A circuit component arrangement includes a base and a plurality of circuit components mounted to the base. A bonding agent adheres the circuit components in intimate contact to the base. The bonding agent is disposed in a respective open channel defined in an outward facing surface of the base in contact with each of the circuit components. A method of assembling a circuit component arrangement includes temporarily fastening a plurality of circuit components to a base. A bonding agent is injected into a respective open channel defined in the base to adhere each of the plurality of circuit components to the base. The plurality of circuit components are unfastened from the base. Injecting a bonding agent can include ceasing injection of bonding agent upon appearance of bonding agent in a window opening in fluid communication with the open channel.

The invention provides transient devices, including active and passive devices that physically, chemically and/or electrically transform upon application of at least one internal and/or external stimulus. Incorporation of degradable device components, degradable substrates and/or degradable encapsulating materials each having a programmable, controllable and/or selectable degradation rate provides a means of transforming the device. In some embodiments, for example, transient devices of the invention combine degradable high performance single crystalline inorganic materials with selectively removable substrates and/or encapsulants.

A pattern-printed thick film roll and a method for manufacturing the pattern-printed thick film roll can reduce defective products and material loss. The method for manufacturing a pattern-printed thick film roll (5) includes preparing a laminate of a printing substrate film (1) being elongated and comprising resin and a masking film (2) being elongated, comprising resin, having multiple through-holes (2a), and being bonded to a surface of the printing substrate film (1), filling, with ink (32), the through-holes (2a) in the masking film (2) in the laminate of the printing substrate film (1) and the masking film (2) to form an ink film (31), drying the ink film (31) to form a pattern-printed thick film layer (3) having a thickness of 10 to 400 m, and winding a stack (4) including the printing substrate film (1), the masking film (2), and the pattern-printed thick film layer (3) into a roll.