A method of layering a layer of circuitry pattern to another layer of circuitry pattern during the manufacturing of a multilayer flexible printed circuit in a reel-to-reel machine. The method includes feeding both layers of circuitry pattern reel-to-reel into the machine, placing a layer of dielectric sheet material on the fly between the two layers of circuitry patterns reel-to-reel, followed by simultaneously passing the two layers of circuitry pattern and the dielectric sheet material under a laser scanner in the reel-to-reel machine to irradiate a laser beam on a layer of circuitry pattern to weld the two layers of circuitry patterns together.

The invention belongs to a related field of electronic manufacturing technology, and particularly relates to a conformal manufacturing device and a method for a complex curved-surface electronic system, the system includes a support platform and a six-degree-of-freedom spherical motor linkage platform, a 3D measurement module, a laser lift-off module, a curved-surface transfer printing module and a conformal jet printing module respectively mounted on the support platform and independently controllable, and specific structures and work modes of these key components are improved. The invention further discloses a corresponding manufacturing method. Through the invention, multiple process flows required in conformal manufacturing process of the complex curved-surface electronic system are effectively integrated into an integrated device, so as to realize conformal hybrid manufacturing of the rigid/flexible curved-surface electronic system with arbitrary area, and the invention has advantages of high precision, high efficiency and high automation, which greatly broadens the application scope of the curved-surface electronic manufacturing technology.

A method is provided of producing a rigid raft comprising electrical conductors enclosed in the raft. The method includes: providing a cured, composite material base layer; laying up electrical conductors on the base layer; and overlaying the laid-up electrical conductors with a cover layer, thereby producing a rigid raft in which the electrical conductors are enclosed in the raft.

A reel-to-reel method to laser-ablate a circuitry pattern on the fly in a reel-to-reel machine as part of a process to fabricate a printed flexible circuit. The laser ablation method includes using an appropriate laser to irradiate a metal sheet thus ablating the edges of an intended circuitry pattern. Slugs can be removed by using an optional sacrificial liner, and the slugs can be optionally ablated into smaller parts first. The laser ablation can also include an optional method of creating tie bars to provide structural support to the web of circuitry patterns.

A reel-to-reel machine to fabricate a printed flexible circuit on the fly, the machine has a plurality of reels, a laser scanner to ablate a metal foil, a source of UV light or heat to curing an adhesive in a coverlay, another source of UV light or heat to debond a sacrificial liner on the fly. There is a depositor to deposit a sintering paste on the fly onto a predetermined spot for a pad on the metal foil. Removal of slugs are also possible on the fly.

A reel-to-reel method of creating pads on a layer of metal sheet or circuitry pattern on the fly. The method includes placing a sintering paste in the intended spots for pads followed by irradiation of the sintering paste by a laser.

A reel-to-reel lamination method to laminate a metal foil or circuitry pattern on the fly. The method includes applying a UV laminate or thermoset laminate to the metal foil or the circuitry pattern reel to reel, and then apply a UV radiation or heat to the laminate. There can be an optional enclosure connected to a suction source. The enclosure can have a flexible bladder that physically compresses the laminate.

A method of layering a layer of circuitry pattern to another layer of circuitry pattern during the manufacturing of a multilayer flexible printed circuit in a reel-to-reel machine. The method includes feeding both layers of circuitry pattern reel-to-reel into the machine, placing a layer of dielectric sheet material on the fly between the two layers of circuitry patterns reel-to-reel, followed by simultaneously passing the two layers of circuitry pattern and the dielectric sheet material under a laser scanner in the reel-to-reel machine to irradiate a laser beam on a layer of circuitry pattern to weld the two layers of circuitry patterns together.

A method of manufacturing an electronic device including the following steps is provided herein. A plurality of first electronic components is provided. The plurality of first electronic components is transferred onto a plurality of pickup sites. An empty pickup site from the plurality of pickup sites may be figured out, wherein the plurality of first electronic components is absent at the empty pickup site. A second electronic component is transferred onto the empty pickup site. A target substrate is provided. The plurality of first electronic components and the second electronic component are transferred onto the target substrate.

A component mounting device includes a mounting head that mounts a component at a mounting position on a substrate, an imaging unit capable of imaging the mounting position from a plurality of fields of view, imaging directions of which are different from each other, and a controller that selects a success or failure determination field of view used for success or failure determination of whether or not the component has been mounted at the mounting position from the plurality of fields of view according to a state of a shield around the mounting position.