In certain aspects, a three-dimensional (3D) memory device includes a first semiconductor structure, a second semiconductor structure, a third semiconductor structure, and a first bonding interface between the first semiconductor structure and the second semiconductor structure. The first semiconductor structure includes an array of memory cells. The second semiconductor structure includes a first peripheral circuit of the array of memory cells. The first peripheral circuit includes a first transistor. A third semiconductor structure includes a second peripheral circuit of the array of memory cells. The second peripheral circuit includes a second transistor. The first semiconductor structure, the second semiconductor structure, and the third semiconductor structure are stacked over one another.

An integrated circuit device according to the inventive concept includes: a semiconductor substrate including a cell region and a connection region; a gate stack including a plurality of gate electrodes and a plurality of insulating layers extending on a main surface of the semiconductor substrate in a horizontal direction and alternately stacked thereon in a vertical direction, the gate stack having a stair structure in the connection region; and a plurality of contact plugs in the connection region, wherein, in a portion of the connection region, a first length, in the horizontal direction, of a first gate electrode that is located in the lowest layer among the plurality of gate electrodes is less than a second length, in the horizontal direction, of a second gate electrode that is located above the first gate electrode.

A 3D semiconductor device including: a first level including a single crystal silicon layer and a plurality of first transistors, the plurality of first transistors each including a single crystal channel; a first metal layer overlaying the plurality of first transistors; a second metal layer overlaying the first metal layer; a third metal layer overlaying the second metal layer; a second level is disposed above the third metal layer, where the second level includes a plurality of second transistors; a fourth metal layer disposed above the second level; and a connective path between the fourth metal layer and either the third metal layer or the second metal layer, where the connective path includes a via disposed through the second level, where the via has a diameter of less than 800 nm and greater than 5 nm, and where at least one of the plurality of second transistors includes a metal gate.

The disclosure provides a semiconductor storage device that realizes high integration and improves reliability. A bit line selection circuit (100) of a flash memory includes transistors (BLSeO, BLSeE, BLSoO, BLSoE) in the column direction of bit lines (BL0-BL3), selecting a bit line pair composed of an even-numbered bit line (BL0) and an odd-numbered bit line (BL3) is selected by the transistors, in which a bit line pair (BL1, BL2) adjacent to the selected bit line pair is set as a non-selected bit line pair, and the selected bit line pair (BL0, BL3) is connected to page buffer/sensing circuit through an output node (BLS0, BLS1).

A semiconductor device includes a substrate; a first stack structure including first gate electrodes on the substrate; and a second stack structure on the first stack structure; wherein the first stack structure includes a first lower staircase region, a second lower staircase region, and a third lower staircase region, wherein the second stack structure includes a first upper staircase region, a second upper staircase region, a third upper staircase region, and at least one through portion penetrating the second stack structure and on the first to third lower staircase regions, wherein the first lower staircase region has a same shape as a shape of the first upper staircase region, the second lower staircase region has a same shape as a shape of the second upper staircase region, and the third lower staircase region has a same shape as a shape of the third upper staircase region.

A nonvolatile memory device comprises a first semiconductor layer including, an upper substrate, and a memory cell array in which a plurality of word lines on the upper substrate extend in a first direction and a plurality of bit lines extend in a second direction. The nonvolatile memory device comprises a second semiconductor layer under the first semiconductor layer in a third direction perpendicular to the first and second directions, the second semiconductor layer including, a lower substrate, and a substrate control circuit on the lower substrate and configured to output a bias voltage to the upper substrate. The second semiconductor layer is divided into first through fourth regions, each of the first through fourth regions having an identical area, and the substrate control circuit overlaps at least a portion of the first through fourth regions in the third direction.

Provided are memory devices and memory systems. The memory device includes a memory cell array in a first semiconductor layer and including word lines stacked in a first direction, and channel structures passing through the word lines in the first direction; a control logic circuit in a second semiconductor layer located below the first semiconductor layer in the first direction; and a physical unclonable function (PUF) circuit including a plurality of through electrodes passing through the first semiconductor layer and the second semiconductor layer, and configured to generate PUF data according to resistance values of the plurality of through electrodes, and generate the PUF data based on a node voltage between through electrodes connected in series, among the plurality of through electrodes.

A semiconductor memory device includes a cell unit including a stack structure and a channel structure penetrating through the stack structure, the stack structure including at least one string selection gate and a plurality of cell gates, cell separation structures separating the cell unit in a first direction, and gate cutting structures defining regions within the cell unit between adjacent cell separation structures. The cell unit includes a first region defined between a first cell separation structure and a first gate cutting structure and a second region defined between the first gate cutting structure and a second gate cutting structure. A ratio of a region of the at least one string selection gate that is occupied by a conductive material in the second region is greater than a ratio of a region of at least one cell gate that is occupied by the conductive material in the second region.

A semiconductor device includes a substrate having a first region and a second region, gate electrodes stacked and spaced apart from each other in a first direction perpendicular to an upper surface of the second substrate, and extending by different lengths in a second direction on the second region to have pad regions in which upper surfaces thereof are exposed, channel structures penetrating the gate electrodes, extending in the first direction, and respectively including a channel layer, on the first region, contact plugs penetrating the pad regions of the gate electrodes and extending in the first direction, and contact insulating layers surrounding the contact plugs. The gate electrodes have side surfaces protruding further toward the contact plugs in the pad regions than ones of the gate electrodes therebelow.

A semiconductor device and a data storage system including the same are provided. The semiconductor device including a plate layer, a pattern structure on the plate layer, an upper pattern layer on the pattern structure, an upper structure including a stack structure and a capping insulating structure covering at least a portion of the stack structure, the stack structure including interlayer insulating layers and gate layers alternately stacked on each other, and separation structures and vertical memory structures penetrating through the upper structure, the upper pattern layer, and the pattern structure, and extending into the plate layer may be provided.