A flexible circuit board and a cutting device are provided. The flexible circuit board includes a board body including a cutting region. A plurality rows of testing terminals are located in the cutting region, a first spacing being provided between two adjacent rows of testing terminals. The testing terminals can be respectively cut off from the board body along a cutting direction which is along the extending direction of the first spacing in the board body. A testing circuit is located on a surface of the board body. The testing circuit is arranged in a region outside the cutting region and the testing circuit is independently and electrically connected to each row of the testing terminals.

A reprint apparatus may include: a defect checking unit configured to check a defective portion in a solder resist layer of a circuit board; a material filling unit positioned above the circuit board to fill the defective portion with a filling material; and a curing unit configured to cure the material filled in the defective portion. The defect checking unit may be configured to calculate a volume of the defective portion, and the material filling unit may be configured to calculate a discharge amount of the filling material based on the calculated volume of the defective portion, and then discharge the filling material by the discharge amount.

A method of manufacturing an electronic device including the following steps is provided herein. Providing a plurality of first electronic components on a first structure. Providing a plurality of receiving sites on a second structure. Performing a first transferring, including transferring at least portion of the plurality of first electronic components onto at least portion of the plurality of receiving sites on the second structure. Figuring out an empty receiving site from the plurality of receiving sites, wherein the plurality of first electronic components is absent at the empty receiving site. Performing a second transferring, including transferring a second electronic component onto the empty receiving site on the second structure. Providing a target substrate, and transferring the at least portion of the plurality of first electronic components and the second electronic component on the second structure onto the target substrate.

A method of detecting defects of a photomask includes measuring registration errors of the photomask, correcting the measured registration errors using a registration control process with a laser beam, extracting deformation data of the photomask deformed by the registration control process, reflecting the extracted deformation data in defect detection parameters to obtain compensated defect detection parameters, and detecting defects of the photomask using the compensated defect detection parameters.

The present invention describes a portable device for monitoring and controlling the level of residual oxygen in reflow oven atmosphere (1). This referred equipment is able to determine the quality of the atmosphere of a reflow oven, using parameters predetermined by the user. Therefore, the equipment performs the monitoring of the reflow oven atmosphere (1) controlling the level of residual oxygen of the reflow oven (1) by increasing or decreasing of the feed flow rate of nitrogen by the control that the microcontroller exerts over the proportional valve of nitrogen flow control (9), by opening or closing the valves to kept such predetermined values.

For determining optimized parameter values of a mask-printing process, a quality value for the substrate is determined in a testing process following the printing operation, and an image of the upper side of the template is generated. A relationship between the parameter, the quality value and the template image are ascertained, and the relationship is used to determine an optimized value for the parameter. In the printing operation, the optimized value is set, and the printing process is monitored by using the respective template image, dispensing with the need for the testing process.

An optical system for measuring the depth of an inner layer of a PCB, includes a light source transmitter used to emit an incident light, a controller, a CCD lens module, a pellicle mirror module, a depth measuring device, a reflective mirror module set at one end of the depth measuring device at an angle of 45 degrees, and a processor. When the incident light is incident on the surface copper of the PCB, a first reflected light is generated to pass through the reflective mirror module and the pellicle mirror module to the CCD lens module, then, the depth measuring device starts to move in the PCB until the incident light is incident on the inner layer copper of the PCB to generate a second reflected light that passes through the reflective mirror module and the pellet mirror module to the CCD lens module.

A circuit board is a wiring board frame in which a plurality of wiring boards in each of which a pair of lands electrically connected to a capacitor are formed on a first surface are arranged side by side. In the wiring board frame, an inspection path is formed. The inspection path passes between the pair of lands provided on each of the plurality of wiring boards. The inspection path includes a first wiring including one end between the pair of lands, and a second wiring including one end between the pair of lands, and the one end of the first wiring and the one end of the second wiring are formed to be separated from each other.