A static random access memory (SRAM) cell includes a first gate and a second gate each extending in a first direction. A first gap separates the first gate from the second gate in the first direction. The SRAM cell includes a Vcc contact extending in the first direction. A second gap separates the Vcc contact and the first gate in a second direction perpendicular to the first direction. No segment of the Vcc contact overlaps with the first gap in the first direction. The SRAM cell includes a Vss contact extending in the first direction. A third gap separates the Vss contact from the first gate in the second direction. A segment of the Vss contact is disposed to the first gap. The Vss contact is smaller than the Vcc contact in the second direction.

An SRAM (static random access memory) includes a semiconductor substrate; a plurality of PD transistors, each including a first fin structure formed on the semiconductor substrate, a PD gate structure formed across the first fin structure and covering a portion of a top and sidewall surfaces of the first fin structure, and a first source/drain doped layer formed in the first fin structure on both sides of the PD gate structure; a plurality of adjacent transistors, each including a second fin structure formed on the semiconductor substrate and a second source/drain doped layer formed in the second fin structure; an isolation layer, formed on the semiconductor substrate; a fin sidewall film, formed on the isolation layer and covering sidewall surfaces of each PD gate structure; and a first PD dielectric layer, formed on the isolation layer and covering sidewall surfaces of the first source/drain doped layer.

An apparatus and method for providing efficient floor planning, power, and performance tradeoffs of memory accesses. A dual read port and single write port memory bit cell uses two asymmetrical read access circuits for conveying stored data on two read bit lines. The two read bit lines are pre-charged to different voltage reference levels. The layout of the memory bit cell places the two read bit lines on an opposed edge from the single write bit line. The layout uses a dummy gate placed over both p-type diffusion and n-type diffusion between the edges. The layout has a same number of p-type transistors as n-type transistors despite using asymmetrical read access circuits. The layout also has a contacted gate pitch that is one more than the number of p-type transistors.

An apparatus and method for providing efficient floor planning, power, and performance tradeoffs of memory accesses. Adjacent bit cells in a column of an array use a split read port such that the bit cells do not share a read bit line while sharing a write bit line. The adjacent bit cells include asymmetrical read access circuits that convey data stored by latch circuitry of a corresponding bit cell to a corresponding read bit line. The layout of adjacent bit cells provides a number of contacted gate pitches per bit cell that is less than a sum of the maximum number of metal gates in layout of each of the adjacent bit cells divided by the number of adjacent bit cells.

A method for fabricating a static random access memory (SRAM) includes the steps of: forming a gate structure on a substrate; forming an epitaxial layer adjacent to the gate structure; forming a first interlayer dielectric (ILD) layer around the gate structure; transforming the gate structure into a metal gate; forming a contact hole exposing the epitaxial layer, forming a barrier layer in the contact hole, forming a metal layer on the barrier layer, and then planarizing the metal layer and the barrier layer to form a contact plug. Preferably, a bottom portion of the barrier layer includes a titanium rich portion and a top portion of the barrier layer includes a nitrogen rich portion.

A bistable circuit includes a pair of inverter circuits each including a first FET being connected between a power supply line and an intermediate node and having a gate coupled to an input node and a first conductivity type channel, a second FET being connected between the intermediate node and an output node and having a gate coupled to the input node and the first conductivity type channel, a third FET being connected between the intermediate node and a bias node, a fourth FET being connected between the output node and a control line and having a gate coupled to a word line and a second conductivity type channel, wherein the pair of inverter circuits are connected in a loop shape, and gates of the third FETs of the pair of inverter circuits are coupled to one of the input and output nodes of the pair of inverter circuits.

The present application provides a method for improving the metal work function boundary effect in FinFET process, the method comprises steps of: depositing a first TiN layer on four fin structures. The first TiN layer has no gap between the second and the third fin structures; removing the first TiN layer up to a first distance from the midline between the second and third fin structures at the second fin structure side; depositing a second TiN layer; removing the second and first TiN layers from second fin structure. The thickness of the TiN layer at the bottom edge of the fin structure at the later structure of the ultra-low threshold voltage P-type transistor will be smaller from this process. Thus formed TiN layer is less prone to a bottom undercut during etching, thereby reducing the metal boundary effect and increasing of the threshold voltage of the device.

A method of forming semiconductor device is disclosed. A substrate having a logic circuit region and a memory cell region is provided. A first transistor with a first gate is formed in the logic circuit region and a second transistor with a second gate is formed in the memory cell region. A stressor layer is deposited to cover the first transistor in the logic circuit region and the second transistor in the memory cell region. The first transistor and the second transistor are subjected to an annealing process under the influence of the stressor layer to recrystallize the first gate and the second gate.

A semiconductor device includes a base substrate including an NMOS region and a PMOS region. The PMOS region includes a first P-type region and a second P-type region. The semiconductor device also includes an interlayer dielectric layer, a gate structure formed through the interlayer dielectric layer and including an N-type region gate structure formed in the NMOS region, a first gate structure formed in the first P-type region and connected to the N-type region gate structure, and a second gate structure formed in the second P-type region and connected to the first gate structure. The direction from the N-type region gate structure to the second gate structure is an extending direction of the N-type region opening, and along a direction perpendicular to the extending direction of the N-type region opening, the width of the first gate structure is larger than the width of the second gate structure.

A photoelectric conversion device including a plurality of substrates in a stacked state, the plurality of substrates including a first substrate and a second substrate electrically connected to each other, the photoelectric conversion device comprising: a memory cell unit including row-selection lines that are to be driven upon selection of a row of a memory cell array and column-selection lines that are to be driven upon selection of a column of the memory cell array; and a memory peripheral circuit unit that includes row-selection line connection portions and column-selection line connection portions so as to drive the row-selection lines and to drive the column-selection lines, wherein a first portion that is at least a part of the memory peripheral circuit unit is formed on the first substrate and the memory cell unit is formed on the second substrate.