A self-aligned multiple patterning (SAMP) process is disclosed for formation of structures on substrates. The process provides improved local critical dimension uniformity by using a first (lower) multicolor array pattern and second (upper) multicolor array pattern. The dimensions of finally formed structures are defined by the overlap of a first spacer that is formed as part of the first multicolor array pattern and a second spacer that is formed as part of the second multicolor array pattern. The spacer widths which control the critical dimension of the formed structure may be highly uniform due to the nature of spacer formation and the use of an atomic layer deposition process for forming the spacer layers of the both first (lower) multicolor array pattern and second (upper) multicolor array pattern. In one embodiment, the structure formed by a memory hole pattern for a dynamic random access memory (DRAM).

A memory device and its manufacturing method are provided, including: a semiconductor substrate, including a shallow trench isolation structure and an active area positioned at one side of the shallow trench isolation structure; two buried word lines and a first dielectric layer, wherein the buried word lines are disposed in the semiconductor substrate and separated from each other, the first dielectric layer is disposed on the semiconductor substrate and corresponds to the two buried word lines; a contact plug disposed on the semiconductor substrate and within the active area, including a conductive layer and an epitaxial layer, the conductive layer is disposed on the sidewalls of the first dielectric layer, the epitaxial layer is disposed on the sidewalls of the conductive layer and extends into the semiconductor substrate; a second dielectric layer disposed over the semiconductor substrate, covering the contact plug and the shallow trench isolation structure.

A FinFET gain cell includes a write port, read port and storage node. The write port includes at least one write FinFET transistor and has write word-line (WWL) and write bit-line (WBL) inputs. The read port includes at least one FinFET read transistor and has a read word-line (RWL) input and a read bit-line (RBL) output. The storage node stores a data level written from said WBL. The storage nodes includes a single layer interconnect which connects the write port output diffusion connection to the read port input gate connection. The height of the single layer interconnect at the write port output diffusion connection is different from the height of the single layer interconnect at the read port input gate connection.

A semiconductor memory device includes a stack structure comprising a plurality of layers vertically stacked on a substrate, each layer including a semiconductor pattern, a gate electrode extending in a first direction on the semiconductor pattern, and a data storage element electrically connected to the semiconductor pattern, a plurality of vertical insulators penetrating the stack structure, the vertical insulators arranged in the first direction, and a bit line provided at a side of the stack structure and extending vertically. The bit line electrically connects the semiconductor patterns which are stacked. Each of the vertical insulators includes first and second vertical insulators adjacent to each other. The gate electrode includes a connection portion disposed between the first and second vertical insulators.

Memory devices may include a source region, channels, a gate insulation layer pattern, a selection gate pattern, a first gate pattern, a second gate pattern and a drain region. The source region may include first impurities having a first conductivity type at an upper portion of a substrate. The channels may contact the source region. Each of the channels may extend in a vertical direction that is perpendicular to an upper surface of the substrate. The selection gate pattern may be on sidewalls of the channels. The first gate pattern may be on the sidewalls of the channels. The first gate pattern may be a common electrode of all of multiple channels. The second gate patterns may be on the sidewalls of the channels. The drain region may include second impurities having a second conductivity type that is different from the first conductivity type at an upper portion of each of the channels.

A method for fabricating floating body memory cells (FBCs), and the resultant FBCs where gates favoring different conductivity type regions are used is described. In one embodiment, a p type back gate with a thicker insulation is used with a thinner insulated n type front gate. Processing, which compensates for misalignment, which allows the different oxide and gate materials to be fabricated is described.

A semiconductor device that can be miniaturized or highly integrated is provided.

The semiconductor device includes a first conductor, a second conductor over the first conductor, a first insulator covering the second conductor, a first oxide over the first insulator, and a second oxide over the first oxide, an opening overlapping with at least part of the first conductor is provided in the first oxide and the first insulator, and the second oxide is electrically connected to the first conductor through the opening.

A memory cell comprises first and second transistors laterally displaced relative one another. A capacitor is above the first and second transistors. The capacitor comprises a container-shape conductive first capacitor node electrically coupled with a first current node of the first transistor, a conductive second capacitor node electrically coupled with a first current node of the second transistor, and a capacitor dielectric material between the first capacitor node and the second capacitor node. The capacitor dielectric material extends across a top of the container-shape first capacitor node. Additional embodiments and aspects, including method, are disclosed.

A semiconductor memory device includes a memory cell array of a three-dimensional structure including a plurality of memory cells repeatedly arranged in a first horizontal direction and a second horizontal direction that are parallel with a main surface of a substrate and cross each other on the substrate and in a vertical direction perpendicular to the main surface, wherein each of the plurality of memory cells includes three transistors. A method of manufacturing a semiconductor memory device includes forming simultaneously a plurality of memory cells arranged in a row in a vertical direction on a substrate, wherein each of the plurality of memory cells includes three transistors.

A semiconductor memory device includes a substrate, a first active pattern on the substrate, a gate electrode intersecting a channel region of the first active pattern, a first insulating layer covering the first active pattern and the gate electrode, a contact penetrating the first insulating layer so as to be electrically connected to a first source/drain region of the first active pattern, and a second active pattern on the first insulating layer. A channel region of the second active pattern vertically overlaps with the contact.