A work machine and a mounting method by which end portions of a wire member can be mounted on connecting sections which are arranged variously are provided. A work head includes a first holding section configured to hold a first end portion and a second holding section configured to hold a second end portion. A control device includes a first mounting section configured to mount the first end portion held by the first holding section on a first connecting section, a moving section configured to cause a work head moving device to move the work head in accordance with a position of the second connecting section after having mounted the first end portion on the first connecting section, and a second mounting section configured to mount the second end portion held by the second holding section on a second connecting section.

A work machine and a mounting method by which end portions of a wire member can be mounted on connecting sections which are arranged variously are provided. A work head includes a first holding section configured to hold a first end portion and a second holding section configured to hold a second end portion. A control device includes a first mounting section configured to mount the first end portion held by the first holding section on a first connecting section, a moving section configured to cause a work head moving device to move the work head in accordance with a position of the second connecting section after having mounted the first end portion on the first connecting section, and a second mounting section configured to mount the second end portion held by the second holding section on a second connecting section.

A microcircuit deposition system incorporates a first printing engine for depositing a dielectric on a substrate. A microwire spooling machine houses a microwire spool and incorporates a tension guide to position a microwire trace onto the dielectric layer. A second printing engine trails the microwire spooling machine to deposit a covering dielectric layer over the microwire trace.

A microcircuit deposition system incorporates a first printing engine for depositing a dielectric on a substrate. A microwire spooling machine houses a microwire spool and incorporates a tension guide to position a microwire trace onto the dielectric layer. A second printing engine trails the microwire spooling machine to deposit a covering dielectric layer over the microwire trace.

A work machine and a mounting method by which end portions of a wire member can be mounted on connecting sections which are arranged variously are provided. A work head includes a first holding section configured to hold a first end portion and a second holding section configured to hold a second end portion. A control device includes a first mounting section configured to mount the first end portion held by the first holding section on a first connecting section, a moving section configured to cause a work head moving device to move the work head in accordance with a position of the second connecting section after having mounted the first end portion on the first connecting section, and a second mounting section configured to mount the second end portion held by the second holding section on a second connecting section.

A work machine and a mounting method by which end portions of a wire member can be mounted on connecting sections which are arranged variously are provided. A work head includes a first holding section configured to hold a first end portion and a second holding section configured to hold a second end portion. A control device includes a first mounting section configured to mount the first end portion held by the first holding section on a first connecting section, a moving section configured to cause a work head moving device to move the work head in accordance with a position of the second connecting section after having mounted the first end portion on the first connecting section, and a second mounting section configured to mount the second end portion held by the second holding section on a second connecting section.

A system and method for the large-scale production of PCBs including a continuous selective adhesion process for creating printed circuit traces providing input to a production line. A roll of printed circuit traces is produced using rolls of flexible substrate, conductive layer, and conductive layer support by applying adhesive between the rolls of flexible substrate and conductive layer, bringing the rolls together, transferring a circuit pattern onto the flexible substrate, curing the adhesive through non-opaque areas of the circuit pattern, and separating the non-bonded areas. The resulting printed circuit traces are applied from the roll to mounts, and circuit components are applied from a roll to the traces as the mounts move along the line. Additional rolls of printed circuit traces and circuit components may be incorporated, and multilayer PCBs may be produced. As part of the production line, the finished PCBs may be applied to flat or contoured products.

A system and method for the large-scale production of PCBs including a continuous selective adhesion process for creating printed circuit traces providing input to a production line. A roll of printed circuit traces is produced using rolls of flexible substrate, conductive layer, and conductive layer support by applying adhesive between the rolls of flexible substrate and conductive layer, bringing the rolls together, transferring a circuit pattern onto the flexible substrate, curing the adhesive through non-opaque areas of the circuit pattern, and separating the non-bonded areas. The resulting printed circuit traces are applied from the roll to mounts, and circuit components are applied from a roll to the traces as the mounts move along the line. Additional rolls of printed circuit traces and circuit components may be incorporated, and multilayer PCBs may be produced. As part of the production line, the finished PCBs may be applied to flat or contoured products.

An apparatus (1) for the creation of products incorporating devices for radio frequency identification (RFID), said apparatus (1) being configured to operate according to a continuous processing line which includes, in sequence: a supply unit (2) of a substrate material; an add-chip unit (4), having means for the application of chips on the substrate material (41); an aerial-making assembly comprising: an aerial posing unit (5), configured to deposit a metal wire at each chip; an electrical connection unit, configured for electrically connecting the metal wire and a respective chip therebetween; a coupling unit (7), adapted to place a coating material on the substrate material; and a plurality of reading means (42, 62, 9) of each chip, arranged along said processing line, wherein said unit of aerial posing (5) comprises a plurality of devices (100) for realizing an aerial, wherein each device (100) is provided with a putting wire head (150) arranged at one end of a main body (101) and having a translational degree of freedom in a longitudinal direction (L), said putting wire head (150) comprising a guide element (102) rotatable according said longitudinal direction (L) and adapted to engage and guide the wire to deposit it on a substrate and a beak-like element (103) adapted to selectively abut in abutment on said rotatable element.

An apparatus (1) for the creation of products incorporating devices for radio frequency identification (RFID), said apparatus (1) being configured to operate according to a continuous processing line which includes, in sequence: a supply unit (2) of a substrate material; an add-chip unit (4), having means for the application of chips on the substrate material (41); an aerial-making assembly comprising: an aerial posing unit (5), configured to deposit a metal wire at each chip; an electrical connection unit, configured for electrically connecting the metal wire and a respective chip therebetween; a coupling unit (7), adapted to place a coating material on the substrate material; and a plurality of reading means (42, 62, 9) of each chip, arranged along said processing line, wherein said unit of aerial posing (5) comprises a plurality of devices (100) for realizing an aerial, wherein each device (100) is provided with a putting wire head (150) arranged at one end of a main body (101) and having a translational degree of freedom in a longitudinal direction (L), said putting wire head (150) comprising a guide element (102) rotatable according said longitudinal direction (L) and adapted to engage and guide the wire to deposit it on a substrate and a beak-like element (103) adapted to selectively abut in abutment on said rotatable element.