An electronic device is provided. In some embodiments, the electronic device includes an a battery having a first electrical connector at a first end, a second electrical connector at a second end, and electrical conductors extending from the first connector to the second connector, a first circuit board connected to the first connector, and a second circuit board connected to the second connector. The first circuit board is electrically connected with the second circuit board through the electrical conductors.

The invention relates to a circuit board (1a, 1b, 1c), particularly for a power-electronic module (2), comprising an electrically-conductive substrate (3) which consists, at least partially and preferably entirely, of aluminum and/or an aluminum alloy. On at least one surface (3a, 3b) of the electrically-conductive substrate (3), at least one conductor surface (4a, 4b) is arranged in the form of an electrically-conductive layer applied preferably using a printing method and more preferably using a screen-printing method, said conductor surface (4a, 4b) being in direct electrical contact with the electrically-conductive substrate (3).

An electronic device is provided. In some embodiments, the electronic device includes an electronic device housing having a major planar face, first and second circuit boards oriented parallel to the major planar face, a third circuit board electrically connected with the first and second circuit boards, and a battery partially surrounded by the first, second, and third circuit boards. At least a portion of the third circuit board is oriented perpendicular to the major planar face between the first and second circuit boards.

An electronic device is provided. In some embodiments, the electronic device includes an electronic device housing having a major planar face, first and second circuit boards oriented parallel to the major planar face, a third circuit board electrically connected with the first and second circuit boards, and a battery partially surrounded by the first, second, and third circuit boards. At least a portion of the third circuit board is oriented perpendicular to the major planar face between the first and second circuit boards.

A flexible connector includes a unitary connector block having first and second board-facing areas. The first and second board-facing areas are longitudinally spaced from each other on a chosen surface of the connector block. The connector block includes a block body transversely separating the chosen surface from an opposing surface oppositely facing from the chosen surface. The connector block includes a flexible connector bridge longitudinally interposed between the first and second board-facing areas. A first connector port is located within the first board-facing area. A second connector port is located within the second board-facing area. A connector trace extends through at least a portion of the block body between the first and second board-facing areas. The connector trace electrically connects the first and second connector ports. Methods of making and using the flexible connector are also included.

An electronic device connection unit includes a substrate and a plurality of signal pads on the substrate configured to send signals from an electronic device to a driving printed circuit board (PCB). One or more active ground pads on the substrate are configured to connect at least the driving PCB to a reference voltage of the electronic device. One or more dummy ground pads on the substrate are configured to connect to the reference voltage of the electronic device without extending onto the driving PCB. One or more connectors are connected to the one or more dummy ground pads, where each of the one or more connectors is configured to electrically couple at least a subset of the one or more dummy ground pads to the one or more active ground pads.

A vehicle accessory control component includes a first circuit board substrate and a second circuit board substrate. The first circuit board substrate has a plurality of circuit elements and an overall perimeter shape including an outer edge profile and a plurality of first deviations along the outer edge profile. The second circuit board substrate has a plurality of circuit elements an outer edge profile and a plurality of second deviations along the outer edge profile, at least one of the second deviations being different than the first deviations. The first circuit board substrate and the second circuit board substrate are arranged in a plane and selectively movable relative to each other to form the overall perimeter shape of the substrate. The outer edge profile of the first and second circuit board substrates are received in a housing having a correspondingly shaped perimeter that generally conforms to the outer edge profile.

An electronic device is provided. In some embodiments, the electronic device includes an electronic device housing having a major planar face, first and second circuit boards oriented parallel to the major planar face, a third circuit board electrically connected with the first and second circuit boards, and a battery partially surrounded by the first, second, and third circuit boards. At least a portion of the third circuit board is oriented perpendicular to the major planar face between the first and second circuit boards.

According to one embodiment, a electronic module includes a circuit board including an electronic component mounted thereon, a flexible conducting member including a conductor including a portion covered with a covering member and a portion exposed from an edge of the covering member and soldered to the circuit board, and an engagement member engaging with the flexible conducting member to place the engaged flexible conducting member in a predetermined position on the circuit board and is attached to the circuit board by an attachment method the same as a method of mounting the electronic component on the circuit board.

A microelectronic assembly includes a first substrate having a surface and a first conductive element and a second substrate having a surface and a second conductive element. The assembly further includes an electrically conductive alloy mass joined to the first and second conductive elements. First and second materials of the alloy mass each have a melting point lower than a melting point of the alloy. A concentration of the first material varies in concentration from a relatively higher amount at a location disposed toward the first conductive element to a relatively lower amount toward the second conductive element, and a concentration of the second material varies in concentration from a relatively higher amount at a location disposed toward the second conductive element to a relatively lower amount toward the first conductive element.