An exemplary embodiment provides a conductive connecting member, and a display device including the same, that includes a flexible elongated body and terminals formed at opposite ends of the body to be electrically connected to the body, wherein the body may include terminal areas in which the terminals are formed and a central area disposed between the terminal areas, and wherein two or more recess portions may be formed in edges of the body within the central area of the body.

The present disclosure provides a flexible printed circuit board (FPCB), a method for manufacturing the FPCB, and a capacitive touch display device with the FPCB. The FPCB comprises an FPCB substrate and a common electrode voltage (VCOM) filter circuit arranged on the FPCB substrate. The FPCB further includes one or more filter units. the filter units comprises: a conduction layer, arranged on the FPCB substrate and electrically connected to a VCOM output end of the VCOM filter circuit; an isolation layer, arranged on the conduction layer; and a shielding film, which is grounded, arranged on the isolation layer and arranged parallel with the conduction layer.

The disclosure is related to a flexible printed circuit board. The flexible printed circuit board comprises a connecting area and a plurality of gold fingers disposed inside the connecting area, wherein the widths of the gold fingers are different. By the above manner, the disclosure is able to increase the number of the gold fingers without changing the size of the flexible printed circuit board so as to solve the impedance matching problem of the gold fingers of the flexible printed circuit board.

A method for making a conductive polymer for electromagnetic shielding purposes includes steps of mixing liquid crystal monomers, a silver complex, an initiator, and a catalytic agent in certain proportions by weight to form a mixture. A solvent is added into the mixture, the mixture and the solvent being in a ratio from 3:17 to 1:3 by weight. The mixture is heated to undergo an atom transfer radical polymerization.

A display device includes a display panel, a first circuit board, a second circuit board, a first adhesive element, and a conductive element. The display panel includes a non-bending region and a bending region that is bent from the non-bending region. The bending region includes a curvature region having a specific curvature and a facing region facing the non-bending region in a thickness direction of the display module. The first adhesive element is disposed to combine the first circuit board with the second circuit board, and the conductive element is disposed to electrically connect the first circuit board to the second circuit board.

A component carrier, wherein the component carrier includes: i) a layer stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, ii) a bendable portion which forms at least a part of the layer stack, and iii) a metal layer which forms at least a part of the bendable portion. Hereby, the metal layer extends over at least 75% of the area of the bendable portion.

An electronic device includes a gimbal driver and a digital camera. The digital camera includes suspension member(s) attached to a base. The digital camera includes a camera module supported by the suspension member(s). The camera module includes: (i) a lens that focuses an image; and (ii) a sensor attached to the lens and that detects the focused image. Shape memory alloy (SMA) actuator(s) are attached between the base and the camera module. The gimbal driver generates actuating signal(s) in response to movement of the base to stabilize the image. An electrical interconnect directs the actuating signal(s) from the gimbal driver to the SMA actuator(s) to rotate the camera module.

A polymeric flexible substrate that meets the barrier requirements for oxygen and water, while exhibiting thermal stability or transparency may be formed from functionalized graphanes bonded with polymers.

Embodiments disclosed include a multilayer substrate for semiconductor packaging. The substrate may include a first layer with a first side with an xy-plane and individual locations on the first side have a first side distance below the first side xy-plane, and a second side with a second side xy-plane and individual locations on the second side may have a second side distance below the second side xy-plane; and a second layer with a first side coupled to the second side of the first layer and a second side opposite the first side of the second layer, wherein a thickness of the second layer at the individual locations on the second layer may be comprised of the first side distance plus the second side distance. Other embodiments may be described and/or claimed.

Embodiments of the present disclosure are directed towards an integrated circuit (IC) package. In embodiments, an integrated circuit (IC) package may include a flexible substrate. The flexible substrate may have a plurality of dies coupled therewith. The IC package may include a first encapsulation material, having a first rigidity, disposed on the flexible substrate to at least partially encapsulate each die of the plurality dies. The IC package may further include a second encapsulation material, having a second rigidity, disposed on the flexible substrate. In embodiments, the second rigidity and the first rigidity are different from one another. Other embodiments may be described and/or claimed.