A bitline structure for use in a memory device may be connected to a plurality of bit memory cells. The bitline may be segmented into segments connected to one-third of the plurality of bit memory cells and two-thirds of the bit memory cells, respectively. The segments may be electrically coupled to each other to provide an overall bitline output.

A bitline structure for use in a memory device may be connected to a plurality of bit memory cells. The bitline may be segmented into segments connected to one-third of the plurality of bit memory cells and two-thirds of the bit memory cells, respectively. The segments may be electrically coupled to each other to provide an overall bitline output.

It is desirable to design and manufacture electronic chips that are resistant to modern reverse engineering techniques. Disclosed is a method and device that allows for the design of chips that are difficult to reverse engineer using modern teardown techniques. The disclosed device uses devices having the same geometry but different voltage levels to create different logic devices. Alternatively, the disclosed uses devices having different geometries and the same operating characteristics. Also disclosed is a method of designing a chip using these devices.

A multiply accumulate circuit receives m one-bit neuron values from a first layer of a neural network system. The multiply accumulate circuit includes m non-volatile memory cells and m current sources. In addition, m current paths are defined by the m non-volatile memory cells and the m current sources collaboratively. A first current path is defined by a first non-volatile memory cell and a first current source. A first terminal of the first current source receives a first supply voltage. A second terminal of the first current source is connected with a first terminal of the first non-volatile memory cell. A second terminal of the first non-volatile memory cell is connected with an output terminal of the multiply accumulate circuit. A control terminal of the first current source receives a first one-bit neuron value.

A mask read-only memory array is provided. The mask read-only memory array includes a semiconductor substrate having a surface; and a heavily doped layer formed on the surface of semiconductor substrate. The mask read-only memory array also includes a plurality of lightly doped discrete regions formed on the heavily doped layer, and a metal silicide layer formed on the lightly doped discrete regions. Wherein the metal silicide layer and the plurality of reverse type lightly doped discrete regions form a plurality of Schottky diode memory cells. Further, the mask read-only memory array includes conductive vias formed one a partial number of the plurality of Schottky diode memory cells for applying column selecting voltage to select certain memory cells.

A method to program bitcells of a ROM array uses different programming cells for programming the bitcells with a first or second data item. A first bitcell is programmed by means of a selected programming cell, wherein the programming cell is selected in dependence on operating the memory array as a flipped or a non-flipped memory in multi-bank instance. All other bitcells located in the same column as the first bitcell and subsequent rows are programmed by selected programming cells, wherein the selection of the programming cells is dependent on operating the memory array as a flipped or a non-flipped memory in multi-bank instance and the programming state of the programming cells used for the previously programmed bitcells in the same column.

Single gate and dual gate FinFET devices suitable for use in an SRAM memory array have respective fins, source regions, and drain regions that are formed from portions of a single, contiguous layer on the semiconductor substrate, so that STI is unnecessary. Pairs of FinFETs can be configured as dependent-gate devices wherein adjacent channels are controlled by a common gate, or as independent-gate devices wherein one channel is controlled by two gates. Metal interconnects coupling a plurality of the FinFET devices are made of a same material as the gate electrodes. Such structural and material commonalities help to reduce costs of manufacturing high-density memory arrays.

A memory system includes a memory array comprising a plurality of memory cells. Each of the memory cells includes a transistor coupled to a first capacitor and a second capacitor in series, respectively. The memory system includes an authentication circuit operatively coupled to the memory array. The authentication circuit is configured to generate a Physically Unclonable Function (PUF) signature based on respective logic states of the plurality of memory cells, and wherein the logic state of each of the plurality of memory cells is determined based on a preceding breakdown of either the corresponding first capacitor or second capacitor.

Memories might include a plurality of access lines extending in a first direction and having a first conductivity type, a plurality of conductive regions extending in the first direction and having a second conductivity type, a dielectric overlying the plurality of conductive regions, a plurality of data lines extending in a second direction and overlying the dielectric, and a plurality of contacts, wherein each contact of the plurality of contacts is formed in the dielectric at an intersection of a respective data line and a respective conductive region to connect its respective data line to its respective conductive region, and wherein a number of contacts is less than a number of data lines of the plurality of data lines times a number of access lines of the plurality of access lines.