A method for obtaining a flexible circuit with an solid-state electric or electronic component, the method comprising: arranging an electric circuit with a conductive flexible polymer-based ink over a polymeric substrate in the solid state, wherein one or both polymers in the ink and the substrate are reversible solid-gel phase transition polymers; placing the component over the substrate and over the electric circuit; applying an external stimulus that results in a solid to gel transition of the polymeric substrate and ink, such that the component penetrates into the softened substrate, establishing an electrical contact of the component with the circuit. Also disclosed is a method for obtaining the flexible circuit itself, the flexible circuit obtained by the method, and an ink for the method for obtaining a flexible circuit.

A wiring substrate device includes a wiring substrate, a plurality of terminals each of which is provided upright on the wiring substrate and has a lower end, an upper end and a narrowed part between the lower end and the upper end, and a plurality of solders each of which has a melting point lower than the terminals and covers a surface of the corresponding terminal.

The invention relates to a method for producing a heatable radome, a flexible printed circuit board having a metallic structure being used. Said flexible printed circuit board is embossed and is back-molded with a thermoplastic material.

The present disclosure provides a printed circuit board and a wire arrangement method thereof. The printed circuit board includes a packaged chip and at least two connectors, wires of the packaged chip that are connected to different connectors are distributed on different board layers; and when the packaged chip is connected to one of the connectors, a via is backdrilled to form a high-speed path from the packaged chip to the connector, and copper walls of board layers corresponding to other connectors are drilled out. The wires of the packaged chip that are connected to different connectors are distributed on different board layers. When the packaged chip is connected to one of the connectors, according to backdrilling of different depths, the via is backdrilled to form a high-speed path from the packaged chip to the connector, and copper walls of board layers corresponding to other connectors are drilled out.

An electric heating device includes an electronics housing with a partition wall which separates a connection chamber from a heating chamber for emitting heat to a medium to be heated, and a fluid housing which delimits the heating chamber. At least one PTC heating device is connected to the heating chamber in a thermally conductive manner and is electrically connected in the connection chamber. A control device is located, at least in part, in the connection chamber and includes a circuit breaker that bears against a channel base. The channel base is located outside the heating chamber and is formed by the partition wall. The channel base, together with a channel top, forms a channel through which the medium can flow. This eliminates the need for complex heat sinks or the like, and the waste heat from the circuit breaker can be used to heat the medium.

A power converter includes a carrier, a first electronic component, a second electronic component, and a connection part. The first electronic component is disposed on the bottom surface of the carrier. The second electronic component is disposed on the top surface of the carrier. A first terminal of the connection part is coupled to the top surface or the bottom surface of the carrier. A second terminal of the connection part is a bonding pad and attached to the first electronic component's surface apart from the carrier. The carrier is disposed at to of a height of the power-converter. The connection part is fabricated by mechanical support of the first electronic component.

A power converter includes a carrier, a first electronic component, a second electronic component, and a connection part. The first electronic component is disposed on the bottom surface of the carrier. The second electronic component is disposed on the top surface of the carrier. A first terminal of the connection part is coupled to the top surface or the bottom surface of the carrier. A second terminal of the connection part is a bonding pad and attached to the first electronic component's surface apart from the carrier. The carrier is disposed at to of a height of the power-converter. The connection part is fabricated by mechanical support of the first electronic component.

A carrier assembly may include a first carrier sub-assembly, said first carrier sub-assembly having an elongated shape and comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure, said at least one electrically conductive layer structure extending up to a first area provided on one of two extremities of the elongated shape, wherein a first plurality of conductive nanowires is provided on said first area, and a second carrier sub-assembly, said second carrier sub-assembly comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure, said at least one electrically conductive layer structure comprising a second area, wherein a second plurality of conductive nanowires is provided on that second area.

Disclosed are semiconductor modules with hybrid deep trench capacitor (DTC) substrate. The semiconductor modules are hybrid in that they include both ajinomoto build-up film (ABF) and PrePreG (PPG). The ABF avoids or at least mitigates resin void risks. The PPG avoids or at least mitigates delamination and via crack risks.