A system and apparatus for monitoring and control of the operation of various types of industrial plants, including power plants, nuclear power plants and plants including various types of mechanical, electrical and chemical machinery. The invention employs modular non-microprocessor based, non-software based digital hardware that enables communication between sensors and control logic and between the control logic and actuators that control a functional aspect of each plant.

The present application discloses a mount for mounting a flexible display panel, comprising a flexible frame comprising a first end, a second end, and a mounting surface for receiving the flexible display panel, a first flexible arm attached to the first end of the flexible frame. The first flexible arm is movable between a first position such that the first flexible arm is substantially retracted into the flexible frame and a second position such that the first flexible arm is substantially extended from the flexible frame. When the first flexible arm is substantially extended from the flexible frame, the first flexible arm is capable of connecting to the second end of the flexible frame directly or indirectly and forming a ring comprising the first flexible arm and the flexible frame.

A power semiconductor module arrangement includes a semiconductor module having a controllable power semiconductor component, a first printed circuit board (PCB) arranged outside the semiconductor module, and a control unit arranged outside the semiconductor module and having a second PCB. The control unit is configured to control the controllable power semiconductor component. The controllable power semiconductor component has a first load terminal and a second load terminal between which a load path of the power semiconductor component is formed, and also a control terminal for controlling the load path. The first PCB has a conductor track connected in series with the load path. The first and second PCBs are spaced apart from one another and electrically connected to one another by a pin.

An electronic device connection unit includes a substrate and a plurality of signal pads on the substrate configured to send signals from an electronic device to a driving printed circuit board (PCB). One or more active ground pads on the substrate are configured to connect at least the driving PCB to a reference voltage of the electronic device. One or more dummy ground pads on the substrate are configured to connect to the reference voltage of the electronic device without extending onto the driving PCB. One or more connectors are connected to the one or more dummy ground pads, where each of the one or more connectors is configured to electrically couple at least a subset of the one or more dummy ground pads to the one or more active ground pads.

A first printed circuit board on which a heatsink having a discrete semiconductor device attached to it and first capacitors for smoothing an electric current after a conversion from AC to DC are mounted is arranged in the horizontal direction of a bottom portion of a device casing. On the first printed circuit board, various electronic components such as a resistor, a diode, a capacitor, a coil, etc. are mounted in addition to the heatsink and the first capacitors. Further, in an in-device-casing vacant space in an upper portion of the heatsink mounted on the first printed circuit board, a second printed circuit board on which second capacitors for performing smoothing upon a conversion from AC to DC are mounted is arranged orthogonally to the first printed circuit board in the device spacing.

The invention relates to a circuit board (1a, 1b, 1c), particularly for a power-electronic module (2), comprising an electrically-conductive substrate (3) which consists, at least partially and preferably entirely, of aluminium and/or an aluminium alloy. On at least one surface (3a, 3b) of the electrically-conductive substrate (3), at least one conductor surface (4a, 4b) is arranged in the form of an electrically-conductive layer applied preferably using a printing method and more preferably using a screen-printing method, said conductor surface (4a, 4b) being in direct electrical contact with the electrically-conductive substrate (3).

The invention relates to a circuit board, particularly for a power-electronic module, comprising an electrically-conductive substrate which consists, at least partially and preferably entirely, of aluminium and/or an aluminium alloy. On at least one surface of the electrically-conductive substrate, at least one conductor surface is arranged in the form of an electrically-conductive layer applied preferably using a printing method and more preferably using a screen-printing method, said conductor surface being in direct electrical contact with the electrically-conductive substrate.

According to one embodiment, a electronic module includes a circuit board including an electronic component mounted thereon, a flexible conducting member including a conductor including a portion covered with a covering member and a portion exposed from an edge of the covering member and soldered to the circuit board, and an engagement member engaging with the flexible conducting member to place the engaged flexible conducting member in a predetermined position on the circuit board and is attached to the circuit board by an attachment method the same as a method of mounting the electronic component on the circuit board.

Circuit arrangement for vehicles with at least one semiconductor element 30 and at least one first metal carrier plate 2a and a metal circuit board 2b. A multifaceted scope of application is provided if the carrier plate 2a is electrically insulated from the circuit board 2b and the carrier plate 2a is electrically linked with at least one of the circuit boards 2b by means of at least one semiconductor device 30 so that the carrier plate 2a and the circuit board 2b form an electrical three-pole.

An illustrative inventory of vehicle accessory control components includes a plurality of first circuit boards and a plurality of second circuit boards. The first circuit boards each have a substrate with a plurality of circuit elements supported on the substrate. The first circuit board substrates have an overall perimeter shape including an outer edge profile and a plurality of first deviations from the outer edge profile. The second circuit boards each have a substrate with a plurality of circuit elements supported on them. The second circuit board substrates have the overall perimeter shape including the same outer edge profile as the first circuit board substrates. The second circuit board substrates include a plurality of second deviations from the outer edge profile. At least one portion of the second deviations is different than the first deviations of the first circuit boards.