A cleaning apparatus includes a case and a cleaning head. The cleaning head is disposed on the case, and provided with a plurality of tines. The tines are separately arranged abreast. The tines are used to extend into gaps between plural conductive terminals of a semiconductor product for cleaning the semiconductor product.

In a cut and clinch device, movable section 122 is slidable with respect to main body section 120. The main body section is configured from main body first section 147, and main body second section 148 that is removably attached to the main body first section, and a first insertion hole is formed in the main body second section. The movable section is configured from movable first section 144, and movable second section 146 that is removably attached to the movable first section, and second insertion hole 136 is formed in the movable second section. A lead is cut by the movable section being slid with the lead inserted into the first insertion hole and the second insertion hole. In a device configured as such, recognition mark 230 is provided on the movable second section and the main body second section, and the types of the movable second section and the main body second section are recognized based on image data of the recognition marks. By this, it is possible to appropriately check the type of the portion that cuts a lead.

A cleaning apparatus includes a case and a cleaning head. The cleaning head is disposed on the case, and provided with a plurality of tines. The tines are separately arranged abreast. The tines are used to extend into gaps between plural conductive terminals of a semiconductor product for cleaning the semiconductor product.

A correction mechanism includes a mounting board, a first correction assembly, and a second correction assembly. The first correction assembly includes a plurality of first limiting members and a plurality of first correction members alternating arranged with the plurality of first limiting members. The first limiting members are securely fixedly mounted on the mounting board. The first correction members are movably mounted on the mounting board and capable of moving toward the plurality of first limiting members along a first direction. The second correction assembly has a structure similar to the first correction assembly. The plurality of second limiting members and the plurality of second correction members are substantially perpendicular to and above the plurality of first limiting members and the plurality of first correction members

The present invention relates to a device for post-processing encapsulated integrated circuits, comprising a transit line, extending from an input location along at least one post-processing device for post-processing encapsulated integrated circuits to an output location, at least a first carrier independently movable across the transit line equipped for moving the encapsulated integrated circuits across the transit line between a first receipt location on the transit line and a first release location on the transit line, and at least one second carrier independently movable across the transit line, equipped for moving the encapsulated integrated circuits across the transit line between a second receipt location on the transit line and a second release location on the transit line.

A method for operating a three-dimensional (3D) metal object manufacturing apparatus selects operational parameters for operation of the printer to form vias in substrates. The method identifies the bulk metal being melted for ejection and uses this identification data to select the operational parameters. The method identifies the via holes in the substrate and operates an actuator to position an ejector opposite the via holes to eject drops of melted bulk metal toward the via holes to fill the via holes.