A mounting device comprises: a mounting head having multiple pickup members configured to pick up components; a mounting control section configured to cause a second component to be picked up later when a first component, held by the mounting head at a predetermined height, and the second component, held by the mounting head at a lowered position lower than the predetermined height, are picked up with the mounting head; the mounting control section being configured to cause the second component to be released earlier when the mounting head, having picked up the first component and the second component, releases a component.

A bonding apparatus includes a bond head structure, an optical unit and an actuator unit. The bond head structure includes a bond head collet, a connecting unit to which the bond head collet is attached and a look-through passage extending through the bond head collet and the connecting unit along a central axis of the bond head structure. In use, the bond head collet holds an electrical component to be bonded to a bonding area of a base member and the optical unit is positioned relative to the bond head structure to view and inspect the electrical component through the look-through passage of the bond head structure. The actuator unit moves the connecting unit of the bond head structure based on the inspection of the electrical component by the optical unit, to align the electrical component with the bonding area of the base member.

The invention relates to an apparatus for mounting components on a substrate. The apparatus comprises a bond head with a component gripper, a first drive system for moving a carrier over relatively long distances, a second drive system which is attached to the carrier for moving the bond head back and forth between a nominal working position and a stand-by position, a drive attached to the bond head for rotating the component gripper or a rotary drive for rotating the substrate about an axis, at least one substrate camera attached to the carrier and at least one component camera. Either the second drive system is also designed to perform high-precision correction movements with the bond head, or a third drive system is provided to perform high-precision correction movements with the substrate. At least one reference mark is attached to the bond head or the component gripper.

A mounting system including a component mounter, a storage, and a unit exchange device includes a selection section that selects a combination of the specific component feeding unit and the related component feeding unit from the component feeding unit stored in the storage based on combination information indicating a combination of the characteristic rank of the specific component and a component type of the related component corresponding to the characteristic rank, and storage information including the component type, a position, and the characteristic rank of the specific component of the component feeding unit stored in the storage; and a control section that controls the unit exchange device to take out the combination of the specific component feeding unit and the related component feeding unit from the storage and to convey the combination to the component mounter.

A pressing device includes a screw body. The screw body includes a screw head that comprises a driver interface. The screw body also includes a screw shaft that comprises a screw tip opposite the screw head with respect to the screw shaft, exterior spiral threads between the screw head and screw tip, and an interior cavity with an opening at the screw tip. The pressing device also includes a pin partially inserted into the interior cavity. The pin comprises a first pin end inserted into the interior cavity, a pin shaft that is connected to the first pin end, and a second pin end that is connected to the pin shaft and that is exterior to the interior cavity. Applying a force to the second pin end in a direction towards the screw head causes the pin shaft to advance into to interior cavity.

A mounting apparatus for stacking and mounting two or more semiconductor chips at a plurality of locations on a substrate includes: a first mounting head for forming, at a plurality of locations on the substrate, temporarily stacked bodies in which two or more semiconductor chips are stacked in a temporarily press-attached state; and a second mounting head for forming chip stacked bodies by sequentially finally press-attaching the temporarily stacked bodies formed at the plurality of locations. The second mounting head includes: a press-attaching tool for heating and pressing an upper surface of a target temporarily stacked body to thereby finally press-attach the two or more semiconductor chips configuring the temporarily stacked body altogether; and one or more heat-dissipation tools having a heat-dissipating body which, by coming into contact with an upper surface of another stacked body positioned around the target temporarily stacked body, dissipates heat from the another stacked body.

A tray-type component supply device includes an exchanging table configured to lift and lowered between an upper position and a lower position, a conveyance section configured to receive a tray from the exchanging table and convey the tray, and a control section configured to receive a detection signal from the detection sensor and cause the driving section to operate the exchanging table, the control section including an abnormality detecting section configured to detect an abnormal state in which a height position of the exchanging table becomes unidentified, a retraction operating section configured to cause the exchanging table to move to the retraction position at a low speed when the abnormal state is detected, and a calibration and restoration section configured to calibrate the height position of the exchanging table to restore a normal state.

Provided is an image processing method for easily viewing images obtained by imaging multiple components at a time, the method including image capturing processing of capturing each component holding state relating to multiple suction nozzles mounted on a mounting head as one image, image dividing processing of dividing a region relating to a predetermined component holding state for image data of the multiple component holding states obtained by the image capturing processing, direction conversion processing of converting a direction of the component holding state for divided image data divided by the image dividing processing, and display processing of displaying an image based on the divided image data subjected to the direction conversion processing.

A shaft drive device includes a plurality of shafts each retained in a raisable and lowerable manner; a return spring for urging each of the shafts upward; an actuating member contactable with a pressed part of any one of the shafts for raising and lowering a selected shaft; and a raising and lowering mechanism which changes a posture of the actuating member between a first posture of coming into contact with the pressed part of the shaft and pressing the pressed part to lower the shaft against an urging force of the return spring and a second posture of releasing the pressing. The pressed part of the shaft is made of ferromagnet, and the actuating member is given a magnetic force.

A control device configured to control a component pickup and mounting operation of a component mounting machine; and multiple devices configured to execute the component pickup and mounting operation are provided. A device out of the multiple devices is attachably and detachably attached to the component mounting machine and includes a field programmable gate array that operates each function of the device by communicating with the control device. The field programmable gate array has a clock gating function of reducing an electric current flowing into the attachable and detachable device by stopping processing on a function that is not used, out of individual functions of the attachable and detachable device, when the attachable and detachable device is in a state capable of being removed by an operator.