Patent classifications
H05K13/04
Method, system and device for identifying a bin in an SMT system
A method in an automated Surface Mount Device (SMD) warehouse configured to store bins at predetermined positions within said automated Surface Mount Device (SMD) warehouse, the method comprising receiving a bin at a port of said automated Surface Mount Device (SMD) warehouse and scanning an identity tag attached to said bin to obtain a bin ID.
IMAGE DATA GENERATION DEVICE AND COMPONENT MOUNTING SYSTEM
The image data generation device includes a component information input section and an image data generation section. The component information input section is configured to input a mounting position and an outer shape of the electronic component for each of the multiple electronic components to be mounted in the mounting processing. The mounting position includes a position in a height direction orthogonal to a surface of the board. The image data generation section is configured to generate image data for displaying a state when each of the multiple electronic components to be mounted in the mounting processing is arranged at the mounting position of the electronic component based on the mounting position and the outer shape of the electronic component input by the component information input section.
Component-mounting system and management device
Component-mounting system includes multiple component mounting machines disposed along a board conveyance direction; feeder storage container for storing multiples of feeders, which are capable of being attached/detached to and from component mounting machines, in each stage among multiple stages; first feeder moving robot capable of exchanging feeder between the lowest stage among multiple stages of feeder storage container and component mounting machine; and second feeder moving robot capable of exchanging feeder between the lowest stage among multiple stages of feeder storage container and the other stages.
Device and method for linearly moving first and second moving bodies relative to target object
A device for linearly moving bases with respect to an object, includes first and second bases, a linear scale provided with graduations at pitches in the moving direction, first and second encoder heads attached to the first and second bases, and a control unit. The control unit maintains an interval between the first and second encoder heads to be constant, and moves the first and second bases while sequentially detects a first and second graduation numbers, and calculates a distance on the scale between the first and second encoder heads by multiplying a difference between the first and second graduation numbers by the pitch, and calculates a position correction coefficient of the scale as a ratio of the interval with respect to the calculated distance, and controls the movement amount of the first movable body and the second movable body based on the position correction coefficient.
COMPONENT MOUNTER
A component mounter includes a state recognition section configured to recognize a supply state of a component in a supply area based on a feature amount including at least one of a shape and an angle of each of multiple feature portions in image data on which image processing has been executed. The state recognition section determines whether one or more candidate feature portions included in a search range belong to an identical component together with a reference feature portion based on one of feature amounts of the candidate feature portion and a positional relationship between the reference feature portion and the candidate feature portion.
IMAGE PROCESSING DEVICE, MOUNTING DEVICE, AND IMAGE PROCESSING METHOD
An image processing device for processing an image of a tape in which multiple cavities for accommodating a component are provided along a predetermined feeding direction includes a generation section configured to extract brightnesses of pixels of a line along the feeding direction from the image and to generate a brightness waveform of the line, and a recognition section configured to execute a periodic analysis of a brightness change from the brightness waveform and to recognize a pitch of the cavities based on a wavelength obtained by the periodic analysis.
ELECTRONIC COMPONENT REEL SET, ELECTRONIC COMPONENT MODULE, AND ELECTRIC CIRCUIT
An electronic component reel set includes a first electronic component reel and a second electronic component reel. The first electronic component reel includes first electronic components each having a first characteristic value falling in a predetermined range above a reference characteristic value, a first electronic component package that stores the first electronic components linearly, a first reel body in which the first electronic component package is wound, and a first indicator portion indicating the first characteristic value. The second electronic component reel includes second electronic components each having a second characteristic value falling in a predetermined range below the reference characteristic value, a second electronic component package that stores the second electronic components linearly, a second reel body in which the second electronic component package is wound, and a second indicator portion indicating the second characteristic value.
TAPE FEEDER AND MOUNT DEVICE
A tape feeder that feeds a carrier tape constituted of a bottom tape accommodating multiple components and a cover tape adhered to the bottom tape to supply the components includes a peeling section configured to peel the cover tape from the bottom tape at a position in front of a supply position of the component, a tension applying section configured to pull the cover tape into a predetermined location by driving a motor to collect the cover tape peeled from the bottom tape, and a holding section configured to hold the cover tape between the peeling section and the tension applying section when a power supply of the tape feeder is turned off and to release the holding of the cover tape when the power supply of the tape feeder is turned on.
MOUNTING DEVICE, MOUNTING SYSTEM, AND INSPECTION AND MOUNTING METHOD
A mounting device of the present disclosure used in a mounting system, includes a supply section configured to hold a component, a mounting section configured to pick up the component from the supply section and perform a mounting process for the component on a mounting target, an inspection/imaging section configured to capture an image of the mounting target, and a control section configured to execute a missing component inspection process of detecting whether a component on the mounting target is missing or not by using a captured image of the mounting target, and, when a component is missing, control the mounting section to pick up the missing component from the supply section and dispose the missing component on the mounting target.
METHOD AND DEVICE FOR DISASSEMBLING ELECTRONICS
The present application provides a device for disassembling electronics, the device comprising transporting means (4) and/or holding means (5) arranged to receive one or more objects containing one or more electronic components, the holding means (5) being adjustable, imaging means (3) for imaging the object and/or measuring means for measuring the object, one or more removal means (6) for removing one or more electronic components from the object, the means being operatively connected to a control unit (1). The present application also provides a method for disassembling electronics with the device.