To populate printed circuit boards by means of a pick.sub.rand-place line, multiple set-ups, each having an associated set-up family, are formed. A number of component types is associated with each set-up and a number of printed circuit board types is associated with each associated setup family, such that a printed circuit board of a printed circuit board type in a set-up family can be populated on the pick-and-place line using components of the component types associated with the set-up. A setting-up table comprising a stock of components of a component type in a set-up can be provided on the pick-and-place line. A method for populating the printed circuit boards includes the steps of recording printed circuit board types, from which printed circuit boards are to be populated with components of associated component types, and associating recorded printed circuit board types with set-up families.

To populate printed circuit boards by means of a pick.sub.rand-place line, multiple set-ups, each having an associated set-up family, are formed. A number of component types is associated with each set-up and a number of printed circuit board types is associated with each associated setup family, such that a printed circuit board of a printed circuit board type in a set-up family can be populated on the pick-and-place line using components of the component types associated with the set-up. A setting-up table comprising a stock of components of a component type in a set-up can be provided on the pick-and-place line. A method for populating the printed circuit boards includes the steps of recording printed circuit board types, from which printed circuit boards are to be populated with components of associated component types, and associating recorded printed circuit board types with set-up families.

A mounter is provided with a head unit with a suction nozzle capable of picking up an electronic component that transfers the electronic component to a specified position, an imaging device that images the pickup orientation of the electronic component, a component data acquiring device that acquires the size of the electronic component, an image processing section that image processes the captured image, and an image processing pattern selecting section. The image processing pattern selecting section, based on the size of the electronic component, is able to select one image processing range and one image processing accuracy from multiple predetermined image processing ranges and multiple predetermined printing accuracies, and, as the size of the electronic component acquired from the component data acquiring section becomes smaller, selects a smaller image processing range and a more accurate image processing accuracy from the multiple image processing ranges and multiple image processing accuracies.

A mounter is provided with a head unit with a suction nozzle capable of picking up an electronic component that transfers the electronic component to a specified position, an imaging device that images the pickup orientation of the electronic component, a component data acquiring device that acquires the size of the electronic component, an image processing section that image processes the captured image, and an image processing pattern selecting section. The image processing pattern selecting section, based on the size of the electronic component, is able to select one image processing range and one image processing accuracy from multiple predetermined image processing ranges and multiple predetermined printing accuracies, and, as the size of the electronic component acquired from the component data acquiring section becomes smaller, selects a smaller image processing range and a more accurate image processing accuracy from the multiple image processing ranges and multiple image processing accuracies.

Some embodiments of the present disclosure relate to a processing tool. The tool includes a housing enclosing a processing chamber, and an input/output port configured to pass a wafer through the housing into and out of the processing chamber. A back-side macro-inspection system is arranged within the processing chamber and is configured to image a back side of the wafer. A front-side macro-inspection system is arranged within the processing chamber and is configured to image a front side of the wafer according to a first image resolution. A front-side micro-inspection system is arranged within the processing chamber and is configured to image the front side of the wafer according to a second image resolution which is higher than the first image resolution.

Some embodiments of the present disclosure relate to a processing tool. The tool includes a housing enclosing a processing chamber, and an input/output port configured to pass a wafer through the housing into and out of the processing chamber. A back-side macro-inspection system is arranged within the processing chamber and is configured to image a back side of the wafer. A front-side macro-inspection system is arranged within the processing chamber and is configured to image a front side of the wafer according to a first image resolution. A front-side micro-inspection system is arranged within the processing chamber and is configured to image the front side of the wafer according to a second image resolution which is higher than the first image resolution.

The present invention provides a storage unit for Surface Mount Technology (SMT) supplies, comprising a plurality of stacks having vertically stacked storage locations for SMT supplies, a terminal for inserting and receiving SMT supplies to and from said storage unit, a first collector arm for transporting SMT supplies between storage locations and said terminal, said collector arm being moveably arranged along said stacks so as to enable engagement with the vertically stacked storage locations of a stack. Further, the plurality of stacks are arranged in at least one cluster of two or more stacks in each cluster, wherein each stack of said at least one cluster is moveably arranged in relation to said collector arm so as to allow engagement of said collector arm with different stacks of the cluster upon movement of said two or more stacks in the cluster, thereby allowing said collector arm to engage storage locations of different stacks in said at least one cluster. The present invention further provides a method for operating a storage unit for SMT supplies.

An optimization device, that optimizes a process procedure for each of a plurality of process machines in a substrate process system in which circuit substrates can be transported on two paths, including a first process for setting a process procedure for each of the process machines so as to optimize a total process time that is the sum of a process time for each of the plurality of process machines for a circuit substrate being transported on one of the two paths, and a process time for each of the plurality of process machines for a circuit substrate being transported on the other of the two paths; and a second process for setting a process procedure for each of the process machines so as to optimize the process times.

An electronic component mounting system includes plural mounting line systems, and an integrated system capable of communication with the plural mounting line systems. The mounting line systems have an electronic component mounting line, a mounting line management unit, and an identification information reading unit. If identification information read by the identification information reading unit is not stored in an integrated database, a component information reading unit included in the mounting line management unit reads from a local database the identification information and information about a use status of electronic components housed in an electronic component housing body to which the identification information is attached.

An electronic component mounting system includes plural mounting line systems, and an integrated system capable of communication with the plural mounting line systems. The mounting line systems have an electronic component mounting line, a mounting line management unit, and an identification information reading unit. If identification information read by the identification information reading unit is not stored in an integrated database, a component information reading unit included in the mounting line management unit reads from a local database the identification information and information about a use status of electronic components housed in an electronic component housing body to which the identification information is attached.