a longitudinal direction of the main body and respectively including openings on one side in a height direction of the main body, a cover sheet to cover the openings of the recesses and removably attached to the main body, and a cover positioned such that the cover sheet is between the cover and the main body and engaged with the main body, slidably in the longitudinal direction. The cover includes a guide section to guide sliding movement relative to the main body, and a fitting section engageable with the main body in the height direction. The main body includes a strip section engageable with the guide section to allow the main body to be held by the cover in the height direction.

A component supply system comprising: a supply device including a storage section configured to store a component and a storage body mounting section where a storage body including at least the storage section is detachably mounted and configured to supply a component from the storage section of the storage body mounted on the storage body mounting section in a supply position; a first loading stand on which the storage body can be placed; and a second loading stand disposed at a different location from a location where the first loading stand is disposed and on which the storage body can be placed, wherein the storage body is transferred between either of the first loading stand and the second loading stand and the storage body mounting section.

A loose component supply device including component support member 150 configured to support components in a scattered state; and component supply apparatus 88 configured to store components and discharge components towards the component support member from discharge opening 98, wherein, in the component supply apparatus, conveyor belt 112 is arranged between storage section 100 that stores components and a discharge opening so as to extend diagonally upwards from the storage section on the side on which the discharge section is provided. Components housed in the housing section are discharged from the discharge opening towards the component support member by being conveyed by the conveyor belt. The component supply apparatus is removably mounted on the mounting section. Thus, because components are not discharged from the discharge opening unless the conveyor is operated, components do not fall from the discharge opening when the component supply apparatus is mounted on or removed from the mounting section.

An electronic package includes a component carrier having a stepped cavity formed therein; and a component assembly having at least two electrically connected electronic components with different sizes such that the component assembly has a stepped shape. The component assembly is accommodated at least partially inserted within the stepped cavity. Further described is a method of manufacturing such an electric package.

The current disclosure describes carrier tape systems that include a carrier tape substrate and a cover tape. The carrier tape system includes a plurality of repetitive adhesion areas where the carrier tape substrate and cover tape are attached to each other and non-adhesion areas where the carrier tape substrate and cover tape are not attached to each other. Separating the cover tape and the carrier tape substrate at these repetitive adhesion and non-adhesion areas imparts a vibration to the cover tape which impedes or prevents semiconductor devices carried in pockets of the carrier tape substrate from adhering to adhesive on the cover tape.

A component supply device, in which, a component storage tape is introduced to a first tape feed-out, unit through a tape introduction guiding unit, a first tape feed-out control unit controls the first tape feed-out unit to feed out the component storage tape. A first calculation unit calculates a standard tape length of the component storage tape. A second calculation unit calculates, based on the standard tape length, a target feed-out length of the component storage tape to be fed out by the second tape feed-out unit, so that a center of a leading component storage unit of the component storage tape coincides with a component extraction position. A second tape feed-out control unit controls the second tape feed-out unit so that the component storage tape is fed out based on the target feed-out length.

An electronic component series includes a base tape mainly composed of paper and having a multiplicity of accommodation recesses formed continuously at predetermined intervals for accommodating electronic components each having a substantially rectangular parallelepiped shape with an L dimension of less than or equal to 0.6 mm, a W dimension of less than or equal to 0.3 mm, and a T dimension of less than or equal to 0.3 mm; the electronic components accommodated in the accommodation recesses; and a cover tape continuously adhered to a surface of the base tape to cover the accommodation recesses. The electronic components are lifted from the accommodation recesses by peeling off the cover tape. Each of the accommodation recesses has a bottom surface inclined in a range of from 10° to 20° with respect to the surface of the base tape to be deeper toward a downstream in a conveyance direction.

A component supply device includes a pallet configured to allow a tray to be arranged thereon, a magazine operable to hold a plurality of pallets, and a magazine holder configured to allow the magazine to be arranged therein. The magazine holder is configured to allow the pallet to be conveyed from the magazine that has been arranged to a component supply position. The component supply device further includes a magazine supply unit configured to supply the magazine to the magazine holder, a magazine ejection unit configured to receive the magazine ejected from the magazine holder, and a magazine conveyance unit configured to convey the magazine from the magazine supply unit to the magazine holder.