An insulated metal substrate (IMS) includes a metal substrate, an insulating layer, a plastic frame, and a plurality of conductive metal pads. The insulating layer is located on the metal substrate. The plastic frame is located on the insulating layer and has a plurality of aperture areas. The conductive metal pads are located on the insulating layer and are respectively located in the aperture areas, and the conductive metal pads have sidewalls are in contact with the plastic frame.

Provided is a method for encoding chipless RFID tags in real-time. The method includes exposing a chipless RFID transponder to a conductive material, the RFID transponder comprising an antenna and a plurality of resonant structures, the plurality of resonant structures together defining a first spectral signature. Each of the plurality of resonant structures includes a respective one of a frequency domain. The method also includes depositing a conductive material on at least one of the resonant structures to short the at least one of the resonant structures. The remainder of the plurality of resonant structures that are not shorted by the conductive material define a second spectral signature for the RFID transponder.

Provided is a method for encoding chipless RFID tags in real-time. The method includes exposing a chipless RFID transponder to a conductive material, the RFID transponder comprising an antenna and a plurality of resonant structures, the plurality of resonant structures together defining a first spectral signature. Each of the plurality of resonant structures includes a respective one of a frequency domain. The method also includes depositing a conductive material on at least one of the resonant structures to short the at least one of the resonant structures. The remainder of the plurality of resonant structures that are not shorted by the conductive material define a second spectral signature for the RFID transponder.

A printed wiring board includes a first conductor layer, an insulating layer formed on the first conductor layer, a second conductor layer formed on the insulating layer, and a via conductor formed in the insulating layer such that the via conductor is connecting the first and second conductor layers. The insulating layer has opening exposing portion of the first conductor layer such that the via conductor is formed in the opening, the second conductor layer and via conductor are formed such that the second conductor layer and via conductor include a seed layer and an electrolytic plating layer on the seed layer, and the insulating layer includes resin and inorganic particles dispersed in the resin such that the particles include first particles forming inner wall surface in the opening and second particles embedded in the insulating layer and the first particles have shapes different from shapes of the second particles.

A printed wiring board includes a first conductor layer, an insulating layer formed on the first conductor layer, a second conductor layer formed on the insulating layer, and a via conductor formed in the insulating layer such that the via conductor is connecting the first and second conductor layers. The insulating layer has opening exposing portion of the first conductor layer such that the via conductor is formed in the opening, the second conductor layer and via conductor are formed such that the second conductor layer and via conductor include a seed layer and an electrolytic plating layer on the seed layer, and the insulating layer includes resin and inorganic particles dispersed in the resin such that the particles include first particles forming inner wall surface in the opening and second particles embedded in the insulating layer and the first particles have shapes different from shapes of the second particles.