According to one embodiment, a semiconductor device includes a semiconductor layer, an element region provided on the semiconductor layer convexly, having a predetermined width in a first direction along a surface of the semiconductor layer, and extending in a second direction along the surface of the semiconductor layer and intersecting the first direction, a gate electrode arranged above the element region, a liner layer covering the gate electrode, and an element separation portion extends in the second direction on both sides of the element region in the first direction, and the liner layer continuously extends from the gate electrode to the element separation portion and the liner layer in the element separation portion lies below the element separation portion.

A semiconductor device includes a substrate including a cell area having a first active region and a peripheral circuit area having a second active region, a direct contact contacting the first active region in the cell area, a bit line structure disposed on the direct contact, a capacitor structure electrically connected to the first active region, a gate structure disposed on the second active region in the peripheral circuit area, lower wiring layers disposed adjacent to the gate structure and electrically connected to the second active region, upper wiring layers disposed on the lower wiring layers, a wiring insulating layer disposed between the lower wiring layers and the upper wiring layers, and upper contact plugs connected to at least one of the lower wiring layers and the upper wiring layers and extending through the wiring insulating layer.

A sub-sense amplifier includes a semiconductor substrate, a first pair of complementary transistors, a second pair of complementary transistors, and at least one ground transistor. The first pair and second pair of complementary transistors and the ground transistor are formed on the semiconductor substrate. The first pair of complementary transistors are disposed in line symmetry with a center line of the sub-sense amplifier as a symmetry axis, and gates of the first pair of complementary transistors are coupled to a node. The second pair of complementary transistors are also disposed in line symmetry with the center line, wherein the current directions of the second pair of complementary transistors are the same. Sources and drains of the first pair of complementary transistors are coupled to gates and sources of the second pair of complementary transistors, respectively. The ground transistor connects in series with the second pair of complementary transistors.

Relative to a gaming system, a jackpot or game win processing device and server are configured to receive acknowledgement from a player regarding a gaming win award, such as input to the game win processing device of a signature by the player to gaming win forms. In response, the server is configured to generate at least one gaming win reporting form, such as a W2G, to generate a security code from at least two elements of personal information regarding the player, such as obtained from a casino player tracking server, to then secure the at the least one reporting form and then email the secure form to the player.

The present application discloses a method for fabricating a semiconductor device including providing a substrate comprising an array region and a peripheral region surrounding the array region, forming a first semiconductor element positioned above the peripheral region and having a first threshold voltage and a second semiconductor element positioned above the peripheral region and having a second threshold voltage, and forming a plurality of capacitor structures positioned above the peripheral region of the substrate. The first threshold voltage of the first semiconductor element is different from the second threshold voltage of the second semiconductor element.

Electrically conductive line side-by-side running distance equalization and related apparatuses and systems. An apparatus includes a first sense amplifier, a second sense amplifier, a first pair of lines, and a second pair of lines. The first sense amplifier includes a first pull-up sense amplifier and a first pull-down sense amplifier. The first pair of lines electrically connects a first pull-up sense amplifier of the first sense amplifier to a first pull-down sense amplifier of the first sense amplifier. The second pair of lines electrically connects the second pull-up sense amplifier to the second pull-down sense amplifier. Parallel running distances between lines of the first pair of lines and the second pair of lines are equalized by a wiring twist of the first pair of lines and three wiring twists of the second pair of lines.

A method of manufacturing a semiconductor memory device and a semiconductor memory device, the method including providing a substrate that includes a cell array region and a peripheral circuit region; forming a mask pattern that covers the cell array region and exposes the peripheral circuit region; growing a semiconductor layer on the peripheral circuit region exposed by the mask pattern such that the semiconductor layer has a different lattice constant from the substrate; forming a buffer layer that covers the cell array region and exposes the semiconductor layer; forming a conductive layer that covers the buffer layer and the semiconductor layer; and patterning the conductive layer to form conductive lines on the cell array region and to form a gate electrode on the peripheral circuit region.

A memory system includes a memory stack including a number of memory dies interconnected via copper bonding, a logic die coupled to the memory stack via a copper bonding. The memory system further includes a buffer die extended to provide the copper bonding between the logic die and the memory stack and a silicon carrier layer bonded to the memory stack and the logic die.

Embodiments of the present application provide a readout circuit layout structure, a readout circuit, and a memory layout structure. The readout circuit layout structure includes: a readout amplification module, a first processing module, and a second processing module arranged along a preset direction, wherein the readout amplification module is configured to read a voltage of a bit line, and the first processing module and the second processing module are at least configured to perform a noise cancellation on an output signal of the readout amplification module. The readout amplification module includes: a first NMOS region and a first PMOS region arranged close to the first processing module, and a second NMOS region and a second PMOS region arranged close to the second processing module, the first NMOS region, the first PMOS region, the second PMOS region, and the second NMOS region being arranged along the preset direction.

A semiconductor structure and a method of manufacturing a semiconductor structure are provided. The method includes forming a conductive layer on a precursor memory structure, in which the precursor memory structure includes a plurality of transistors and a plurality of contact plugs disposed on and connected to the transistors. The conductive layer in a TEG region is then patterned to form a first patterned conductive layer on the precursor memory structure. The first patterned conductive layer is then patterned to form a plurality of first landing pads extending along a first direction, in which the first landing pads are separated from each other in a second direction that is different from the first direction and are electrically connected to each other through the contact plugs and the transistors.