H05K2201/05

FLEXIBLE SUBSTRATE AND SEMICONDUCTOR APPARATUS
20220130739 · 2022-04-28 ·

A flexible substrate includes a first area including a first circuit, the first circuit configured to be connectable to a first component, a second area including a second circuit, the second circuit configured to be connectable to a second component, a connecting area provided between the first area and the second area and including a third circuit, the third circuit connecting the first circuit and the second circuit, one or more first via conductors provided between the first area and the connecting area and electrically isolated from the first circuit, the second circuit, and the third circuit, and one or more second via conductors provided between the second area and the connecting area and electrically isolated from the first circuit, the second circuit, and the third circuit.

DEVICE COMPRISING STACKED CIRCUIT MEMBERS

A device comprises a first circuit member, a second circuit member and a third circuit member. The first circuit member comprises a first body for performing the function of the first circuit member and a first flexible board formed with a first integrated-electrode portion including first electrodes. The second circuit member comprises a second body for performing the function of the second circuit member and a second flexible board formed with a second integrated-electrode portion including second electrodes. The third circuit member comprises a third body for performing the function of the third circuit member and a third flexible board formed with a third integrated-electrode portion including third electrodes. The first integrated-electrode portion, the second integrated-electrode portion and the third integrated-electrode portion lie over each other in an upper-lower direction. The first body, second body and the third body are apart from each other when seen along the upper-lower direction.

ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME, AND BONDING METHOD THEREOF

Provided is an electronic component including a pad region including a plurality of pads extending along corresponding extension lines and arranged in a first direction, and a signal wire configured to receive a driving signal from the pad region, wherein the plurality of pads include a plurality of first pads arranged continuously and a plurality of second pads arranged continuously, and extension lines of the plurality of first pads substantially converge into a first point and extension lines of the plurality of second pads substantially converge into a second point different from the first point.

Shield Printed Wiring Board and Method of Manufacturing Shield Printed Wiring Board

Provided is a shielded printed wiring board that exhibits excellent connection stability even when having a through-hole with a small opening area, and enables a high degree of freedom in circuit design. The shielded printed wiring board 1 according to the present invention includes a printed wiring board 10, an insulating layer 22, and a conductive adhesive layer 21 disposed between the printed wiring board 10 and the insulating layer 22. The printed wiring board 10 includes a base 11, a circuit pattern 13 disposed on the base, and an insulating protective layer 14 covering the circuit pattern 13. The shielded printed wiring board has a through-hole 23 for external grounding that vertically penetrates the insulating layer 22 and the conductive adhesive layer 21. The conductive adhesive layer 21 has an extension 21a extending toward the inside of the through-hole 23 as compared with the insulating layer 22.

Component Carrier With Improved Bending Performance
20210368613 · 2021-11-25 ·

A component carrier, wherein the component carrier includes: i) a layer stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, ii) a bendable portion which forms at least a part of the layer stack, and iii) a metal layer which forms at least a part of the bendable portion. Hereby, the metal layer extends over at least 75% of the area of the bendable portion.

FLEXIBLE CIRCUIT BOARD INCLUDING BENDING PART WITH IMPROVED SHIELDING PROPERTIES AND MANUFACTURING METHOD THEREOF
20210360773 · 2021-11-18 ·

An antenna carrier includes a flexible circuit board, the flexible circuit board comprising: a first dielectric formed to include a width direction and a length direction; a first signal line positioned on one side in the width direction of an upper surface or a lower surface of the first dielectric; a second signal line spaced apart from the first signal line to the other side in the width direction and positioned on the upper surface or the lower surface of the first dielectric; a second dielectric positioned on one side in the width direction above the first dielectric and having the first signal line positioned below the second dielectric; a third dielectric spaced apart from the second dielectric to the other side in the width direction and positioned below the first dielectric, and having the second signal line positioned above the third dielectric; a first ground; and a second ground.

Flexible circuit board and test fixture

The present disclosure relates to the field of circuit testing technologies and discloses a flexible circuit board and a test fixture. The flexible circuit board comprises: a flexible body which has a first crimping portion and an extension portion, the first crimping portion being used to be laminated with a second crimping portion of a substrate to be tested; a first electrically connected structure which is located on a first side of the flexible body, arranged on the first crimping portion, and used to be laminated with a second electrically connected structure on the second crimping portion; a support structure which is located on the first side of the flexible body and includes a first support portion and a second support portion; the first support portion is arranged on the extension portion and configured to support the extension portion in the laminating state.

Connector for printed circuit board (PCB) memory drive

A data storage device including a first printed circuit board (PCB) and a second PCB. The first PCB includes a controller, an interface configured to interface with a host device, and a first connector. The second PCB includes a non-volatile memory and a second connector. The second connector is configured to couple to the first connector to establish a communication connection between the controller and the non-volatile memory.

EYEGLASSES

The present disclosure provides eyeglasses including: an eyeglass rim; an eyeglass temple, the eyeglass temple comprising a control circuit or a battery; a rotating shaft, the rotating shaft being configured to connect the eyeglass rim and the eyeglass temple, so that the eyeglass rim and the eyeglass temple are relatively rotated around the rotating shaft, and the rotating shaft being disposed with a rotating shaft wiring channel along an axial direction; and a speaker, the speaker comprising an earphone core, the speaker being connected to the eyeglass temple, the control circuit or battery in the eyeglass temple driving the earphone core to vibrate through the connection wire, wherein the earphone core vibrates to generate a driving force to drive a housing panel of the speaker to vibrate, and a straight line of the driving force being not parallel to a normal line of the housing panel.

ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME, AND BONDING METHOD THEREOF

Provided is an electronic component including a pad region including a plurality of pads extending along corresponding extension lines and arranged in a first direction, and a signal wire configured to receive a driving signal from the pad region, wherein the plurality of pads include a plurality of first pads arranged continuously and a plurality of second pads arranged continuously, and extension lines of the plurality of first pads substantially converge into a first point and extension lines of the plurality of second pads substantially converge into a second point different from the first point.