The present disclosure provides a novel apparatus and method for printing circuitry that can dispense conducting traces, insulating traces, solder paste, and other materials onto a substrate material in a manner that allows for convenient prototyping of printed circuit boards.

Method for assembling includes: providing a system to transfer wire element from wire element supply device to wire element storage device; stretching wire element between supply and storage devices by tensioning; providing an individualized reservoir and separated chip elements, each including a connection terminal including a top with free access facing in which chip element is not present; transporting the chip element from reservoir to an assembly area between supply and storage devices in which wire element is tightly stretched in assembly area; fixing electrically conducting wire element to chip element connection terminal in assembly area; and adding electrically insulating material on chip element after latter has been fixed to wire element forming a cover, the addition of material being performed on surface of chip element including connection terminal fixed to wire element to cover at least the connection terminal and portion of wire element at fixing point of latter.

The present invention provides technology that makes it possible to perform branch formation on a semi-finished product in which electrical wires are inserted into connectors, without placing the semi-finished product on a jig board, and improving manufacturing flexibility. A wire harness manufacturing method includes step (a) and step (b). The step (a) is preparing a member in which a plurality of connectors into which electrical wires are inserted are respectively held by connector holding parts such that the electrical wires dangle, and supporting parts that are able to support the connector holding parts in a first direction that is orthogonal to a vertical direction are arranged in a second direction that is orthogonal to the first direction. The step (b) is forming branches from portions of the electrical wires that dangle from the connectors, with the connectors remaining in a state of being held by the connector holding parts.

The present invention provides technology that makes it possible to perform branch formation on a semi-finished product in which electrical wires are inserted into connectors, without placing the semi-finished product on a jig board, and improving manufacturing flexibility. A wire harness manufacturing method includes step (a) and step (b). The step (a) is preparing a member in which a plurality of connectors into which electrical wires are inserted are respectively held by connector holding parts such that the electrical wires dangle, and supporting parts that are able to support the connector holding parts in a first direction that is orthogonal to a vertical direction are arranged in a second direction that is orthogonal to the first direction. The step (b) is forming branches from portions of the electrical wires that dangle from the connectors, with the connectors remaining in a state of being held by the connector holding parts.

An apparatus (1) for the creation of products incorporating devices for radio frequency identification (RFID), said apparatus (1) being configured to operate according to a continuous processing line which includes, in sequence: a supply unit (2) of a substrate material; an add-chip unit (4), having means for the application of chips on the substrate material (41); an aerial-making assembly comprising: an aerial posing unit (5), configured to deposit a metal wire at each chip; an electrical connection unit, configured for electrically connecting the metal wire and a respective chip therebetween; a coupling unit (7), adapted to place a coating material on the substrate material; and a plurality of reading means (42, 62, 9) of each chip, arranged along said processing line, wherein said unit of aerial posing (5) comprises a plurality of devices (100) for realizing an aerial, wherein each device (100) is provided with a putting wire head (150) arranged at one end of a main body (101) and having a translational degree of freedom in a longitudinal direction (L), said putting wire head (150) comprising a guide element (102) rotatable according said longitudinal direction (L) and adapted to engage and guide the wire to deposit it on a substrate and a beak-like element (103) adapted to selectively abut in abutment on said rotatable element

A device (100) configured for the realization of a wire aerial of an element of radio frequency identification (RFID), which device (100) comprises: a main body (101), extending along a longitudinal direction (L) and adapted to be constrained to a support, which main body (101) has a longitudinal seat (112) adapted to house a wire for the realization of the aerial; a putting-wire head (150) arranged at one end of said main body (101) and constrained to the latter, said putting-wire head (150) comprising: a guide element (102), preferably rotatable according to an axis parallel to said longitudinal direction (L), which guide element (102) is adapted to engage the wire and to deposit it on a substrate and has a translational degree of freedom along said longitudinal direction (L) with respect to said main body (101); and a restraining element (103) of the wire, apt to selectively abut on said guide element (102) and preferably shaped like a beak,

the overall arrangement being such that said putting-wire head (150) is apt to assume a first rest configuration, wherein said restraining element (103) is attested on said guide element (102) and the wire is retained between them, and a second operative configuration, wherein said restraining element (103) is spaced from said guide element (102) in such a way that the wire can slide within said seat (112) and be deposed on the substrate by means of said guide element (102).

According to an aspect of the present disclosure, a device for manufacturing a side line includes a stage on which a substrate is loaded, a side guide configured to be disposed adjacent to a side portion of the substrate loaded on the stage, and a printing unit configured to print a conductive paste on the substrate.

According to an aspect of the present disclosure, a device for manufacturing a side line includes a stage on which a substrate is loaded, a side guide configured to be disposed adjacent to a side portion of the substrate loaded on the stage, and a printing unit configured to print a conductive paste on the substrate.

Discussed is a method of manufacturing a display device including forming a plurality of thin film transistors, a plurality of light emitting diodes (LEDs), a plurality of gate lines, and a plurality of data lines on a top surface of a first substrate, forming a plurality of gate link lines and a plurality of data link lines on a bottom surface of a second substrate, bonding the first substrate and the second substrate, and forming a plurality of side lines to connect the plurality of gate lines and the plurality of gate link lines, and to connect the plurality of data lines and the plurality of data link lines. The forming of the plurality of side lines includes loading the first substrate and the second substrate on a stage and disposing a side guide on side portions of the first substrate and the second substrate.

Discussed is a method of manufacturing a display device including forming a plurality of thin film transistors, a plurality of light emitting diodes (LEDs), a plurality of gate lines, and a plurality of data lines on a top surface of a first substrate, forming a plurality of gate link lines and a plurality of data link lines on a bottom surface of a second substrate, bonding the first substrate and the second substrate, and forming a plurality of side lines to connect the plurality of gate lines and the plurality of gate link lines, and to connect the plurality of data lines and the plurality of data link lines. The forming of the plurality of side lines includes loading the first substrate and the second substrate on a stage and disposing a side guide on side portions of the first substrate and the second substrate.