A method for equipping printed circuit boards on an equipping machine, the printed circuit boards being of a first length, and the equipping machine being realized to equip printed circuit boards of a second length, the second length being more than twice as great as the first length. The equipping machine has an input section (1) and an equipping section (2), the equipping section (2) being disposed after the input section (1) in a direction of conveyance (F) of the printed circuit boards, disposed after the input section (1) in a direction of conveyance of the printed circuit boards, the printed circuit boards of the first length and the printed circuit boards of the second length being transportable, in their longitudinal direction, from the input section (1) into the equipping station (2).

A circuit board assembly includes a connection circuit board, a near field communication antenna and solders. The connection circuit board includes circuit board pads. The near field communication antenna is attached to the connection circuit board, and the near field communication antenna includes: an antenna coil, antenna pads electrically connected to the antenna coil, and through holes penetrating the antenna pads and disposed opposite to the circuit board pads. The solders are connected to the circuit board pads through the through holes.

A management apparatus of the present disclosure is an apparatus used in a mounting system including multiple mounting-related devices each having an attachment portion to which a second member used in combination with a first member is attached and related to a process of mounting a component on a processing target object, and a moving work device that is moved between the mounting-related devices and automatically attaches and detaches the second member to and from the attachment portion. The management apparatus is configured to, when cancelation information indicating that the second member has been detached from the attachment portion of the mounting-related device is acquired and collecting information indicating that the moving work device has detached the second member from the attachment portion is not acquired, execute a process of setting the second member as a restriction target.

A reel holder on which is loaded tape reel is held on feeder main body of tape feeder so as to be displaceable in the width direction of feeder main body by link mechanism. By this, it is possible to displace the position of tape reel of tape feeder set on feeder setting table of a component mounter in the width direction of feeder main body based on the reel width of tape reel of an adjacent tape feeder, and tape reel of each tape feeder can be arranged making efficient use of the empty space between adjacent tape feeders.

An ultrasound-on-a-chip device has an ultrasonic transducer substrate with plurality of transducer cells, and an electrical substrate. For each transducer cell, one or more conductive bond connections are disposed between the ultrasonic transducer substrate and the electrical substrate. Examples of electrical substrates include CMOS chips, integrated circuits including analog circuits, interposers and printed circuit boards.

A driver mounting apparatus 40 includes a pressing device 50 that collectively presses drivers 21 to be mounted on terminals 23, 24 of bonded substrates 11ab, 11ab each of which is obtained by bonding a CF substrate 11a and an array substrate 11b having terminals 23, 24 with the terminals 23, 24 being uncovered, and substrate support members 41, 41 supporting the bonded substrates 11ab, 11ab, respectively. The pressing device 50 includes a driver-side pressing portion 51 and a substrate-side pressing portion 52. The substrate support members 41, 41 are movable independently from each other to position each of the bonded substrates 11ab, 11ab supported on the substrate support members 41, 41 with respect to the driver-side pressing portion 41.

A driver mounting apparatus 40 includes a pressing device 50 that collectively presses drivers 21 to be mounted on terminals 23, 24 of bonded substrates 11ab, 11ab each of which is obtained by bonding a CF substrate 11a and an array substrate 11b having terminals 23, 24 with the terminals 23, 24 being uncovered, and substrate support members 41, 41 supporting the bonded substrates 11ab, 11ab, respectively. The pressing device 50 includes a driver-side pressing portion 51 and a substrate-side pressing portion 52. The substrate support members 41, 41 are movable independently from each other to position each of the bonded substrates 11ab, 11ab supported on the substrate support members 41, 41 with respect to the driver-side pressing portion 41.

Methods and devices for selectively presenting a user interface in a dual screen device. More particularly, the method includes providing a gallery for the dual screen device. The gallery can present one or more images in a user interface. The gallery user interface can adapt to changes in the device configuration. Further, the gallery can display images or videos in the various configurations.

A tape feeder includes a path through which a taped lead component, in which a lead component is taped, is fed-out to a supply position, a sensor disposed in the path to detect the taped lead component, and a notification device configured to notify of detection of the taped lead component when the taped lead component is detected by the sensor.

A production system includes a first production line and a second production line arranged in parallel with each other, and a first feeder exchange device and a second feeder exchange device respectively provided in each production line at an interval with which the first feeder exchange device and the second feeder exchange device can pass by each other. When the production is stopped, the first feeder exchange device and the second feeder exchange device stop at intervals of a predetermined distance or more in a board conveyance direction.