The present invention relates to an ink composition, a kit comprising components of the ink composition, a method of manufacturing a deformable conductor utilizing the ink composition, a deformable conductor obtainable by the method, an electronic device, in particular a wearable and/or stretchable electronic device, comprising the deformable conductor, a method of manufactuing a conductor, a conductor obtainable by the method and an electronic device comprising the conductor. The ink composition comprises a source of transition metal ions, a reducing agent and a polymer and/or a polymer precursor, the polymer precursor comprising a polymerizable terminal multiple bond. The method of manufacturing a deformable conductor comprises the steps of applying the ink composition on at least a part of a surface of a deformable substrate and thermally treating and/or irradiating the ink composition.

An anti-interference circuit board and a terminal are provided. The circuit board specifically includes a substrate (10). The substrate (10) has a first surface, and a first region (14) for placing a magnetometer (2) is disposed on the first surface. A plurality of circuit layers (11, 12, 15) are disposed in the substrate (10), and the plurality of circuit layers (11, 12, 15) are disposed in a stacked manner. For example, at least a first functional circuit (20) that is configured to generate a magnetic field in a first direction and a second functional circuit (30) that is configured to generate a magnetic field in a second direction are disposed in a stacked manner and are disposed in the substrate (10). When positions of the first functional circuit (20) and the second functional circuit (30) are specifically disposed, the following is met: the first region (14) is located in vertical projections of the first functional circuit (20) and the second functional circuit (30) on the first surface. It can be learned from the foregoing descriptions that the first functional circuit (20) and the second functional circuit (30) are disposed to compensate for interference to the magnetometer (2) in the first region (14), and during disposing, the first functional circuit (20) and the second functional circuit (30) are located below the magnetometer (2), to reduce an occupied surface area of the anti-interference circuit board.

A method for manufacturing a wiring board according to the present disclosure includes: in the following order, (a) a step of irradiating an insulating layer composed of a resin composition with active energy rays; (b) a step of adsorbing an electroless plating catalyst to the insulating layer; and (c) a step of forming a metal layer on a surface of the insulating layer by electroless plating, in which in the step (a), a modified region having a thickness of 20 nm or more in a depth direction from the surface of the insulating layer and voids communicating from the surface of the insulating layer is formed by irradiation of the active energy rays.

A wiring board according to the present disclosure includes a first insulating material layer having a surface with an arithmetic average roughness Ra of 100 nm or less, a metal wiring provided on the surface of the first insulating material layer, and a second insulating material layer provided to cover the metal wiring, in which the metal wiring is configured by a metal layer in contact with the surface of the first insulating material layer and a conductive part stacked on a surface of the metal layer, and a nickel content rate of the metal layer is 0.25 to 20% by mass.

The invention relates to a process of fabricating a beaded path on the surface of a substrate, the process comprising: preparing a dispersion of particles in a liquid; supplying the prepared dispersion to at least one electrically conductive microcapillary in a continuous manner; forming and maintaining a convex meniscus of the dispersion at the outlet end of the microcapillary positioned above and/or below the surface of a substrate; applying alternating voltage to the microcapillary so that a beaded structure is formed between the dispersion meniscus and the surface of the substrate; and moving the microcapillary relative to the substrate and/or the substrate relative to the microcapillary so as to deposit the particles of the formed beaded structure on the surface of the substrate and simultaneously rebuild the beaded structure formed between the dispersion meniscus and the surface of a substrate. The invention also relates to a system for realizing this process and the use of the beaded path fabricated in accordance with the process of the invention for the production of electrodes in photovoltaic cells, new generation clothing, electronic components, including flexible electronics, artificial flagella, photonic and optomechanical materials, as well as for the regeneration of damaged paths on the surface of a substrate. The present invention also relates to a kit comprising a substrate and a beaded path fabricated on the surface of that substrate according to this process. The invented process is simple, efficient, hence economical, and enables fabricating beaded paths that retain their properties after turning off the voltage initially used to form a beaded structure. Moreover, the process occurs outside a liquid environment and enables fabricating of paths in a continuous manner, that is, through the formation of the beaded structure and its simultaneous depositing on the surface of a substrate allowing the fabrication of beaded paths of arbitrary length.

An electronic device includes: a housing and a printed circuit board (PCB) structure disposed in the housing. The PCB structure includes a circuit board including an opening area formed through a first surface of the circuit board and a second surface of the circuit board opposite the first surface and a conductive pattern formed in a peripheral area around the opening area, a plate disposed on the second surface of the circuit board covering the opening area, an electronic element disposed on the plate and electrically connected with the circuit board, a resin portion disposed between the plate and the circuit board and extending from the conductive pattern, the resin portion including a conductive material, and a solder portion formed between the resin portion and the plate.

Electronic assembly methods and structures are described. In an embodiment, an electronic assembly method includes bringing together an electronic component and a routing substrate, and directing a large area photonic soldering light pulse toward the electronic component to bond the electronic component to the routing substrate.

A method of fabricating a composite conductive film is provided. The method includes providing, as a matrix, a layer of photoresist material. The method further includes introducing a plurality of inorganic particles upon a surface of the layer of photoresist material. The method further includes, without patterning the layer of photoresist material, embedding at least some of the plurality of inorganic particles into the layer of photoresist material to form an inorganic mesh within the layer of photoresist material, thereby forming the composite conductive film. Embedding at least some of the plurality of inorganic particles into the layer of photoresist material results in the composite conductive film being patternable and substantially transparent to optical light.

A printed circuit board is disclosed. The printed circuit board includes: a substrate layer; a copper layer disposed on the substrate layer; and an organic solderability preservative (OSP) layer disposed on the copper layer. The OSP layer defines one or more laser treated OSP surfaces.

A method of fabricating a composite conductive film is provided. The method includes providing, as a matrix, a layer of cross-linkable polymer while the cross-linkable polymer is in a substantially noncross-linked state. The method further includes introducing a plurality of inorganic nanowires onto a surface of the layer of cross-linkable polymer and embedding at least some of the plurality of inorganic nanowires into the layer of cross-linkable polymer to form an inorganic mesh within the layer of cross-linkable polymer, thereby forming the composite conductive film. The method further includes cross-linking the cross-linkable polymer within at least a surface portion of the composite conductive film, wherein following the cross-linking, the cross-linkable polymer within at least the surface portion of the composite conductive film is in a cross-linked state.