A flexible printed circuit of low emissivity including first and second ends and a flexible central portion extending between the first and second ends and including electrically-conductive tracks, coated with a polymer material, to electrically connect the first and second ends. The flexible central portion is at least partly covered with a heat shield formed in a material having an emissivity smaller than those of the polymer material and of the electrically-conductive tracks.

A radiative cooling structure for a printed circuit includes a circuit board and a cooling structure. A printed circuit is disposed on the circuit board. The printed circuit includes a plurality of printed leads and a thermal conductive area. The printed leads are connected to the thermal conductive area. A cooling structure covers the thermal conductive area. The cooling structure covers the thermal conductive area, and the cooling structure incudes a thermal radiation layer. Heat generated by heat sources on the circuit board is transferred to the thermal conductive area via the printed circuit. The cooling structure radiates the heat into surrounding space by radiation.

A heat spreader for printed wiring boards and a method of manufacture are disclosed. The heat spreader is made from a plurality of graphene sheets that are thermo-mechanically bonded using an alloy bonding process that forms a metal alloy layer using a low temperature and pressure that does not damage the graphene sheets. The resulting heat spreader has a higher thermal conductivity than graphene sheets alone.

An electronic power module comprising a case that houses a stack, which includes: a first substrate of a DBC type or the like; a die, integrating an electronic component having one or more electrical-conduction terminals, mechanically and thermally coupled to the first substrate; and a second substrate, of a DBC type or the like, which extends over the first substrate and over the die and presents a conductive path facing the die. The die is mechanically and thermally coupled to the first substrate by a first coupling region of a sintered thermoconductive paste, and the one or more conduction terminals of the electronic component are mechanically, electrically, and thermally coupled to the conductive path of the second substrate by a second coupling region of sintered thermoconductive paste.

A circuit component arrangement includes a base and a plurality of circuit components mounted to the base. A bonding agent adheres the circuit components in intimate contact to the base. The bonding agent is disposed in a respective open channel defined in an outward facing surface of the base in contact with each of the circuit components. A method of assembling a circuit component arrangement includes temporarily fastening a plurality of circuit components to a base. A bonding agent is injected into a respective open channel defined in the base to adhere each of the plurality of circuit components to the base. The plurality of circuit components are unfastened from the base. Injecting a bonding agent can include ceasing injection of bonding agent upon appearance of bonding agent in a window opening in fluid communication with the open channel.

A copper foil composite comprising a copper foil and a resin layer laminated thereon, satisfying an equation 1: (f.sub.3t.sub.3)/(f.sub.2t.sub.2)=>1 wherein t.sub.2 (mm) is a thickness of the copper foil, f.sub.2 (MPa) is a stress of the copper foil under tensile strain of 4%, t.sub.3 (mm) is a thickness of the resin layer, f.sub.3 (MPa) is a stress of the resin layer under tensile strain of 4%, and an equation 2: 1<=33f.sub.1/(FT) wherein f.sub.1 (N/mm) is 180 peeling strength between the copper foil and the resin layer, F(MPa) is strength of the copper foil composite under tensile strain of 30%, and T (mm) is a thickness of the copper foil composite, wherein a Cr oxide layer is formed at an coating amount of 5 to 100 g/dm.sup.2. is formed on a surface of the copper foil on which the resin layer is not laminated.

Systems and methods for detecting an incorrectly attached heat sink component on an electronic device. The system includes one or more temperature sensors secured to the electronic device and a controller unit comprising one or more processors and one or more computer-readable media, the computer-readable media having stored thereon executable instructions that are executable by the one or more processors to perform a method for detecting incorrectly attached heat sink components. The method includes receiving temperature data, calculating a thermal ramp rate, comparing the thermal ramp rate to a predetermined threshold ramp rate, and transmitting a fault signal when the calculated thermal ramp rate exceeds the predetermined threshold ramp rate.

A composite phase change material, including 65 to 80 parts of a phase change material and 20 to 35 parts of a binder by weight. The binder includes an acrylate monomer having a molecular weight of 50 to 300, an acrylate polymer having a molecular weight of 500 to 2000, and an initiator. The initiator in the composite phase change material can generate free radicals under the condition of ultraviolet light irradiation to initiate polymerization reactions between components of the composite phase change material, so that the composite phase change material is cured, thereby greatly accelerating a cure speed of the composite phase change material.

A method for producing or disassembling an electronic assembly are provided. The assembly may have a heating device integrated into a substrate. The heating device can be heated via an external power supply during the assembly process so that, for example, solder connections of an electric component can be melted. The heating device can also be used when operating the electronic assembly, and the heating device can then be directly actuated by the component. For this purpose, an electric connection is then established between the component and the heating device, the connection not yet being provided during the thermal assembly process in order to protect the electronic components of the circuit from being damaged.

An electrical assembly comprises a dielectric substrate and a metallic conductive trace overlying the substrate. The metallic conductive trace has a hollow cross-section that forms a duct. An annular member protrudes from the metallic conductive trace. The annular member has an opening in communication with the duct, the opening for receiving pressurized air or gas.