A semiconductor chip is mounted on a mounting substrate. The semiconductor chip includes plural first bumps on a surface facing the mounting substrate. The plural first bumps each have a shape elongated in a first direction in plan view and are arranged in a second direction perpendicular to the first direction. The mounting substrate includes, on a surface on which the semiconductor chip is mounted, at least one first land connected to the plural first bumps. At least two first bumps of the plural first bumps are connected to each first land. The difference between the dimension of the first land in the second direction and the distance between the outer edges of two first bumps at respective ends of the arranged first bumps connected to the first land is 20 m or less.

A barrier layer is formed over electrically conductive contact pads on a substrate such as a wafer. A photoresist layer is applied over the barrier layer, and openings in the photoresist layer are filled with solder to form solder bumps. The barrier layer may be removed from within the openings prior to filling the openings with solder. The process is applicable to fine pitch architectures and chip size packaging substrates. The photoresist layer and portions of the barrier layer outside of the openings are removed following solder fill.

A soldering iron system with automatic variable temperature control comprising a hand piece or robot arm including a soldering cartridge having a soldering tip, a coil that generates a magnetic field, and a temperature sensor for sensing a temperature of the soldering tip; a variable power supply for delivering variable power to the coil to heat the soldering tip; a processor including associated circuits for accepting a set temperature input and the sensed temperature of the soldering tip, and providing a control signal to control the variable power supply to deliver a suitable power to the coil to keep the temperature of the soldering tip at a substantially constant level of the set temperature input.

A solder recovery device includes a recovery plate, a lifting and lowering device, and multiple connecting sections. The recovery plate recovers solder. The lifting and lowering device lifts up and lowers the recovery plate. The multiple connecting sections include a fixing portion provided on the recovery plate and configured to detachably attach the recovery plate to the lifting and lowering device and a fixed portion provided on the lifting and lowering device and to which the fixing portion is fixed, and are configured to restrain the recovery plate from moving in a predetermined direction relative to the lifting and lowering device when the fixing portion is fixed to the fixed portion. The multiple connecting sections have different restraining directions in which the recovery plate is restrained from moving relative to the lifting and lowering device.

A printed board has an elongated shape and is to be electrically coupled to a display panel via a flexible board. The printed board includes a first board section; and a second board section shorter in length than the first board section in a substantially perpendicular direction to a longitudinal direction of the printed board. The first board section and the second board section are disposed in a row in the longitudinal direction, each of the first board section and the second board section has a first end in the substantially perpendicular direction to the longitudinal direction, the first end of the first board section projects further than the first end of the second board section in the substantially perpendicular direction, and a connection portion to be connected to the flexible board is disposed at the first end of each of the first board section and the second board section.

Provided herein are power converter of a drive unit for an electric vehicle. The power converter includes an inverter having a first transistor, a second transistor, and a capacitor, and a laminated bus-bar having a positive bus-bar segment, a negative bus-bar segment and a phase bus-bar segment. The positive bus-bar segment, the negative bus-bar segment, and the phase bus-bar segment can be disposed about the capacitor to form a lead frame coupled with the capacitor. The lead frame can include a first lead coupled with the first transistor. The first lead can include portions of the positive bus-bar segment and the phase bus-bar segment. The lead frame can include a second lead coupled with the second transistor. The second lead can include portions of the negative bus-bar segment and the phase bus-bar segment.

Provided herein are power converter of a drive unit for an electric vehicle. The power converter includes an inverter having a first transistor, a second transistor, and a capacitor, and a laminated bus-bar having a positive bus-bar segment, a negative bus-bar segment and a phase bus-bar segment. The positive bus-bar segment, the negative bus-bar segment, and the phase bus-bar segment can be disposed about the capacitor to form a lead frame coupled with the capacitor. The lead frame can include a first lead coupled with the first transistor. The first lead can include portions of the positive bus-bar segment and the phase bus-bar segment. The lead frame can include a second lead coupled with the second transistor. The second lead can include portions of the negative bus-bar segment and the phase bus-bar segment.

Provided is an electronic component including a pad region including a plurality of pads extending along corresponding extension lines and arranged in a first direction, and a signal wire configured to receive a driving signal from the pad region, wherein the plurality of pads include a plurality of first pads arranged continuously and a plurality of second pads arranged continuously, and extension lines of the plurality of first pads substantially converge into a first point and extension lines of the plurality of second pads substantially converge into a second point different from the first point.

An anisotropic conductive film including conductive particles arranged uniformly in a single layer and capable of supporting fine-pitch connection is produced by: drying a coating film of a particle dispersion in which conductive particles are dispersed in a dilute solution of a thermoplastic resin that forms a coating after drying, whereby a conductive particle-containing layer is formed in which the coated conductive particles coated with the dried coating of the dilute solution of the thermoplastic resin and arranged in a single layer stick to the dried coating film; and laminating an insulating resin layer onto the conductive particle-containing layer.

A method of manufacturing a printed wiring assembly PWA on a substrate, includes the following steps: receiving assembly data associated with said PWA; dispensing, onto said substrate, and in accordance with the assembly data, a conductive ink; curing the dispensed conductive ink; reducing, by plasma treatment, the cured conductive ink; depositing a solder material on top of at least a portion of the reduced conductive ink; picking and placing, in accordance with the assembly data, one or more components on the deposited solder material; and performing reflow soldering, by heating, of the deposited solder material, the one or more placed components, and the reduced conductive ink, forming an intermetallic compound therebetween.