A memory device includes a first transistor. The first transistor includes one or more first semiconductor nanostructures spaced apart from one another along a first direction. Each of the one or more first semiconductor nanostructures has a first width along a second direction perpendicular to the first direction. The memory device also includes a second transistor coupled to the first transistor in series. The second transistor includes one or more second semiconductor nanostructures spaced apart from one another along the first direction. Each of the one or more second semiconductor nanostructures has a second, different width along the second direction.

A one-time programmable memory cell includes a transistor coupled to a capacitor. The transistor includes at least one first conductive gate element arranged in at least one first trench formed in a semiconductor substrate, and at least one first channel portion buried in the substrate and extending at the level of at least a first lateral surface of the at least one first conductive gate element. The capacitor includes a capacitive element forming a memory. The at least one first channel portion is electrically coupled to an electrode of the capacitive element.

A one-time programmable memory cell includes a transistor coupled to a capacitor. The transistor includes at least one first conductive gate element arranged in at least one first trench formed in a semiconductor substrate, and at least one first channel portion buried in the substrate and extending at the level of at least a first lateral surface of the at least one first conductive gate element. The capacitor includes a capacitive element forming a memory. The at least one first channel portion is electrically coupled to an electrode of the capacitive element.

A one-time programmable (OTP) memory cell includes a substrate having a first conductivity type and having an active area surrounded by an isolation region, a transistor disposed on the active area, and a capacitor disposed on the active area and electrically coupled to the transistor. The capacitor comprises a diffusion region of a second conductivity type in the substrate, a metallic film in direct contact with the active area, a capacitor dielectric layer on the metallic film, and a metal gate surrounded by the capacitor dielectric layer. The diffusion region and the metallic film constitute a capacitor bottom plate.

The present disclosure is directed to methods for the formation of high-voltage nano-sheet transistors and low-voltage gate-all-around transistors on a common substrate. The method includes forming a fin structure with first and second nano-sheet layers on the substrate. The method also includes forming a gate structure having a first dielectric and a first gate electrode on the fin structure and removing portions of the fin structure not covered by the gate structure. The method further includes partially etching exposed surfaces of the first nano-sheet layers to form recessed portions of the first nano-sheet layers in the fin structure and forming a spacer structure on the recessed portions. In addition, the method includes replacing the first gate electrode with a second dielectric and a second gate electrode, and forming an epitaxial structure abutting the fin structure.

A 3D semiconductor device including: a first single crystal layer with first transistors; overlaid by a first metal layer; a second metal layer overlaying the first metal layer and being overlaid by a third metal layer; a logic gates including at least the first metal layer interconnecting the first transistors; second transistors disposed atop the third metal layer; third transistors disposed atop the second transistors; a top metal layer disposed atop the third transistors; and a memory array including word-lines, and at least four memory mini arrays, where each of the memory mini arrays includes at least four rows by four columns of memory cells, where each of the memory cells includes at least one of the second transistors or third transistors, sense amplifier circuit(s) for each of the memory mini arrays, the second metal layer provides a greater current carrying capacity than the third metal layer.

An anti-fuse memory cell includes a substrate, a gate dielectric layer over the substrate, a word line gate over the gate dielectric layer, a first implant region on a first side of the word line gate, a bit line contact plug over the first implant region, a second implant region on a second side of the word line gate opposite the first side of the word line gate, an oxidized region on the second implant region and having a convex upper surface and a source line gate over the convex upper surface of the oxidized region.

An anti-fuse memory cell includes a substrate, a gate dielectric layer over the substrate, a word line gate over the gate dielectric layer, a first implant region on a first side of the word line gate, a bit line contact plug over the first implant region, a second implant region on a second side of the word line gate opposite the first side of the word line gate, an oxidized region on the second implant region and having a convex upper surface and a source line gate over the convex upper surface of the oxidized region.

An anti-fuse circuit includes the following: a first transistor, and at least one parasitic transistor and at least one parasitic triode that are connected to the first transistor. The at least one parasitic transistor and the at least one parasitic triode are connected to a first node.

A semiconductor structure and a method for manufacturing the semiconductor structure are provided. The semiconductor structure includes: a substrate including a first doped region; a first isolation structure located in the first doped region, a depth of the first isolation structure being greater than that of the first doped region; a first gate structure located on the surface of the substrate of the first doped region and spanning the first isolation structure, a projection width of the first gate structure on the substrate being larger than that of the first isolation structure on the substrate; and second gate structures located on the surface of the substrate and at both sides of the first gate structure.