The invention relates to a substrate (1) for electrical circuits comprising at least one first composite layer (2) which is produced by means of roll cladding and, after said roll cladding, has at least one copper layer (3) and an aluminium layer (4) attached thereon, wherein at least the surface side of the aluminium layer (4) facing away from the copper layer (3) is anodized for the generation of an anodic or insulating layer (5) made of aluminium oxide, and wherein the anodic or insulating layer (5) made of aluminium oxide is connected to a metal layer (7) or at least one second composite layer (2) or at least one paper-ceramic layer (11) via at least one adhesive layer (6, 6).

Configurable semiconductor packages and processes to attain a defined configuration are provided. A configurable semiconductor package includes a base semiconductor package including a semiconductor die mounted on a surface of a package substrate. An expansion package can be mechanically coupled to a mounting member. The expansion package includes a second package substrate and one or more second semiconductor dies that can be surface mounted to the second package substrate. The second package substrate include an array of interconnects that permit coupling (mechanically and/or electrically) the second semiconductor die(s) to the package substrate of the base semiconductor package. The mounting member can mechanically attach to the base semiconductor package, resulting in a package assembly that has the array of interconnects adjacent to another array of interconnects in the package substrate of the base semiconductor package. The expansion package can be coupled to the base semiconductor package via the interconnects, providing expanded functionality relative to the functionality of the base semiconductor package.

In some embodiments, methods include drilling one or a plurality of PTHs with any industrial grade drill to fabricate holes with positive etch back, flooding the PTHs with a dilute solution of an acrylate monomer/oligomer containing an appropriate level of peroxide initiator, polymerizing the acrylate, and then rising the PTHs with the solvent used in the formulation of the acrylate material. In one embodiment, the printed circuit board may include a substrate comprising a plurality of metal layers separated by a plurality of insulating layers; a plurality of plated through holes formed in the substrate, each plated through hole comprising: recesses formed at each insulating layer, copper lands between the recesses, a polymer coating in each recess, and a metal layer lining the plated through hole.

Provided is a conductor connection structure (10) in which two conductors (21, 31) are electrically connected by a copper connection part (11). The connection part (11) comprises a material containing mainly copper. The connection part (11) also comprises a plurality of holes. An organosilicon compound is present within the holes. The connection part preferably has a structure in which a plurality of gathered particles are melted and bonded together and the particles have a necking section therebetween. In addition, the connection structure (10) preferably has a structure in which a plurality of large copper particles having a relatively large particle size and a plurality of small copper particles having a particle size smaller than that of the large copper particles are melted and bonded together such that the large copper particles and the small copper particles are bonded together, the small copper particles are bonded together, and a plurality of small copper particles are positioned around one large copper particle.

Electrically conductive patterns formed on a substrate are provided with a reduced visibility. A region of a major surface of the substrate is selectively roughened to form a roughened pattern on the major surface of the substrate. Electrically conductive traces are directly formed on the roughened region and are conformal with the roughened pattern on the major surface of the substrate.

An inductive thermal bonding system includes at least one inductive bonding or heating member containing a magnetic E-shaped inductive core and a coil bounding a central member of the E-shaped inductive core. A rigid cover plate allows high and predictable temperature rate-of-change during use and reduced thermal cycling time without risk of detriment. Adaptive solid copper pads on multiplayer bonding regions minimize bonding errors and improve reliability. A cooling system is provided for adaptively cooling both the bond head and the bonded stack. Single and paired inductive heating members may be employed, and may also be alternatively controlled and positioned to aid generation of multiplayer bonding subassemblies distant from an edge of a multiplayer sheet construct.

A portable baking assembly includes a portable housing, a receiving base, and an air flow assembly. The receiving base is disposed in the portable housing. The receiving base is operable to receive a processing unit assembly including a processing unit, a thermal solution, and a thermal interface material operable to couple the processing unit and the thermal solution. The air flow assembly is received in the portable housing and in fluid communication with the receiving base. The air flow assembly includes an inlet conduit that is operable to receive heated air and direct the heated air towards the receiving base to heat the processing unit assembly and cure the thermal interface material.

The present invention relates to a photosensitive multilayer resin film including: a first resin composition layer; and a second resin composition layer, in which the first resin composition layer and the second resin composition layer each contain a compound (A) having an ethylenically unsaturated group, a thermosetting resin (B), a photopolymerization initiator (C), and an inorganic filler (D), and a is smaller than b and a is 10 g/m.sup.2 or less, where a is a weight reduction amount when the photosensitive multilayer resin film is irradiated with ultraviolet light of 2 J/cm.sup.2, then cured by heating at 170 C. for 1 hour, and then subjected to a roughening treatment under a predetermined roughening treatment condition in a state where a surface of the first resin composition layer is exposed and a surface of the second resin composition layer is not exposed, and b is a weight reduction amount when the photosensitive multilayer resin film is irradiated with ultraviolet light of 2 J/cm.sup.2, then cured by heating at 170 C. for 1 hour, and then subjected to a roughening treatment under the predetermined roughening treatment condition in a state where the surface of the second resin composition layer is exposed and the surface of the first resin composition layer is not exposed, a printed wiring board using the photosensitive multilayer resin film and a method for producing the same, and a semiconductor package.

A composite ceramic substrate and method for producing the composite ceramic substrate are provided. The composite ceramic substrate includes a ceramic board, a circuit board, and a composite adhering structure adhered to the ceramic board and the circuit board. The composite adhering structure includes a first active metal layer, a second active metal layer, and a solder layer. The first active metal layer includes an active metal material, the active metal material is selected from the group consisting of a group IV metal, a group V metal, and titanium hydride. The group IV metal is titanium, zirconium, or hafnium, and the group V metal is vanadium, niobium, or tantalum. The second active metal layer is made of titanium or titanium hydride. The solder layer includes tin and copper. The composite ceramic substrate has a tensile strength between 100 N/cm and 340 N/cm.

The invention discloses a structure utilizing a Printed Circuit Board (PCB) as an interconnecting carrier for heating elements. By sandwiching a rigid PCB between upper and lower layers of hot melt adhesive film and forming an encapsulated structure through heating and melting, it achieves a rigid, non-deformable first waterproof area while forming a flexible, variable second annular waterproof buffer area on the outside. This not only enhances the durability and waterproofness of the heating components but also ensures the comfort of heated clothing. Compared to traditional flexible circuit boards, the invention offers higher mechanical strength, compatibility with various types of heating elements, and meets personalized needs, thereby improving the market adaptability and service life of heated clothing.