Patent classifications
H05K2201/05
Optical image recognition device and method for fabricating the same
An optical image recognition device and a method for fabricating the same are disclosed. The device includes a flexible printed circuit board, an image sensor, a glue, an optical collimator, a supporting ring, a sealant, and an optical filter. The top of the flexible printed circuit board is provided with a recess, the image sensor is located in the recess, the sidewalls of the image sensor and the recess are separated from each other, and the image sensor is coupled to the flexible printed circuit board through conductive wires. The glue adheres to the flexible printed circuit board and the image sensor and covers the conductive wires. The optical collimator is disposed on the image sensor. The supporting ring, disposed on the flexible printed circuit board, surrounds the glue and the optical collimator. The optical filter, disposed on the sealant, shields the optical collimator and the image sensor.
Ultrathin OLED lighting panel
A flexible lighting panel comprising a light-emitting unit with electrical contact pads on a flexible substrate; a flat flexible printed circuit board with a bendable extension tab, wherein the circuit board is located on the opposite side of the light-emitting unit from the substrate; the area of the circuit board, not including the extension tab, is the same or greater than and overlaps the emissive area of the light-emitting unit; and the circuit board has at least two flat electrical connectors in electrical contact with the contact pads of the light-emitting unit; the flat electrical connectors extending along the extension tab of the circuit board for connection to a power source. The light emitting unit can be an OLED. The extension tab can be bent so that the flat electrical connections become accessible in different orientations. The panel can be ultrathin.
Liquid crystal display module backlight structure, liquid crystal display, and display device, with each including a matt layer
The disclosure relates to the technical field of liquid crystal display, and discloses a liquid crystal display module backlight structure which includes a light blocking tape, a FPC strip, rubber-iron layer, a reflective sheet, a light enhancement prismatic lens, a light guide plate, and a matt film layer, a first end of the matt film layer overlaps the FPC light strip and a second end overlaps the light enhancement prismatic lens; the first end is bonded to the light blocking tape and the second end is positioned between the light enhancement prismatic lens and the light guide plate.
Flexible printed circuit board
A flexible printed circuit board includes a base film having an insulating property and a conductive pattern laminated on one surface of the base film, and has a terminal connecting area toward one end edge of the conductive pattern, the flexible printed circuit board including a reinforcement member laminated on an opposite surface of the base film and situated at least at a position opposite the terminal connecting area, wherein the reinforcement member has one or more lines of hollow holes aligning with a width direction thereof.
Apparatus, system and method of providing a fluid bag heater
The disclosure provides an apparatus, system and method of providing a flexible heater on at least one conformable substrate of a medical fluid bag. The disclosed embodiments may include providing a matched function ink set, printed onto at least one substantially planar face of the at least one substrate to form at least: at least one conductive layer capable of receiving current flow from at least one power source; at least one resistive layer electrically associated with the at least one conductive layer and comprising a plurality of heating elements capable of generating heat upon receipt of the current flow; and at least one dielectric layer capable of at least partially insulating the at least one resistive layer.
Connecting Electrical Circuitry in a Quantum Computing System
In some aspects, a flexible cable may comprise: a flexible strip with first and second parallel surfaces and first and second ends, said flexible strip being electrically insulating; a metal stripline within said flexible strip; first and second metallic grounding planes on said first and second surfaces, respectively; and a first circuit board mechanically attached to at least one of said first end of said flexible strip and said first and second metallic grounding planes at said first end, said first circuit board being mechanically stiff, said metal stripline being electrically connected to electrical circuitry on said first circuit board.
MULTI-LAYER MATERIAL WITH ONE OR MORE EMBEDDED FUNCTIONAL LAYERS
Please replace the current Abstract with the below language:
A multi-layer material comprises a textile substrate layer, a functional layer arranged on the textile substrate layer, and a coating covering the functional layer and the textile substrate. The multi-layer material further includes a textile cover layer arranged between the functional layer and the coating. An adhesive layer is arranged between the functional layer and the textile cover layer. The textile substrate is woven or knitted from one yarn and the textile cover layer is woven or knitted from an identical yarn.
Flexible substrate and semiconductor apparatus
A flexible substrate includes a first area including a first circuit, the first circuit configured to be connectable to a first component, a second area including a second circuit, the second circuit configured to be connectable to a second component, a connecting area provided between the first area and the second area and including a third circuit, the third circuit connecting the first circuit and the second circuit, one or more first via conductors provided between the first area and the connecting area and electrically isolated from the first circuit, the second circuit, and the third circuit, and one or more second via conductors provided between the second area and the connecting area and electrically isolated from the first circuit, the second circuit, and the third circuit.
LARGE-SCALE UV-C INACTIVATION DEVICES AND SIMULATIONS OF THE SAME
An UV-C device may include several UV-C light sources (e.g., UV-C LEDs) and such UV-C LEDs may have UV-C reflecting structures arranged to direct UV-C in a particular direction and at a particular size and shape. Doing so may, for example, increase the UV-C in a particular direction or working area. A UV-C generating device may be utilized in an air stream, such as an air duct, to sterilize air from that air stream. Multiple UV-C inactivation devices may be coupled in series and placed into a single housing for in order to increase the efficacy of the UV-C inactivation device. The inlet of the device may draw air using an inlet module attachment (e.g., a hood with one or more than one inlet hood) and may output air using an outlet module attachment (e.g., a duct to deliver air to an outflow air duct). Computational fluid dynamic software may be provided where UV-C inactivation devices may be positioned (e.g., manually or autonomously by an adaptive algorithm) to determine impact on airflow against various pathogens (e.g., Staphylococcus and/or SARS-CoV-2).
Loudspeaker
The present disclosure relates to a loudspeaker. The loudspeaker may include an earphone core, an auxiliary function module, and a flexible circuit board. The earphone core may be configured to convert an electric signal into a vibration signal. The auxiliary function module may be configured to receive an auxiliary signal and execute an auxiliary function. The flexible circuit board may be configured to electrically connect to an audio signal wire and an auxiliary signal wire of an external control circuit, and electrically connect the audio signal wire and the auxiliary signal wire with the earphone core and the auxiliary function module via the flexible circuit board, respectively. The loudspeaker in the present disclosure may simplify the wire routing and improve sound quality.